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Pushing the Envelope in Analyzer Sampling Technology. Panel Session ISA 2001 September 10, 2001 Gary Frank. Challenges. Communications Power and Connections Component Availability Pressure Requirements Ratings Other Considerations. Communications. Sensor Bus DeviceNet Profibus SDS
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Pushing the Envelope in Analyzer Sampling Technology Panel Session ISA 2001 September 10, 2001 Gary Frank 1
Challenges • Communications • Power and Connections • Component Availability • Pressure Requirements • Ratings • Other Considerations 2
Communications • Sensor Bus • DeviceNet • Profibus • SDS • Others • Network • EtherNet/IP • Control Net 3
Power and Connections • MFCs • ± 15VDC • + 24VDC • + 15VDC • Pressure Transducers • + 5VDC • +10VDC • +15VDC • Other Components • ? • MFCs • 9 pin “D” • 15 pin “D” • Card Edge • DeviceNet Micro • Pressure Transducers • Bendix • 9 Pin “D” • Flying Lead • Other Components • ? 4
Component Availability • Semiconductor Grade • Regulators • Pneumatic Valves • MFC • Pressure Transducers • Check and Relief Valves • Filters • Industrial Grade • ? 5
Pressure Requirements • High pressure Inlet • Regulators to Small • Base to Centerline Height for larger regulator • Fitting Connections • Face Seal • Compression • Tube • Pipe 6
Ratings • Class 1 Div 2 • Some Components Rated. • Class 1 Div 1 • None • CE Mark • Most 7
Other Considerations • Fasteners - Metric Vs Inch • Various Substrates • Metal vs. Elastomeric Seals • Solenoid Valves • High Flows • Liquid Flows 8