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Comprehensive Solutions in Package and PCB Modeling for High-Speed Design

Our services encompass a wide range of advanced modeling techniques tailored for the semiconductor and electronics industries. We specialize in package modeling for BGA, Flip-Chip, PGA, QFP, TSOP, and PoP. Additionally, we offer comprehensive connector and cable modeling, including SMA, SCSI, USB, and board-to-board connections. Our expertise extends to PCB measurement focusing on impedance, skew, delay, and switching noise, along with socket and contactor modeling. We also provide design consulting and validation for DDR devices and DIMM modules, ensuring robust support through seminars and conferences at our High-Speed Design Center.

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Comprehensive Solutions in Package and PCB Modeling for High-Speed Design

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  1. What We Do • Package Modeling • BGA, Flip-Chip, PGA, QFP, TSOP, PoP • Connector/Cable modeling • SMA, SCSI, USB, Thru-hole, Board-to-board • PCB Measurement • Impedance, Skew, Delay, switching noise • Socket, Contactor Modeling • Probe Card, Socket, Calibration Standard • Design Consulting • Design reviews, load board design, prototype development, design recommendations • Validation • DDR device, DIMM module • Partner Support • Conference, Design Seminar High Speed Design Center

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