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WP6 status report

WP6 status report. A. Di Mauro (CERN) ITS plenary meeting 20.01.2014. Outline. Update on d evelopment of FPC in Al Summary of proposal of an automated HIC assembly system from VEA Planning of 2014 WP6 objectives. Status of Al-FPC R&D.

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WP6 status report

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  1. WP6 status report A. Di Mauro (CERN) ITS plenary meeting 20.01.2014

  2. Outline • Update on development of FPC in Al • Summary of proposal of an automated HIC assembly system from VEA • Planning of 2014 WP6 objectives WP6 status report - A. Di Mauro

  3. Status of Al-FPC R&D • 7 prototypes have been etched using DEPHIS Al-coated kapton (the first was shown in December); however last step (Ni/Au coating of contacts) failed due to issues with quality of Al layer (too porous). New foils are being prepared by DEPHIS by improving the Al processing. • Two kapton foils coated (with 25 mm Al) by FHR were delivered last week and will be processed in the next two weeks. WP6 status report - A. Di Mauro

  4. Al-FPC deformation • Nominal distance between first and last contact: 268.800 mm • Metrology checks along 5 trace lines C1 C5 C9 C13 C4 C17 C2 C3 C6 C7 C10 C11 C14 C15 C20 WP6 status report - A. Di Mauro C18 C19

  5. Al-FPC deformation • Al coating and subsequent steps produce shrinking (observed up to ~400 mm): • Cu FPC (12/09/2013): 268.822, 268.827, 268.838, 268.824, 268.827 • Al FPC (DEPHIS prototype, after etching, 16/12/2013): 268.562, 268.575, 268.545, 268.565, 268.528 • Al FPC (FHR 15μm Al, before etching, 07/01/2014): 268.405, 268.396, 268.379, 268.366, 268.384 • After finalization of the production procedure, will study various solutions depending on reproducibility of effect and final deviation from nominal value: • Pad diameter larger than FPC holes (e.g., 250 mm pad can compensate 100 mm over 9 chip flex) • Modify holes position when drilling in order to achieve final nominal values • Compensate by suitable adjustment of chips gap (variation of chips position HIC by HIC!) WP6 status report - A. Di Mauro

  6. Automated HIC assembly system from VEA • The proposal has been reviewed and the system is conform to our requirements and suitable to the purpose. • The main constraints are precision (final chip position tolerance ~ 5-10 mm) and time • In order to achieve the required accuracy and repeatability Linear Positioning Stages (X,Y,Z) have been preferred to robotic arms (faster but less precise) • The structures are simple and also the mathematical model to compensate errors due to thermal expansion is quite simple • This machine allows the assembly of both modules for the inner layer (1 x 9 chips) and for the outer layer (2 x 7 chips) by simple replacement of the "assembly frame", the "FPC stack" and the “soldering balls grid“. WP6 status report - A. Di Mauro

  7. Automated HIC assembly system from VEA TOP VIEW • X or Y Linear Positioning Stage • 200 mm/s • 0.05 mm unidirectional repeatability • 0.2 mm bidirectional repeatability SIDE VIEW Z LPS with 0,1 μm unidirectional repeatability WP6 status report - A. Di Mauro 7

  8. Automated HIC assembly system from VEA Ultra high-precision rotation stage - ± 1.7 mrad (0.0001o) repeatability The assembly frame is positioned on a high precision rotation stage and it has vacuum suction to hold components. WP6 status report - A. Di Mauro 8

  9. Automated HIC assembly system from VEA Cycle time estimation • Worst case scenarios: • 9 chips → 9x8.1 + 8.5 + 8.5 + 9x(4x10.5) + 9x(88x10) = 8388” = ~ 2 h 20’ • 2x7 chips → 14x8.1 + 8.5 + 8.5 + 14x(4x10.5) + 14x(88x10) = 13039” = ~ 3 h 38’ Assuming 48+10% HICs for IB and 1604+10% HICs for OB and 16 h/ working day: 8 days for IB + 397 days for OB WP6 status report - A. Di Mauro 9

  10. 2014 WP6 objectives WP6 status report - A. Di Mauro

  11. WP6 meetings Weekly on Thursdays, 15:30 (Geneva Time) At CERN: 4-S-030 Next Meeting: Jan 30 WP6 status report - A. Di Mauro

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