An Update on Material Declaration Standards

1. An Update on Material Declaration Standards Kevin Brady Electronic Information Group Semiconductor Electronics Division kevin.brady@nist.gov

2. Legislation Across the Globe WEEE RoHS EuP (Energy-Using Products) Canada Japan California SB20/50 (California version of RoHS) China RoHS (Chinese version of RoHS) Brazil

3. Need for Product Material Information Acquisition and management of product material information is critical business requirement for multiple reasons: Required to Prove Compliance with Environmental Regulations: New laws and regulations designed to protect human health and the environment are being established all over the world. Non-compliance can result in fines and being banned from markets To Promote Social and Environmental Responsibility Consumers now consider environmental aspects when buying products Companies seeking a competitive advantage are now developing and advertising eco-friendly products Management of Material Resources Increasing world wide demand is limiting availability for key resources Detailed material information will enable companies to manage their costs and find suitable alternatives

4. Current Directives RoHS - Restriction of the Use of Certain Hazardous Substances bans the placing on the EU market of new electrical and electronic equipment containing more than agreed levels of lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) flame retardants. WEEE - Waste Electrical and Electronic Equipment Sets collection, recycling and recovery targets for all types of electrical goods Imposes the responsibility for the disposal of waste electrical and electronic equipment on the manufacturers of such equipment

5. RoHS: Hazardous Substances Cd Hg Pb

6. What is covered presently? Included categories Large household appliances Small household appliances IT, telecom equipment consumer equipment lighting equipment tools toys and sport equipment Automatic dispensing machines

7. What is not covered presently Exempt categories Military specific equipment Products where electricity is not required to fulfill main functionality A product that is part of another type of equipment WEEE-RoHS differences Medical devices Monitoring and control equipment

8. RoHS exemptions 32 exemptions presently Item based Mercury in certain lamps Lead in glass of cathode ray tubes, electronic components and fluorescent tubes Application based Lead in solders for servers, storage and storage array systems, network infrastructure equipment List is changing Exemptions are reviewed periodically

9. The International Electronics Manufacturing Initiative (iNEMI) identified material declaration as a major issue in their roadmap IPC, an industry association for printed circuit board and electronics manufacturing service companies, worked with iNEMI, created IPC 2-18 Supplier Declaration Subcommittee The resulting standard, IPC 1752, was published in 2006 prior to EU RoHS going into effect and provided the ability to provide multiple levels of declarations including yes/no, Summary (JIG), and full. IPC 1752 was created to assist the electronics industry in complying with the European Union RoHS directive Created using the alternative standards development process built around UML The core of the standard is built around a data model that captures the needs of exchanging product material composition information NIST developed a PDF based tool to populate the XML structure of IPC 1752, using on Adobe Acrobat Reader Applying the Approach to an Industry Standard: IPC 1752 Materials Declaration

10. IPC 1752 Background • Designed to help industry comply with new material regulations effecting the electronics industry Part of 1750 series Supplier Declaration Version 1.0 included simple tools to support material data management • Supports • RoHS yes/no • JIG A and B lists (From JIG-101) • Full substance declaration • Provides • An electronic data format for material declaration • Standard PDF forms Data entry tools and container for data • Created using software design approach • Scope/requirements • Business/use cases • Modeled using UML • Uses XML Schema to define data structure • Releases • v1.0 Spring 2006 • v1.1 Spring 2007 • v2.0 Summer 2009

11. Benefits of Modeling Helps team envision final result Ensures designer’s intent is communicated to the development team Less expensive to improve the model than to improve the thing being modeled, which means more design iterations/money These ultimately lead to: Better coverage of the domain space Deeper understanding of the product Fewer design gaps during implementation More maintainable product A higher quality product overall

12. 175x UML Modeling to Development Overview Analysis Class Diagram planning Design Class Diagram design RDB Schema Classes XML Schema Table Rows Objects XML Instances data Presentation (PDF, spreadsheet, web page) format

13. IPC 1752 Analysis model • Analysis Model • Shows: • Stakeholders • Information • relationships

14. Going from Data Exchange Standard to A Data Management System • The next step was to show that a data exchange standard built with this method would facilitate the development of a data management system. • The Test system was comprised of two components: a database and a software tool to handle data entry and manipulation. • A test database management system was successfully created from the IPC 1752 standard • Database schema generated from design model • Implemented using MySQL • Developed software to import and export XML files • While limited it can easily be extended to provide full DMS capabilities

15. Limitations of IPC 1752 V1 Limited multiple part reporting Only one sub-level within the product Data authenticity - no XML signature No language for new legislation Implementation limitations

16. IPC-1752 Version 2.0 Modular - allows for easy modification to support other types of declarations and new regulations Support for new legislation - general declaration, no longer focused on RoHS Multiple parts - more robust support for reporting multiple parts in a single declaration No forms - work with solution providers to create supporting tools Improve support for multiple product IDs Part families - similar Shopping cart - different Support for multi-level sub-components A part is a part is a part Better BOM integration

17. Version 2.0a Data Model

18. Design Model

19. NIST Data Entry Tool - Scriba Version 1.0 of the 1752 standard included a PDF document designed to provide users with a basic software tool to implement the standard This tool was removed for version 2.0. To address this need and to prove the validity of the proposed method a software tool called “Scriba” was developed Basic details of NIST reference tool – Scriba Written in Java Public domain Simple tool: Create-Update-Delete Multiple parts - multiple levels Data Validation Electronic Signature Merge Ability Generate presentation format Reference Implementation for 1752

20. Improved Implementation Scriba Dissociate tool from data Need tool for XML files Additional functionality using full programming environment Improve performance with large data files Not limited by page based format

21. XML Signature Allows supplier to digitally sign XML file using w3c XML Signature recommendation The XML Signature is embedded in the document that is signed Easily implemented Java XML Digital Signature API

22. Product ID Link Material and Process Chemicals 01001101 System Build Recycling Information Trusted Supplier Information Data Sheets

23. IPC plans 175X to cover: EuP – Energy Using Products energy used to produce, transport, sell, use, and dispose of almost every one of its products Eventually will even include energy to extract raw materials eco-design requirements for energy using products that must be meet in order to be placed on the market or into service REACH - Registration, Evaluation, Authorization and Restriction of Chemical substances progressive substitution of the most dangerous chemicals when suitable alternatives have been identified RoHS – Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Version 1 – 2006 Version 2 – Announced December 2008, release some time in 2009 WEEE – Waste from Electrical and Electronic Equipment mandates the treatment, recovery and recycling of electric and electronic equipment Anti-counterfeiting Prevent counterfeiting by unique Product ID

24. Why do we care? IEC TC111 - Environmental standardization for electrical and electronic products and systems WG1 - Material declaration for electrical and electronic equipment Describes the procedure, content, and form relating to material declarations for electrical and electronic products Covers materials and substances that are present in a supplied product Product view, not chemical view Does not cover production chemicals and emissions during manufacturing or use Will be compatible with IPC 1752 How can STEP take advantage of the IPC Environmental work? Can we pool efforts with iNEMI/IPC to accomplish work? RosettaNet already has

25. 3M Technologies S Pte Ltd 5-Trees LLC ADC Telecommunications, Inc. ASE Group Accton Actio Corporation Adiva Technology Inc. Agere Systems Ageus Solutions Agile Software Altera Corporation Array Solutions Austin Insulators Inc. Avocent Corporation Balda Solutions Malaysia Beckman Coulter BeRex Corporation Boardwalktech C&D Technologies Carestream Health Inc. Celestica, Inc. Ciena Corporation Circuit Connect, Inc. Coherent Conexant Cope Plastics Crescend Technologies DALSA Corporation DMEGC-SFD Dalicap Ltd. Datakey Electronics, Inc. Delta Electronics Thailand Design Chain Associates LLC DiSS Technology (HK) Co., Ltd. Distron Corporation Dynalink Corporation EPM Global Service Ltd. E2open E-Switch Eastman Kodak Company Electronic Hardware Corp. Ellington Electronics Technology Emulex Corporation Energy Transformation Systems ENOVIA MatrixOne Enventure Technologies • ExcelStor Technology • FCI Technology Services Ltd. • FiberElectronics, LLC • Foamtec International Co., Ltd. • Foresite Systems • Foxconn Electronics Inc. • Freescale Semiconductor • Funai Corporation • Future Electronics • GE Healthcare - Surgery • GE Industrial Sensing • GE Security • GMNameplate Printing (DongGuan) Co., Ltd. • GPS Networking Inc. • The GoodBye Chain Group • H & H Technologies Inc. • Harris Corporation • Harvard Custom Manufacturing • Indian Springs Mfg. Co., Inc. • Information Handling Services • Intelligent Motion Systems, Inc. • Interphase Corporation • J.C. Metal Industries (S) Pte Ltd • JDSU • JST Corporation • J-Tech Technology Co., Ltd. • Jabil Circuit • Jinfeng Metal & Plastic Products • Kemet Electronics Corporation • Kuo Leng Electronic Co., LTD. • LG Chemical • Lelon Electronics Corp. • Logic • Lucent Technologies • MHTB • Maxtor Corporation • Micro Commercial Components Corp. • Micron Instruments Pvt. Ltd. • MicroRam Elecronics, Inc • Microsoft • Molex Corporation • Mouser Electronics • NIC Components Corp. • NXP Semiconductors • National Semiconductor • Neophotonics (China) Corp • Nexgen Mediatech Inc • NIKKIN MgCAST • Nippon • NuSil Technology LLC • Omnitrix, Inc. • Optichron Inc. • P3 America, Inc. • PCNalert • PTC • Pacific Oaks Technology • Panasonic Electronic Devices Co. • Pantronix Corporation • Pantronix Corporation • Papros, Inc. • Paxar Americas, Inc. • Pony Testing International Group • Precience, Inc. • Q Point Technology • Qualcomm, Inc. • Quanta Computer Inc. • RCM Industries, Inc. • Radio Frequency Systems - Conditioning • Ramtron International Corp. • Royal Electronic Factory (Thailand) Co., Ltd. • SGS • Sagem Tunis • Sanmina-SCI • Schaffner • Senju Metal Industry • Shenzhen Newstar Microelectronics Co., Ltd. • Shin Chin Industrial Co., Ltd • SIMCOM International • Smith Induspac-Toronto • Solectron Corporation • Span International • Specialized Technology Resources • Speedline Technologies • Sun Microsystems • Sunpower Technology Co. • SupplierSoft • Suzhou Broadway • Symbol Technologies, Inc. • Synapsis Technology • tec4U • Techwise Circuits Co., Ltd. • TechniData AG • Temex • Teradyne • Tetra Tech • Texas Instruments • Tong Jiang Electronics CO., LTD. • Total Parts Plus, Inc. • Tri-State Fabricators Inc. • Trompeter Semflex, Inc. • Tyan Computer Corp. • Tyco Electronics • UPE Electronics • Uawithya • ViaSat, Inc. • Viconics Inc. • Vitesse • Volex • Well Shin Technology • WorkflowOne • Yangzhong Jia Hui Electron Co., Ltd • ZESTRON America • Zicon LLC These companies (160) indicated that they will support/use the IPC-1752 standard for materials declaration.

26. RosettaNet PiPs Material declaration support for companies using RosettaNet PiP (Partner Interface Process) gateways Provides necessary information for business transactions between trading partners 2a10 - Design Engineering Information 2a13/15 - Material Composition Information Designed to integrate with IPC 1752 data (XML or PDF) Mapping between RosettaNet 2a13/15 and IPC 1752 to improve connection between large OEMs and small & medium businesses

27. Proposal UML Domain Models STEP IPC 175X UML Models Develop a translation tool to go from UML to EXPRESS STEP AP 210 Offspring IPC 258X EXPRESS Environmental Module Materials Declaration IPC 175X Schematics Schematics