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DOM Main Board Rev 3/Rev 4 Status

DOM Main Board Rev 3/Rev 4 Status. December 2, 2003 Gerald Przybylski Lawrence Berkeley National Laboratory. Major Rev 3 Goals. Booting to –50°C, or colder Memory Interface Layout PMT Waveform, and Clamping Ringing, Clamping, Baseline Bounce Component Substitutions. Deferred:

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DOM Main Board Rev 3/Rev 4 Status

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  1. DOM Main BoardRev 3/Rev 4 Status December 2, 2003 Gerald Przybylski Lawrence Berkeley National Laboratory

  2. Major Rev 3 Goals • Booting to –50°C, or colder • Memory Interface Layout • PMT Waveform, and Clamping • Ringing, Clamping, Baseline Bounce • Component Substitutions Deferred: -- Front-End Pulser -- Local Coincidence

  3. We’re On Track

  4. Rev 3 First Items (4) • Boot at -70°C, measured by on-board sensor: from Flash and Configuration Memory • Memory test OK at -50°C, at 40 MHz, long term... • Good PMT waveforms. Good clamping. • Perfect MB – to – Delay board fit • Power Under 3W (at CPU @ 80MHz & Memory @ 40MHz) • 2 boards: -60°C, 160 MHz CPU, 125 MHz Mem • RAP at -60°C

  5. Rev 3 Problems • PC Fab House Testing Failure Shorts on Top Layer: 2 pcs. 4 shorts • Two New Schematic Errors (Mentor/EDIF) • Loading/Bill-of-Materials errors • Two Footprint errors (QFP-100, Oscillator) • Minor, but Unsightly Quirks in Front-End Pulser Waveform - product/brand dependency discovered

  6. Rev 4 Changes • Component Value Changes -- optimization -- schematic corrections • Power Supply Load Balancing (One trace, one resistor) • On-Board LED Pulser Power (Several parts) • Component Substitutions for Reliability,- A few; mainly inductors… 99% finalized- Availability issues • Front End Pulser Corrections • Layout Design Rule Optimizations

  7. Open Issues • Chevette vs. Buick vs. Cadillac quality PCBs (Class 1, 2, 3) • Verification (Qualtest) Split between LBNL and UWe.g. Thermal Cycling: How many? What range?e.g. Vibration Testing: What acceleration? Where?e.g. Humidity: Will UW measure RH at -40°C? at -70°C?? in purged and sealed DOM…(VPH2O 0.002mm Hg@-70°C vs. 0.1mm Hg@-40°C vs. 24mm Hg@25°C)>> No problem, says RI…<<Design for EMS, when mature (what measure of maturity?)

  8. Late Breaking News • Receiving & Testing 12 More Rev 3 Boards- 6 Evenstar boards, 6 Data Circuits boards- Looking good so far; Many loading changes in batch • Rev 4 Schematic Updates In Progress - 30% of schematic pages to date- Few additional Components.- Detailed List; Configuration Control

  9. Rev 4 schedule Ongoing test stand parallel development (STF) -- To be available 1/23 -- Move to room 50a-6105 • 11/21Modification Review/approval of Spreadsheet and File III • 11/25 Design rules Review • 12/15 - 12/19 “line-by-line” Reviews • 12/24 - 1/6 Fab • 1/7 - 1/20 Assembly • 1/23 - 2/19 Acceptance Testing at LBNL (STF based) • 2/20 First 20 cards to UW • 2/23 - 5/21 integration at UW, verification testing at UW and LBNL

  10. The End

  11. Changes Spreadsheet

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