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Detailed Design Review of Wireless TPS Sensors for Precision Measurement

This document provides a comprehensive review of the design and implementation of wireless Temperature and Pressure Sensor (TPS) systems. Key components include PCB design, sensor node and receiver node software, and packaging solutions. The report outlines the project timeline, budget analysis, and challenges encountered, particularly with the PCB and programming. The collaboration of team members highlights the commitment to achieve precise measurements and reliable data transmission within the budget constraints. The project aims for an innovative deployment in a flight test scenario, ensuring successful data collection.

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Detailed Design Review of Wireless TPS Sensors for Precision Measurement

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  1. Wireless TPS Sensors Detailed Design ReviewFebruary 12, 2008 Jesse PentzerJohn SochackiBrandy HolmesChris JohnsonLucas Wells

  2. Outline • Introduction • PCB • Sensor Node Software • Receiver Node Software • X-Jet Packaging • VAST Packaging • Timeline • Budget

  3. Amplifier CJCs LDO Regulator LDO Regulator LDO Regulator Pressure Sensor XBee PIC

  4. CJC CJC CJC LDO LDO LDO Amp RTD XBee Pressure

  5. Newest Revision Air-wires will be resolved through testing

  6. Final Concept Final Concept

  7. Final Concept Final Concept

  8. Software Flow Sensor Node • Poll of Sensors • I2C (pressure sensor) • A/D (RTD temp. sensor) • SPI (3 thermocouple temp. sensor) • Communication • USART (XBEE transceiver) • Data Structure Union with Array • Redundant Send

  9. Error Reduction • Program Lockups • Conditional Locked Loops • Watchdog Timer (WDT) • Data Reliability • Redundant Data • Use PIC EEPROM to store old sensor data • Data Comparison

  10. Error Reduction Cont’d • Code Protection • Power Problems • Brown-Out Reset (BOR)

  11. Rabbit RCM 4510W

  12. Receiver Node Data Flow

  13. LabVIEW Interface • Communications Parameters • Thermal Coupler graph • Pressure graph • RTD graph • Data Storage in File

  14. LabVIEW Logic Diagram Communication Parameters (user input) Configure Serial Port Set Termination Character Set XON and XOFF Characters Write data to serial port Set I/O Buffer Size Close Session Read Data for buffer Write Data to File Display Data on Graph

  15. X-Jet Preparation Using an aluminum sheet metal box to house electronics. Discs of TPS material allow thermocouples to measure temperature along a centerline through block. Static tube allows pressure measurement inside X-Jet 16

  16. X-Jet Preparation - Progress

  17. Thermal X-Jet Model • Assumptions: • TPS properties constant • 1-D heat transfer along centerline of TPS Heat Flux Node: Interior Node: Convection Node:

  18. Thermal X-Jet Model – Current Results Heat Flux at q=10000 W/m^2

  19. VAST Flight • Four sensor nodes and the receiver node will be flown. • Pressurized capsule allows the balloon’s internal pressure to be measured. • Capsules made of extruded polystyrene insulation foam. 20

  20. VAST Flight: Progress

  21. Timeline 22

  22. Beginning Budget $10,943 Shop and UI Fee $1,360 Travel Allocation $7,343 Beginning Spending Budget $2,240 Current Spending Left $957 Budget Status 23

  23. Closing • PCB and Programming are our biggest challenges at this time • We are within budget • Still on track to meet all goals

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