1 / 21

WBS 1.1.1.5 (& W.B.S. 1.1.1.6.2 & Services)

WBS 1.1.1.5 (& W.B.S. 1.1.1.6.2 & Services). Pixel Module Assembly & Test. Technical Status Goals for 2004 Service Panels. Technical Status. Thinning and dicing Module Assembly Pigtails are gone Adhesives Sector loading Production testing Burn-in setup.

badrani
Télécharger la présentation

WBS 1.1.1.5 (& W.B.S. 1.1.1.6.2 & Services)

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. WBS 1.1.1.5(& W.B.S. 1.1.1.6.2 & Services) Pixel Module Assembly & Test • Technical Status • Goals for 2004 • Service Panels M. Garcia-Sciveres -- Module Assembly & Test

  2. Technical Status • Thinning and dicing • Module Assembly • Pigtails are gone • Adhesives • Sector loading • Production testing • Burn-in setup M. Garcia-Sciveres -- Module Assembly & Test

  3. Technical Status: Thinning and Dicing • This is going very well. Great work by Amanda, Aldo, & Al Clark. Vendor GDSI has been very reliable. Cost under control. • Only issue with FE-I1 was suspected silicon particle contamination leading to shorts during flip chip. This may not be an issue for FE-I1 (or it may be worse). Chip squashing tests are under way. M. Garcia-Sciveres -- Module Assembly & Test

  4. Technical Status: Module Assembly 1/2 • FE-I1 used to “shake down” the module assembly process. • Yield of all steps has steadily improved. Not quite at planned levels yet, but plateau probably not yet reached. M. Garcia-Sciveres -- Module Assembly & Test

  5. Technical Status: Module Assembly 2/2 • Fixturing is very simple and works well. What we have is good enough for production. • Assembly time with new adhesive tape is literally less than 1 hour per module • Wire bonding with new machine is a breeze. But we need to buy such a machine! (availability assumed in cost and schedule) • Only outstanding issue is how exactly to pot the bonds to avoid magnetic field resonance. Work in progress. M. Garcia-Sciveres -- Module Assembly & Test

  6. Technical Status: Pigtails Gone 1/3 • Original design had cable soldered to flex pigtail, in turn wire-bonded to module • In fixing a defective pigtail bypassing it with wires, we realized that the pigtail was hurting more than helping. • Now cable soldered directly to flex. • Fewer things to test, fail and assemble. • No wire bonded connections to module • All modules for a given disk are identical (before needed 2 flavors) M. Garcia-Sciveres -- Module Assembly & Test

  7. Technical Status: Pigtails Gone2/3implications for US assembly flow Flex + SMT LBL for cable Albany for HV test OU for MCC M. Garcia-Sciveres -- Module Assembly & Test

  8. Technical Status:Adhesives • Flex Hybrid To module Attachment • Original scheme of no glue under flex bond pads did not work due to flex bow • Switched to silicone tape adhesive under bond pads. • Allows for excellent wire bonding and instant assembly. • Radiation tested OK. Some further qualification needed (thermal cycling, etc.) • Module to Sector Attachment • SE-4445 Silicone accepted as new universal baseline • Modules on sector being loaded with this glue now (used to be CGL). Very good initial experience. M. Garcia-Sciveres -- Module Assembly & Test

  9. Technical Status:Sector Loading • Major development here • First and only real sector was loaded “by hand” with makeshift fixtures • Original tooling, now 2 years old, had many problems. • Pickup of real modules built with Dyconex flex was a problem • Sector tubing design evolved and no longer fit. • No provision for survey of module position • New concept introduced for sector safe handling, storage, survey, testing. “Sector frame”. Similar concept to flex frame. • Entirely new tooling designed around frame. All parts have need built and are almost ready for first use (build second real sector). (aside: Fred charges all this to SCT account) M. Garcia-Sciveres -- Module Assembly & Test

  10. Technical Status: Production Testing • Have been pushing for a documented module, sector and stave QA plan. Collaboration has been slow to respond. • Nevertheless, a fairly clear picture is emerging of the resources needed. • Basically: • Characterize each module with PC test setup • Burn-in and thermal cycle each module (new burn-in setup needed) • Burn-in, survey, thermal cycle, and IR image each sector (same burn-in setup as module) • Undecided: test each sector with ROD. M. Garcia-Sciveres -- Module Assembly & Test

  11. USB port or USB hub Technical Status: Burn-in Setup • Finally started development at LBL • Students + Eng. Div. drafter. • Design “specs” • Keep it simple • Add-on to existing single module test setup • Cheap and easy to replicate (we expect everyone will want one). New burn-in board New burn-in board ISEG supplies for HV, bulk supply for LV power New burn-in board New burn-in board M. Garcia-Sciveres -- Module Assembly & Test

  12. Goals For 2004 • Start Production! • Finish production in early FY05! • Try to get collaboration to buy into this “5th disk” • Gain time on ramp-up • If it ends up working more or less it becomes half of a 3rd hit M. Garcia-Sciveres -- Module Assembly & Test

  13. 2004 Goals:Type 0 Cable Production • There is no flex pigtail fabrication (1.1.1.4.3.2 -> 0) • Copper clad wire and other materials ($5K) • PCB for PP0 connector end of cable ($1.7K) • Cables attached to flex hybrid at LBL (600hrs tech.) • Total: • $6.7K this is part of • 600 hours labor ($40K) module assy. in WBS M. Garcia-Sciveres -- Module Assembly & Test

  14. 2004 Goals: Wafer Thinning, Dicing, Die-probing Production • 100x Bumped FE-I wafer thin ($15K) • Cleaning & re-coating in Microlab (100hrs student) • Inspection(25hrs student) • Dicing ($20K) • Cleaning resist in Microlab (100hrs student) • Single Die Probing & inspection (1760hrs student) • Supplies (gel packs, etc) ($12K) • Totals: • $47K ETC03 prod. total • 2000 hours student ($30K) 29K+28K +20K M. Garcia-Sciveres -- Module Assembly & Test

  15. 2004 Goals: Production Module Assembly • Shipping Covers & supplies ($8K) • Equipment maintenance ($5K) • Technician Assembly Labor (600hrs) • Technician tests (bond pulls, etc.) (300hrs) • Shops (100hrs) • Totals • $13.3+6.7= $20K ETC03 prod. total • 1160+600 hours ($60K) 24K+176K(type 0 cable) -120K M. Garcia-Sciveres -- Module Assembly & Test

  16. 2004 Goals:Burn-in System Development • Being developed by students + eng. Div. Drafter. • First prototype by end of summer => Much of this cost is in FY03! • At that point will need a lot of software help (new postdoc to jump in…) • Same system to be used for sector burn in. • See Module QA for operation of burn-in system • Copies of system likely to be requested by collaborators • $20K board fabrications and purchases • 440 hours drafter ($20K) • 880 hours student ($12K) • 80 hours shop ($6K) ETC03 • Total: $58K 46K +12K M. Garcia-Sciveres -- Module Assembly & Test

  17. 2004 Goals: Production Module QA • Still hard to estimate how long it will take per module for 1 person + TDaq setup. • Optimistically assume 4 hours per module. • Need dedicated setup and a lot of disk space. • Note this is different setup than burn-in. That’s a second dedicated setup. • => Do we need one more TDaq setup? Yes. • New Tdaq setup & pwr supplies ($15K) • 1760 hrs student ($25K) • Burn-in setup operation • Operating supplies ($5K) • 880 hrs student ($12K) ETC03 Prod. Total • Total QA: $20K + $37K $45K + $75K -63K M. Garcia-Sciveres -- Module Assembly & Test

  18. 2004 Goals: Production Sector Loading • This should not be a very labor intensive operation • Ideally will be done by an engineering tech. now F/T on mechanics, to be trained by FRED. • Important cost is frame holders for production modules and possibly additional tooling. • Misc. tooling, & supplies ($7K) • 20 frames, 16shop hours each ($16K) ETC03 Prod. Total • 440hrs. Mech. tech. ($16K) $7K + $24K +8K M. Garcia-Sciveres -- Module Assembly & Test

  19. 2004 Goals: Production Sector QA • Involves IR, Metrology, Thermal cycling, and electrical burn-in • Assume 1 sector/week • => 1 FTE for this job (student OK) • Fixtures, storage ($25K) ETC03 Prod. Total • 1760 hrs student ($25K) $36K + $12K • What about database?ETC03 has $11K +2K M. Garcia-Sciveres -- Module Assembly & Test

  20. Module Production Summary • Adding up the labor we need 4.1FTE students in FY04. • We have ~1. • New postdocs can pick up some of the work • Probably still need to hire at least 2 temps (eg. finishing undergrads) or find visitors or other help. • Technicians needed: 1.6FTE. Seems OK. • Assuming we can find this many students, looks like significant reduction compared to ETC03. (about 140K). • But, part of these savings are not real because we are spending “production” money on continued prototype work in FY03. I have not tried to add up FY03 standing army cost and subtract it from production budget. M. Garcia-Sciveres -- Module Assembly & Test

  21. Service Panel Production (2004)For 3-Hit System (everything up to PP1 tapes) This is the slide from last year. New estimate looks a tiny bit less (10-20%), but uncertainty is still too large to reduce this. • 57Kg Cu-Clad Al Wire (+overage) $81K • Flex fabs, connectors, vendor assy. $66K • LBNL Tech. Labor 3648Hrs • Total for Electrical component of Service panel production: $293K • (2 hit total is $226K) M. Garcia-Sciveres -- Module Assembly & Test

More Related