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Justin Greenhalgh

CMS ECAL Endcaps Effort requirements in Engineering Department and Instrumentation Department (collectively, “TD”). Justin Greenhalgh. Summary. Overview of EE Scope of project in TD Team members Project status List of tasks to completion in outline List of tasks in detail

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Justin Greenhalgh

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  1. CMS ECAL Endcaps Effort requirements in Engineering Department and Instrumentation Department (collectively, “TD”) Justin Greenhalgh 2002

  2. Summary • Overview of EE • Scope of project in TD • Team members • Project status • List of tasks to completion in outline • List of tasks in detail • Effort required: PPESP request, mid-term review, current plan • Effort for each task, by year, and by team member • Summary comments 2002

  3. The CMS calorimeter BARREL The 53 degree crack LOCATION OF HE Preshower ENDCAP 2002

  4. HE EE SE 2002

  5. Exploded view and parts 2002

  6. Picture of original electronics arrangement 2002

  7. Supercrystal parts Arrangement of a few Super Crystal Parts 2002

  8. SC - Concept Super Crystal with Positional Spacer 2002

  9. TD Project scope - included • Supercrystals • Manufacture of 50% of full supercrystals (alveolars and crystals supplied by others) • Handover of parts and expertise to others for the other 50% • Major mechanics • Design of backplate, ring flange, positional spacers, environmental shield, moderators, other internal components • Procurement and supply of above • Electronics • Participation in ECAL joint VFE design • Customisation to suit EE. Design & supply housings, cooling, etc. • Project co-ordination • Many interfaces to other work areas including assembly & installation • Ensure ECAL is aware of what needs to be done outside our scope 2002

  10. TD project scope - excluded • Supercrystals • Supply of crystals (ETH); alveolars (Russia); VPTs (PPD) • Electronic test eqpt for regional centre (PPD) • Partial supercrystals (Russia) • Major mechanics • Some support with design and analysis from Russia • Dee assembly (IC/CERN) • Electronics • Support with completion of HV design from PPD • VFE cards (ECAL) • Other areas • Slow controls (ECAL); services outside EE (ECAL) • Installation (ECAL) • Radiation testing and TIS clearance (PPD) 2002

  11. Team members in TD • Justin Greenhalgh • Management of TD resources and activities in other areas • Thermal and structural performance oversight • Brian Smith • Supercrystals • John Hill • Major mechanics, mechanical integration issues • Tony Lodge • Electronics • Others - Design and technician support 2002

  12. Project status - overview • Supercrystals • Design OK, parts mostly on order, gearing up for production in summer 2003 but subject to confirmation of external funding • Major mechanics • Design passed review, production drawings in hand, due to carry out tender action spring/summer 2003 • Electronics • CMS critical path item • EE working as part of ECAL effort to make a joint design for the VFE “mechatronics” • tests hoped in test beam summer 2003, production electronics required March 2005 2002

  13. Project status - supercrystals • Successful review November 2000 • Mechanical components tendered, companies shortlisted, contract to be placed before end 2002 • Production facility about 50% kitted out • Production due to start summer 2003 • BUT • crystals still not ordered, • HV cards design still not fixed, • other details to finalise 2002

  14. Project status - major mechanics • EDR succesful in Sept 2002 • Production drawings being made • Ring flange almost complete • Backplate in hand • Pos spacers next • Agreed to freeze backplate and ring flange and treat those as design constraints for the mechatronics 2002

  15. Project status - Electronics • Strategy is to work with the ECAL community to ensure that the agreed design is EE-compatible • Two promising potential designs for housing the electronics • Fundamental principle is that it must be possible to install and test the cooling before the electronics is fitted • After many delays on the FPPA chip design, a second, more promising, design is now being pursued in parallel (using 0.25 micron technology) • TD staff member Tony Lodge is now working about 50% at CERN, the arrangements being under continuous review • CERN mechanical designer is due to start work on EE-specific design issues 2002

  16. Outline list of tasks from now to completion in TD • procure mechanical parts for supercrystals, • produce about 300 supercrystals, transfer expertise to other regional centres • complete design of major mechanical items, procure them • participate in completion of ECAL “mechatronics” design • (level of input negotiable) • complete EE-specific mechatronics design • (level of input depends upon how applicable the ECAL design is to EE) • See Project Specification paper - latest version was superseded by developments in the mechatronics area. 2002

  17. Tasks from now to completion - supercrystals • Oversee production of SC mechanics • Complete preparation of regional centre at RAL • Resolve remaining details: temperature sensors, support bracket for fibres. • Resolve HV card and umbilical design, procure. 2002

  18. Tasks from now to completion - major mechanics • Completion of production drawings for backplate, ring flange, positional spacers, moderators • Oversee completion of drawings for environmental shield by Russian colleagues • Tender action - documents, company visits, etc • Oversee manufacture • Interface with assembly and installation teams 2002

  19. Tasks from now to completion - mechatronics • Work with ECAL to arrive at a mechatronics design which can be applied (perhaps in two variants) to the barrel and the endcaps. • Currently effort is being used to look at the services external to EE, because they influence the design inside. • Future: • Install the “new” electronics in the test bench “E zero prime” model. Includes making any required mods to suit EE • Test beam runs to establish noise performance • Fix noise problems • Make engineering model of final design, produce drawings • Oversee production 2002

  20. Effort requirements - PPESP vs midterm review 2002

  21. Effort requirements - midterm review vs current situation 2002

  22. Effort requirements in detail for each task 2002

  23. Effort requirement year-by-year 2002

  24. Effort requirement year-by-year (staff) 2002

  25. Summary • The scope of project includes making significant parts but we (TD/PPD) cannot afford to assemble or install the Dees. • There have been significant delays - to the VFE electronics and the crystal delivery, eg. • A major exercise was undertaken in early 2001 to fully re-cost activities to completion. • Some work was passed to PPD and a significant increase in TD resources was sought at the mid-term review. • Since then there have been yet further delays but we have • Minimised effort usage where design work was blocked • Sought to use “ECAL-wide” resources as far as possible, by collaborating on the joint mechatronics design (just starting to pay off) • replanned to live within the mid-term-review effort budget 2002

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