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4.9.1 JEDEC MOISTURE SENSITIVITY UPDATE. STEVE MARTELL (Sonoscan). J-STD-033C Published February 2012 J-STD-075 Published August 2008 Request to remove connectors (per EIA) J-STD-020D.1 Published August 2007 Typos corrected 3/08 (Rev D.1) Draft of 020C in process
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4.9.1 JEDEC MOISTURE SENSITIVITY UPDATE STEVE MARTELL (Sonoscan)
J-STD-033C Published February 2012 J-STD-075 Published August 2008 Request to remove connectors (per EIA) J-STD-020D.1 Published August 2007 Typos corrected 3/08 (Rev D.1) Draft of 020C in process Future Topics to be Considered Outline
J-STD-033C Published Feb 2012 Desiccant Quantity Calculation
J-STD-075 - Future • Changes known since original release of J-STD-075 • Remove from scope connectors and point to equivalent connector document • EIA-364-56E, Resistance to Soldering Heat Test Procedure for Electrical Connectors and Sockets • Move marking requirements to J-STD-033 • Other changes • Add preheat requirements to solder wave profile • 125C for 3 minutes (based on profiling from a few IBM cards) • Update tables 13-1 and 14-1 • Base wave and base reflow solder process exceptions • Improvements have been made across many commodities • Need to decide to either update values or remove values and only list commodity names
J-STDs 020 & 075 Draft of 020E in process Looking at potential future changes for 075A J-STD-033C Published February 2012 Other Future Considerations from JEITA ? J-STD-020 J-STD-033 J-STD-075 Summary