A “BTeV” Hybrid Pixel Telescope for MTest

1. A “BTeV” Hybrid Pixel Telescope for MTest David Christian May 4, 2007

2. Outline • Review of hybrid pixel detectors, status of “BTeV” R&D. • Conceptual design of pixel telescope. • MTest assets. • First crack at task list; items for further discussion.

3. A Hybrid - a 2-D array of Pixels A Pixel 200 µm “8-chip” Hybrid 400 µm 250 µm 50 µm Sensor What is a Hybrid Pixel Detector?

4. SiO2 passivation Contact metallization P-spray isolation N+ N+ N+ N+ + + + + + + + + + + + + Electrons - - - - - - - - - - - - + N-type bulk + V Holes P P P P P P P P P P P P P P P P The Sensor

5. Vdda Thresholds (Vth1-Vth7) Token Out Iff ADC Thermometer Flash Latch to Binary Vfb2 Encoder Vfb Resets Row Address Bus Ibp1 Ibb Ibp2 Command Interpreter Controller - + Sensor 00 - idle 01 - reset Kill 10 - output listen Inject 11 - Test Vref Threshold (Vth0) 4 pairs of RFastOR Throttle Read Clock HFastOR Command Lines Read Reset Token In Token Reset Preamp 2nd stage +disc Kill/ inject ADC encoder Digital interface ADC The readout IC

6. Debugging Outputs Pixel array + End-of-Column Logic + e = “Core” 128x22 Pixel array End-of-Column Logic Registers and DAC’s Data Output Interface Command Interface LVDS Drivers and I/O pads Internal bond pads for Chip ID FPIX2 developed for BTeV Chiphit available for use in trigger

7. Hybrid Pixel R&D After BTeV • As of two years ago: • FNAL-designed readout chip had two minor fatal flaws. • No system demonstration had yet been done. • An “extended closeout” R&D program was approved • 1 more chip submission. • R&D refocused on ILC. • Two system tests approved: • Telescope for the forward direction of PHENIX (at RHIC) • Test beam telescope

8. Sensor & FPIX2.1 wafers FPIX2.1 fabricated on wafer with “TripT” for D0; fatal flaws fixed; 11 wafers purchased by LANL for PHENIX, 11 by FNAL to support R&D - 2 required for MTest telescope. Sensor wafers produced for PHENIX by CiS (LANL has agreed to donate the x4 sensors for use in MTest)

9. Sensors & ROCs probed – yield is high Typical FPIX2.1 wafer map Typical sensor IV curve

10. Hybridization – solder bump bonding done by VTT (Finland) VTT bump-deposition process flow X-ray made at FCC

11. 15 Pre-production PHENIX (x8) hybrids delivered 12 April 2007 First 10 x4 hybrids being assembled at VTT this week.

12. New test beam telescope Half-plane = three 1x4 modules read out by 1 FPGA (collaboration with Columbia U.) Station = two half-planes offset by active area of sensor 2 stations upstream of DUT & 2-4 downstream (precision x & precision y)

13. 4x HDI

14. PCB Sensor Readout chips Interposer Glue HDI TPG Concept for pixel plane

16. MT6-A1

17. MT6-A1 Assets • Climate controlled hut. • Aluminum table on rails allows entire setup to be removed from beam. • Dark box with feed throughs for signals, power, & cooling fluid. • Remotely controlled motors determine (x,y) position of both ends of box. • Local chiller provides closed loop cooling system • CAEN power system can provide LV & sensor bias (“HV”). • Plenty of quiet power is available.

18. Climate Controlled Hut Table on rails

19. Remotely Controlled x-y Positioners Moveable Pixel Box Feed Through Boards Chiller

20. Old picture of pixel box interior

21. MT6-A1 task list • Status of CAEN & motor control system? • Modify box mechanicals • Support 6x4 stations • Stations positioned to minimize MS error at DUT • Flexible DUT station (CMS upgrade didn’t really work out)

22. Pixel telescope task list • x4 HDI • x4 plane/station design (mechanical and electrical) • DAQ • Integration of telescope data with: • DUT in pixel box • data from other MTest detectors (if necessary)