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Electronic Engineering Final Year Project 2008 By Claire Mc Kenna

Electronic Engineering Final Year Project 2008 By Claire Mc Kenna. Title: Point of Load (POL) Power Supply Design Supervisor: Dr Maeve Duffy. Project Outline.

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Electronic Engineering Final Year Project 2008 By Claire Mc Kenna

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  1. Electronic Engineering Final Year Project 2008By Claire Mc Kenna Title: Point of Load (POL) Power Supply Design Supervisor: Dr Maeve Duffy

  2. Project Outline • Objective is to compare the industry used Dc-Dc Voltage Regulator Module (VRM) the (Interleaved Buck Converter) with a conventional power converter. • Conventional power converter V.I Chips, PRM and VTM made by Vicor Corporation. • Pre-Regulator Module (PRM) and Voltage Transformation Module (VTM) chips.

  3. Background • Operating voltages for microprocessors are getting smaller e.g. 1V. • At present the Intel Xeon (LV) processor operates at 1.1V. • As the operating voltage is reduced the current drawn is increased. • Higher current results in higher dissipated losses in mosfets and copper paths.

  4. Background • As switching frequency increases, the switching losses increase. • Vicor have proposed a high current low voltage solution providing low voltage high current (100A) direct from 48V input. • Compare the V.I chips and the alternative solution under steady state and transient load conditions.

  5. Progress to Date • Review of VRM issues for future microprocessor requirements. • Research on the PRM and VTM V.I chips. • 2008 Intel launch new 45nm microarchitecture with energy efficiency technology, so far no information on power requirements or VRM design. • Review of Buck converter using Pspice. • Review of the Multiphase Interleaved Buck Converter.

  6. Progress to Date • Review of the Buck Converter Using the parameters below Pspice was used to simulate the transient and steady state of the buck converter. Vin = 12V Vo = 1.3V F = 500Khz Io = 100A • The duty cycle was found to be 0.108 and the period 2us. L = 23.18nH and C = 1538.46uF

  7. Progress to Date • Vout was less than 1.3V due to the switching losses and voltage drops from the mosfet and diodes. • By varying the duty to 1.9us the highest it would go 1V was obtained at the output. • The output current was reduced to 10A and new inductor and capacitor values were calculated.

  8. Progress to Date • Varying the duty to 0.156 the output voltage of 1.3V was obtained. • Current ripple was calculated to be 9.97A and the measured value obtained was 9.996A.

  9. Progress to Date • Two phases of the interleaved buck was simulated. • By driving the mosfets 1us apart introduces the interleaving effect which is the ripple cancellation in the output capacitor. • The duty was adjusted and the correct output voltage and current was obtained. • Transient load change was also simulated.

  10. Project Plan • Order the VI chips so testing can begin and to compare with simulated results. • Review the circuit diagrams of VTM and PRM and simulate in Pspice. • Magnetic component design of a suitable inductor/transformer for both VI chips and Buck Converter. • Build and test for both solutions.

  11. Proposals (Time Scale) • Now – Review of the PRM/VTM chips. • Feb - Magnetic component design for V.I chips and Buck converter. • Late Feb/Early March – Build and test magnetic components for both solutions. • March – Consider the implications of future microprocessor requirements for magnetic components.

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