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X-Ray Fluorescence Measurement for Pitch Adapter Thickness Verification

Utilize X-Ray Fluorescence tech to verify pitch adapter thickness from lot samples dated 2004. Features Au & Ni measurements for quality control. Inventory status and production insights included.

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X-Ray Fluorescence Measurement for Pitch Adapter Thickness Verification

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  1. PITCH ADAPTER NI & AU THICKNESS.PN: LAT-DS-00370 rev 6CMI X-Ray Fluorescence MeasurementExpressTech Santa Clara, Ca.

  2. INVENTORY • Teledyne ~ 80 Pitch Adapters • SLAC 87 Pitch Adapters • No flight TMCM’s have been manufactured using any Pitch Adapters from these two lots. • MIP-1 yield is currently 0% from a production lot of 18 boards.

  3. PARLEX, SAN JOSE • Parlex to provide lot to lot data today. • Lots manufactured early 2004 are acceptable. • ExpressTech has always been the plater.

  4. LOT 6228-01XNOV. 15, 2004 • Sample size 1 • Au thickness microinches: • Spread: 22.1 – 21.4 • Mean: 21.7 microinches • Dwg spec. 10 microinches Au

  5. LOT 6228-01XNOV. 15, 2004 • Sample size 1 • Ni thickness microinches • Spread 130.3 – 168.5 • Mean 149.4 microinches • Dwg spec. 150 microinches Ni

  6. LOT 5887-04SEPT. 9, 2004 • Sample size 1 • Au thickness microinches • Spread: 24.9 – 30.6 • Mean: 27.8 microinches • Dwg spec. 10 microinches Au

  7. LOT 5887-04SEPT. 9, 2004 • Sample size 1 • Ni thickness microinches • Spread: 162.1 – 204.7 • Mean: 183.4 • Dwg spec. 150 microinches Ni

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