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Welcome to ChipMOS Quality Laboratory

Welcome to ChipMOS Quality Laboratory. Laboratory instrument introduction-----1:30~2:00 SAT instrument operation ----------------2:00~3:00 COF defect sample inspection (OM/Decapsulation/SEM) --------------- 3:00~3:30 COF electrical measurement ----------- 3:30~4:00

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Welcome to ChipMOS Quality Laboratory

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  1. Welcome to ChipMOS Quality Laboratory • Laboratory instrument introduction-----1:30~2:00 • SAT instrument operation ----------------2:00~3:00 • COF defect sample inspection (OM/Decapsulation/SEM) --------------- 3:00~3:30 • COF electrical measurement ----------- 3:30~4:00 • COF mechanical test (die strength) --- 4:00~4:30

  2. Failure Analysis Procedure SAT Picture XRM Image SEM Photo LCM Photo Hot Spot (Defect)

  3. Scanning Acoustic Tomograph Inspection • Die Surface Delamination Mode • TSOPII 50L • Die Crack Mode • mBGA 70B 1 2

  4. COF Defect Location and Decapsulation Peeling from tape • COF (48mm) after decapsulation • Fuming Nitric Acid (100%) • Room temperature • 30mins Rinse by acetone

  5. Optical Microscope (OM) Inspection after Decapsulation 50X Stereo OM 500X 200X

  6. Scanning Electron Microscope (SEM) Inspection and Energy Dispersive X-ray (EDX) Detection SEM

  7. Electrical Measurement (COF/Chip) Probe station Curve tracer I (mA) I (mA) I (mA) Short Pass Open V (v) V (v) V (v)

  8. Mechanical Test (Die Strength)

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