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Solution For Portable Customer

Solution For Portable Customer. On semiconductor. Q 2 04. Charge control. Schottky diode. OP amplifier. Charge Controller. Comparator. TVS/Zener. MiniGate TM Logic. Pass Elements. Transistor. BRTs. Analog Switches. Onsemi solution. Not Onsemi’s. ON Solutions for Cellular Phones.

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Solution For Portable Customer

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  1. Solution For Portable Customer On semiconductor Q2 04

  2. Charge control Schottky diode OP amplifier Charge Controller Comparator TVS/Zener MiniGateTM Logic Pass Elements Transistor BRTs Analog Switches Onsemi solution Not Onsemi’s ON Solutions for Cellular Phones Baseband (DSP, MCU & Memory) Package Roadmap RF/IF Power Management Display RF Detector White LED Driver DC-DC Buck Boost Audio Amplifier LDO FET PA Driver Flash Light OLED driver uP Reset Supervisory USB & SIM Interface Charge Pump RF Modulation PA ESD+EMI filter Duplexer Synthesizer Voltage Detector MotorDriver PM ASIC LCD Display Receiver Megapexial Camera Standard components Audio Micro Integration Key PAD Bottom Connector SIM&MMC Interface USBInterface

  3. SIM/ SMART Card ON Solutions for Cellular Phones Baseband (DSP, MCU & Memory) RF Battery Charger Inner Battery Charger NCP1800 NTHD4P02 NTHD3101 (or NTGS3441T1 +MBRM120LT3) SIM Card Interface Reset Controller DC/DC Converter LDO (Baseband) LDO(RF) PA controller NCP4523,MC78PC NCP4561, MC33761/2 NCN6000 NCN6010 NCP1501 NCP1510/1 MBRM120 NCP500, 511 (150mA); NCP512 (80mA) MC33170 RF Power Detector NCS5000 NCP300~5 MAX809/810 Over-voltage Protection IC MC33765 (5 outputs) NCP345/6 MicroIntegrationTM Mini-gate Logic Analog Switch Audio Amp for Speaker & Polyphonic Ringer Driver TVS array White LED Driver NLAS4599 NLAS44599 NLAS4501 NLAS323/4/5 MC74VHC1Gxx MC74HC1Gxx NL17SZxx NL27WZxx MUN series DTA series DTC series MDC3105 SMS05/15/24 SM12 NZQA5V6 MSQA6V1 NSQA6V8 1PMT16A SMS05/12/24C SMF05/12/24C Vibrator Drivers NCP5007 NCP1403 MBR0520LT1 NCP2890 NCP4894 NCP4896 NCP5426 MDC3105 NUD3105 Small signal MOSFET Filter NZF220DF NZF220TT STF202-22 NZMM7V0T4 NUF6105 NTGS3441/3 NTHS2101 NTJD4105 NTR4101 MBRM120 MBR0520 MMBT35200NSR15WT1 Stereo Audio Amp for MP3 Headset • * (Black) Analog products • * (Blue) Integrated Power (TVS, Filter, Driver, MOSFET) • (Green) Standard Components • (Italic) New products NCP2809

  4. High clamping Voltage (35V) 高钳位电压(35V) Conversion Factor: 转换因子： V = “X “ / [(2/267)*(0.1)*(0.5)] V = 7.98KV 5V/div Low clamping Voltage (7V) 低钳位电压(7V) Clamping Voltage (8V) 钳位电压(8V) 5V/div 5V/div TVS vs Varistors ESD protection comparison安森美半导体、变阻器和竞争者的ESD响应比较 Condition 1: Applied 8kV ESD contact pulse using a high frequency test board (Low inductance, ideal case). 状况1：使用高频测试板施加8kV ESD 接触脉冲(低电感，理想状况)。 Input: 8KV ESD Pulse, IEC 61000-4-2 输入： 8KV ESD脉冲， IEC 61000-4-2 Output: Varistor, VA-C1005-5R5E 输出：变阻器，VA-C1005-5R5E Output: ON Semiconductor, MSQA6V1 输出：安森美半导体， MSQA6V1 Output: Competition, SMF05 输出：竞争者，SMF05

  5. Conversion Factor: 转换因子： V = “X “ / [(2/267)*(0.1)*(0.5)] V = 7.98KV High clamping Voltage (40V) 高钳位电压(40V) 5V/div Better response even with the effect of parasitic (V=Ldi/dt) 即使有寄生效应(V=Ldi/dt)也有较好的响应 Bad response due to the parasitic effect (V=Ldi/dt) 寄生效应(V=Ldi/dt) 造成响应变差 5V/div 5V/div TVS vs Varistors ESD protection comparison安森美半导体、变阻器和竞争者的ESD响应比较 Condition 2: Applied 8kV ESD contact pulse using a normal test board (Inductance =10nH, real board case) 状况2：使用正常测试板施加8kV ESD 接触脉冲(电感=10nH，真实状况)。 Input: 8KV ESD Pulse, IEC 61000-4-2 输入： 8KV ESD脉冲， IEC 61000-4-2 Output: Varistor, VA-C1005-5R5E 输出：变阻器，VA-C1005-5R5E Output: ON Semiconductor, MSQA6V1 输出：安森美， MSQA6V1 Output: Competition, SMF05 输出：竞争者，

  6. IEC 61000-4-2 ESD pulses are very fast rise time (between 0.7 and 1nsec) IEC 61000-4-2 ESD 脉冲的上升时间很快(在 0.7 和1nsec之间) Response time measured from 10% to 90% of the peak Voltage 15 nsec 从峰值电压10% 到 90%测量的 响应时间： 15 nsec Response time measured from 10% to 90% of the peak Voltage 10 nsec 从峰值电压10% 到 90%测量的 响应时间： 10 nsec TVS vs Varistors ESD protection comparison安森美半导体、变阻器和竞争者的ESD响应比较 Output: Varistor, VA-C1005-5R5E 输出：变阻器，VA-C1005-5R5E Input: 8KV ESD Pulse, IEC 61000-4-2 输入： 8KV ESD脉冲， IEC 61000-4-2 Output: ON Semiconductor, MSQA6V1 输出：安森美， MSQA6V1 Test condition: 测试条件： Applied 8kV ESD contact pulse using a high frequency test board (Low inductance, ideal case). 使用高频测试板施加8kV ESD 接触脉冲(低电感，理想状况)。

  7. TVS vs varistor Package Size Comparison封装尺寸比较 On Semiconductor SC88 (2 x 2 x 1) 安森美半导体SC88 On Semiconductor SOT-563 (1.6 x 1.6 x 0.60) 安森美半导体 SOT-563 Varistor (3.2 x 1.6 x 0.9) 变阻器 英寸 毫米 尺寸 英寸 毫米 尺寸

  8. ON Semiconductor (MSQA6V1) 安森美半导体 Varistor 变阻器 ESD 7V 35V Response Time 响应时间 10nS 15nS Surge 浪涌 11V 20V Leakage 漏电 0.04uA 4uA Foot Print 占用面积 1.6 x 1.6 3.2 x 1.6 Height Profile 高度 0.55 0.90 Capacitance 电容 90pF 360pF Lifetime 寿命 TVS vs Varistor Conclusion结论

  9. TVS ESD Conclusion • IC’s must be protected because most of them cannot withstand • ESD conditions higher than 2kV. • ON Semiconductor devices showed the best performance • to suppress ESD pulses generated by the IEC 61000-4-2 • ESD standard. • PCB lay-out is critical to improve ESD protection and reduce the • parasitic effects (V=Ldi/dt). • Varistors do not offer an effective ESD protection because their • clamping voltage is too high. They cannot be used for protection • in high speed data lines either because of their high capacitance. • Semtech’s devices are more sensitive to board parasitic effects, • which could be due to higher package’s inductance.

  10. TVS- Dual / Multi-Line Array Protection Smallest package (1.6x1.6mm)

  11. IC to be Protected IC to be Protected NZQA5V6XV5T1; NZQA6V2XV5T1; NZQA6V8XV5T1; NZQA8V2XV5T1; NZQA5V6AXV5T1; NZQA6V8AXV5T1; MSQA6V1W5T2; SMF05T1; NSQA6V8AW5T2 4 Uni-Directional ESD Protection Packages: SC-88A (for MSQA, SMF05, NSQA) SOT-553 (for NZQA series) IC to be Protected IC to be Protected TVS Application: Bottom Connector Benefits: • Integrated Solution • Increase Reliability & Quality • Saving Board Space • Low Capacitance (as low as 12pF typical for NZQA6V8A and NSQA6V8A) SMF05C; NUP5102VX6 • 5 Uni-Directional ESD Protection • Packages: SC-88 ( SMF05C) SOT-563 (NUP5102)

  12. NUP4101FCT1; NUP4102XV6T1 4 Bi–Directional ESD Protection Low Capacitance ( <10pF @ 3V) Package: NUP4101FCT1: Flip-Chip NUP4102VX6T1: SOT-563 Vcc SIMDATA SIMCLK SIMRST NUP4101FCT1 NUP4102VX6T1 TVS Application: SIM Card Interface NZQA6V8AXV5T1; NSQA6V8AW5T2 • 4 Unidirectional Array for Protection • Low Capacitance ( <7pF @ 3V) • Package: NZQA6V8AXV5T1: SOT-553 NSQA6V8AW5T2: SC-88A Vcc SIMDATA SIMCLK SIMRST NZQA6V8AXV5T1 MSQA6V1W5T2 Benefits: • ESD Immunity as per IEC61000-4-2 Level 4 • Low Capacitance for fast data rate • Low PCB area (51 x 51 mil for NUP4101FCT1) OR

  13. ESD+EMI filterapplications • Microphone and Speaker • ESD Protection/EMI Filtering • LCD Display • ESD Protection/EMI Filtering • Keypad • ESD Protection/ • EMI Filtering • Camera • ESD Protection/EMI • Filtering • Bottom Connector • ESD Protection/ • EMI Filtering • SIM Card, USB/MMC Interface • ESD Protection/EMI Filtering

  14. EMI Types and Generation EMI类型和产生 1.- Conducted EMI is noise fed back from a system onto the AC or DC power line or signal lines. This noise is in the frequency range of 10KHz to 30MHz. It usually has a common mode component and a differential mode component. The common mode component appears as a voltage on both line and neutral leads with respect to ground or earth while the differential mode appears between the line and neutral leads. To suppress conducted EMI, LC networks are usually used.传导EMI是从系统反馈到交流或直流电源线或信号线的噪声。这种噪声的频率范围从10KHz 到 30MHz。它通常有一个共模分量和一个差模分量。共模分量是施加在火线和中线上的对地电压。差模出现在火线和中线之间。为了抑制传导EMI，通常使用LC网络。 2.- Radiated EMI comes in the form of electromagnetic waves radiating directly from the circuitry and leads of a system. A common example is the AC power cord of the system which can act as a transmitting antenna for radiated EMI. Ranging from 30MHz to 1GHz, this type of noise can be effectively suppressed by metal shielding around the source.辐射EMI以直接从系统电路和导线辐射出来的电磁波形式出现。常见的实例是系统的交流电源线作为辐射EMI的发射天线。频率范围从30MHz 到 1GHz，这种噪声可以被源周围的金属屏蔽有效抑制。 Conducted EMI, ac power line 60Hz 传导EMI，交流电源线60Hz Radiated EMI, high frequency clock 辐射EMI，高频时钟 图2：有高频噪声的20MHz时钟 图1：工厂中的线路源

  15. ESD+EMI filterPerformance Comparison Between Discrete and Integrated Filters Discrete Pi-Filter Integrated Pi-Filter NZF22OTT1 Reduced parasitic L2 < 0.5nH Ground parasitic L1 > 2.8nH usually Sharp Rise Smooth Rise Advantages of ON Semi’s integrated Filters versus discrete filters • Reduced package parasitic for better roll-off frequency response. • Tighter tolerances for integrated components. • Integrated ESD protection. • Significant PCB space savings for optimized designs.

  16. ESD+EMI filter: Devices

  17. ESD+EMI filter: Devices

  18. NUF2441FCT1(Available Jun’04) EMI Filter with ESD Protection Inductors Integrated 3.5nH Low Resistance 0.32ohm Integrated Package: ChipFET & Flip-Chip Audio processing and conversion A Speaker D Audio processing and conversion A Speaker OR D ESD+EMI filter Audio: Speaker Line OR Benefits: • Ui-Directional EMI Filtering Low Power Loss by Integrated Inductors • Replace 12 discrete components • ESD Immunity as per IEC61000-4-2 Level 4 OR NUF2113FCT1(Available Q2’04) • EMI Filter with ESD Protection • Low Resistance 10ohm Integrated • Package: Flip-Chip Benefits: • Bi-Directional EMI Filtering Prevents Noise from Entering/Leaving the System • Low Power Loss by Integrated Low Resistance • Replace 14 discrete components • ESD Immunity as per IEC61000-4-2 Level 4

  19. NUF2114FCT1 EMI Filter with ESD Protection Integrated Solution Package: Flip-Chip Audio processing and conversion A D ESD+EMI filterAudio: Headset (Speaker + Microphone) Benefits: • Bi-Directional EMI Filtering Prevents Noise from Entering/Leaving the System • Low Power Loss by Integrated Low Resistance • Replace 14 discrete components • ESD Immunity as per IEC61000-4-2 Level 4

  20. NUF2441HT1; NUF2441FC EMI Filter with ESD Protection Package: ChipFETTM (for NUF2441HT1) Flip-Chip (for NUF2441FC) ESD+EMI filter Audio: Microphone and Audio Line Vbias Audio processing and conversion Microphone/ Speaker A Benefits: • Bi-Directional EMI Filtering Prevents Noise from Entering/Leaving the System • Low PCB area • Replace 10 discrete components • ESD Immunity as per IEC61000-4-2 Level 4 D NUF8101FCT1 • Integrates the Filtering for 2 Microphone Inputs, 4 Resistors for Biasing, and ESD Protection • EMI Symmetrical (I/O) Low-Pass Filter • Package: Flip-Chip Audio processing and conversion Microphone1 A Microphone2 Benefits: • Low PCB area (2.0 x 2.5 mm2) • Very thin package (0.65mm) • ESD suppression on both input and output pins (IEC61000-4-2 Level 4) NUF8101FCT1 Speaker1 D Speaker2

  21. Audio processing and conversion Stage-1 Stage-2 A NMF3501FC NMF3501FC D Microphone ESD+EMI filter Audio: Audio Line NMF3501FC & NMF3502FC • -75dB @ 80MHz -1GHz • -60dB @ 1GHz – 2GHz • Two-stage Integrates Filter for Microphone Inputs with Resistors for Biasing, and ESD Protection • Package: Flip-Chip Benefits: • Low PCB area (1.2 x 1.7 mm2) • Very thin package (0.65mm) • Replace 30 discrete components • ESD suppression on both input and output pins (IEC61000-4-2 Level 4)

  22. NZMM7V0T4 9 EMI/RFI Bi-Directional “Pi” Low Pass Filter 4 x 4 mm Lead Less MLF Surface Mount Package Replace 30 discrete components Package: 24 PIN MLF NZF220DFT1 Dual EMI/RFI Bi–directional “Pi” Low–Pass Filters Package: SC-88A NZF220TT1 Single EMI/RFI Bi–directional “Pi” Low–Pass Filters Package: SC-75 ESD+EMI filter Keypad I1 I2 O1 I3 O2 O3 ON’s Filter CPU O7 O8 I7 O9 I8 I9 Benefits: • Suppresses EMI/RFI Noise in Systems Subjected to Electromagnetic Interference • Small Package Size Minimizes Parasitic Inductance, Thus a More “Ideal” Low Pass Filtering Response

  23. CPU NUF9001FC NUF6105/06 CPU NUF4105/15 ESD+EMI filter Bottom Connector NUF9001FCT1(Available May’04) • 10 Channel EMI Pi-Filter with ESD Protection • Two Bump Sizes Available • 300mm & 350mm • Package: Flip-Chip Benefits: • Low PCB area (2.6mm x 2.6mm) • Reduced components count • Low line capacitance for high data rate exchange NUF4105FCT1; NUF6105FCT1; • 4 & 6 Channel EMI Pi-Filter with ESD Protection • Two Bump Sizes Available • 300mm for NUF4105FC and NUF6105FC • 350mm for NUF4115FC and NUF6115FC • Package: Flip-Chip Benefits: • Low PCB area • Reduced components count • Wide freq. range rejection -35dB from 800MHz to 2.2GHz • Low line capacitance for high data rate exchange

  24. ESD+EMI filter LCD Display NUF4401MNT1(Available Jun’04) • 4 Channel EMI Pi-Filter with ESD Protection • 200 Ohms line resistor design for LCD application • Package: 2X2mm QFN package CPU NUF4401 NUF4105FCT1; NUF6105FCT1; NUF6106FCT1 (21pF@ 2.5V),NUF9001 • 4 , 6 &10 Channel EMI Pi-Filter with ESD Protection • Two Bump Sizes Available • 300mm for NUF4105FC and NUF6105FC • 350mm for NUF4115FC and NUF6115FC • Package: Flip-Chip Benefits: • Low PCB area • Reduced components count • Wide freq. range rejection -35dB from 800MHz to 2.2GHz • Low line capacitance for high data rate exchange NUF6105/06 CPU NUF4105/15

  25. ESD+EMI filter Mega pixel Camera Interface NUF6106FCT1 (21pF@ 2.5V) • 6 Channel EMI Pi-Filter with ESD Protection • Low Capacitance (21pF@2.5V) for Mega pixel/ high speed dataline • Package: Flip-Chip Benefits: • Low PCB area • Reduced components count • Wide freq. range rejection -25dB from 800MHz to 2.2GHz • Low line capacitance for high data rate exchange NUF6106FC CPU CAMERA

  26. ESD+EMI filterNUF6106FCt1 –Low capacitance 6 channel EMI filter for high speed

  27. Vcc in1 out1 SIMDATA in2 out2 SIMCLK in3 out3 SIMRST NUF3101FCT1 ESD+EMI filter SIM Card Interface NUF3101FCT1(Available in Jun 04) • Integrated Filter with ESD Protection • 3 channels are dedicated to data lines and 1 channel is for the supply voltage • Package: Flip Chip (1.6X1.6mm)

  28. ESD+EMI filter Multimedia Card Interface NUF4105FCT1; NUF4115FC • 4 Channel EMI Pi-Filter Array for Data Lines with ESD Protection • Two Bump Sizes Available • 300mm for NUF4105FCT1 • 350mm for NUF4115FC • Package: Flip-Chip Vcc NUF4105FC NUF4115FC Vcc in1 out1 MMCDATA MMCCLK in2 out2 MMCCMD in3 out3 GND Benefits: • Low PCB area • Reduced components count • Wide frequency range rejection -35dB from 800MHz to 2.2GHz • Low line capacitance for high data rate exchange NZMM7V0T4 • 9 EMI Bi-Directional “PI” Low Pass Filter • Package: 24 PIN MLF Benefits: • Low PCB area • Reduced components count • Low parasitic inductance, providing a more ideal low pass filtering response

  29. ESD+EMI filter Multimedia Card Interface NUF3101FCT1 • Integrated Filter with ESD Protection • 3 channels are dedicated to data lines and 1 channel is for the supply voltage • Package: Flip Chip @ 300um Vcc NUF3101FC Vcc in1 out1 MMCDATA MMCCLK in2 out2 MMCCMD in3 out3 GND Benefits: • Low PCB area • Reduced components count • Wide frequency range rejection • -30dB @ 800mHz - 1GH • -25dB @1GHz – 2GHz • Low line capacitance, 20pF typical, for high data rate exchange

  30. ESD+EMI filter SIM card EMI filter NUF3101FCT1 Description This device is a 3 line EMI filter array with TVS diode design for SIM card application. Greater than -35 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. It also offers ESD protection – clamping transients from static discharges. ESD protection is provided across all capacitors. Features • EMI Filtering and ESD Protection • Flipchip • Moisture Sensitivity Level 1 • Applications • Wireless Phones • Handheld Products • LCD Displays Schedule • Phase 0 approved • Engineering Sample Now • Production May 2004

  31. Vcc in1 out1 SIMDATA in2 out2 SIMCLK in3 out3 SIMRST NUF3101FCT1 ESD+EMI filter SIM Card Interface NUF3101FCT1 • Integrated Filter with ESD Protection • 3 channels are dedicated to data lines and 1 channel is for the supply voltage • Package: Flip Chip Benefits: • Low PCB area • Reduced components count • Wide frequency range rejection -35dB from 800MHz to 2.2GHz • Low line capacitance for high data rate exchange

  32. ESD+EMI filter New Products Flip Chip Package Introduced NUF4105 4 channel filter+ 4 TVS diode NZF220T/NZF220D Single(SC-75)/ Dual filter(SC-88A) 2004 2005 NUF4107 4 channel filter +USB filter NZMM7V0 9 channel filter MLF24 pin 24 PIN MLF 4X4mm NUF6105 6 channel filter NUF4401MN 4 channel filter 2mm QFN NUF6106 (Low-cap) 6 channel filter 8 pin QFN 2X2mm NUF4402MN 4 channel filter 1.6mm QFN NUF9001 10 channel filter NUF8401MN 8 channel filter 1.6X4mm DFN 8 pin QFN 1.6X1.6mm NUF3101 SIM Card filter NUF4404MN (Low-cap) 4 channel filter 1.6mm QFN NUF3201 MM Card filter NUF4801MN (Low cap) 4 channel filter/ 4 ESD diode 1.6X4mm DFN 16 pin DFN 1.6X4.0mm NUF1001MN (Low-cap) 10 channel filter/4 ESD diode 1.6X5mm DFN

  33. ESD+EMI filter New Products Flip Chip Package Introduced NUF2441FC 2 channel LC Speaker/Headset filter NUF4111 MN 4 channel Speaker and Mic RC+LC Filter in 2mm QFN 2004 8 pin QFN 2X2mm 2005 NUF2113FC 2 channel Headset RC filter NUF4112MN 4 channel Speaker and Mic RC+ LC Filter in 1.6mm QFN 8 pin QFN 1.6X1.6mm NUF2114FC 2 channel Mic RC filter NUF4112FC 3 channel Speaker and Mic RC Filter RC Filter LC Filter

  34. ESD+EMI filter New Products NUF8401 • 8- line EMI filter • 1st 8 line filter in DFN package • Sample available : Aug 04 • Production schedule: Sep 04 • CMD 8 line Flip chip (1.5X4.0mm) NUF4401 • 4 Channel filter • Standard 8 leaded QFN pacakage • Sample available: NOW • Production schedule: Aug 04 • NUF4402 • 4 Channel filter • Smallest 4 line filter in QFN package • Sample available : Aug 04 • Production schedule: Sep 04 NUF8401 NUF4402 NUF4401 1.6 X1.6mm 2.0 X2.0mm 1.6 X4.0mm

  35. ESD+EMI filter New Products NUF6401 • 6- line EMI filter • 1st to provide in DFN package • Pin to Pin compatible Flip chip package • Competitor cross reference • CMD (CSPEMI306A) • STM (EMIF06-10006F1) • PHILIPS (IP4053CX15) • NUF6402 • 4- line EMI filter + 4 ESD diode • 1st to provide in DFN package • Pin to Pin compatible Flip chip package • Competitor cross reference • CMD (CSPEMI307A) • STM (EMIF04-10006F1) NUF6401 NUF6402 1.35 X3.0mm 1.35 X3.0mm

  36. QFN package Better Reliability and robust package Better ESD rating and handling capability All pins accessible after board mounted for debugging or trouble shooting for design engineers Better Filter characteristics than Flip-chip or CSP 50% Less parasitic Inductance than Flip-chip or CSP Increase chip mount density (400um chip to chip separation) Competitive Pricing ESD+EMI filter QFN versus Flipchips

  37. ESD+EMI filter Pin to Pin Compatibility • The DFN package • Pin to Pin replacement • Compatible Foot print • Same Case size • Related Part# are • NUF6401 and NUF6402 Flip chip or BGA (1.33X 3.0mm) DFN package (1.35X3.0mm)

  38. ESD+EMI filter 4 Channel EMI filter NUF4401MN(2.0MM) Description This device is a 4 line EMI filter array for wireless applications. Greater than -35 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. It also offers ESD protection – clamping transients from static discharges. ESD protection is provided across all capacitors. • Benefits • Reduces EMI/RFI Emissions on a Data Line • Integrated Solution offers Cost and Space Savings • Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass Filter Response • Integrated Solution Improves System Reliability Features • EMI Filtering and ESD Protection • QFN 2x2mm • Moisture Sensitivity Level 1 • Applications • Wireless Phones • Handheld Products • LCD Displays Schedule • Phase 0 approved • Engineering Sample May 2004 • Production Q2 2004

  39. New Product ESD+EMI filter 4 Channel EMI filter NUF4105MN (QFN1.6MM) Description This device is a 4 line EMI filter array for wireless applications. Greater than -35 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. It also offers ESD protection – clamping transients from static discharges. ESD protection is provided across all capacitors. Low Capacitance • Cline = 15pF max @ 3 volts • Benefits • Reduces EMI/RFI Emissions on a Data Line • Integrated Solution offers Cost and Space Savings • Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass Filter Response • Integrated Solution Improves System Reliability Features • EMI Filtering and ESD Protection • QFN 1.6x1.6mm • Moisture Sensitivity Level 1 • Applications • Wireless Phones • Handheld Products • LCD Displays Schedule • Phase 0 approved • Engineering Sample May 2004 • Production Q3 2004

  40. GND New Product ESD+EMI filter 5 Channel EMI filter NUF5105MN (1X 3MM) Description This device is a 5 line EMI filter array for wireless applications. Greater than -35 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. It also offers ESD protection – clamping transients from static discharges. ESD protection is provided across all capacitors. • Benefits • Reduces EMI/RFI Emissions on a Data Line • Integrated Solution offers Cost and Space Savings • Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass Filter Response • Integrated Solution Improves System Reliability Features • EMI Filtering and ESD Protection • QFN 1x3mm • Moisture Sensitivity Level 1 • Applications • Wireless Phones • Handheld Products • LCD Displays Schedule • Engineering Sample Q3 2004 • Production Q3 2004

  41. 1 7 2 8 3 9 4 10 5 11 6 12 New Product ESD+EMI filterUSB + 3 EMI filterNUF5107MN ( 1X 3MM) Rs Description This device is a 3 line EMI filter array for wireless applications. Greater than -35 dB attenuation is obtained at frequencies from 800 MHz to 2.2 GHz. It also offers USB filtering circuitry with ESD protection – clamping transients from static discharges. ESD protection is provided across all capacitors. Rs Rin Rin Features • USB filtering circuit • EMI Filtering and ESD Protection • QFN 1X3mm • Moisture Sensitivity Level 1 Rin • Benefits • Reduces EMI/RFI Emissions on a Data Line • Integrated Solution offers Cost and Space Savings • Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass Filter Response • Integrated Solution Improves System Reliability • Applications • Wireless Phones • Handheld Products • LCD Displays Schedule • Engineering Sample Q3 2004 • Production Q3 2004

  42. USB interface:Single Channel Transceiver NCN2500 The NCN2500 Integrated Circuit is a single channel transceiver designed to accommodate the physical USB Port with a microcontroller digital I/O. The part is fully USB compliant and supports the full 12 Mbps speed. On the other hand, the NCN2500device includes the pull−up resistors as defined by the USB−ECN new specifications. Features • Compliant to the USB Specification, Version 2.0, Low and FullSpeed • Very Small Footprint Due to the QFN−16 Package • Integrated D+/D− Pull−Up Resistors • Operates Over the Full 1.5 V to 5.5 V Vbat Supply Typical Application • Portable Computer • Cellular Phone

  43. USB interface:Single Channel Transceiver NCN2500

  44. USB interface:NCN2500:TYPICALAPPLICATION

  45. USB interface:NCN2500 / MICREL COMPARISON

  46. USB interface:NCN2500 / FAIRCHILD COMPARISON

  47. USB interface:ESD Protection USB 1 Lines (1/2 Port) 2 Lines (1 Port) 4 Lines (2 Port) USB 1.1 I/O Lines + VBus SRDA05-4 SL05 LC03-6 USB 2.0 I/O Lines + VBus Low capacitance series <5pF for USB 2.0 and high speed I/O NUP4201DR2 NUP2201MR6 NUP4201MR6 USB I/O Lines NUP4301MR6 NUP1301ML3 NUP2301MW6 USB1.1 USB2.0

  48. 1 line 1 port (2 lines) 2 ports (4 lines) CAMD P/N: CM1210-01ST; CM1210-01SC Package: SOT23-3; SC70-3 Max. Cap: 1.3pF ESD: IEC61000-4-2 P/N: CM1210-02ST; CM1210-02SC Package: SOT143-4; SC70-5 Max. Cap: 1.3pF ESD: IEC61000-4-2 P/N: CM1210-04ST Package: SOT23-6 Max. Cap: 1.3pF ESD: IEC61000-4-2 P/N: SLxx Package: SOT23 Max. Cap: 5pF ESD: IEC61000-4-2 P/N: SRV05-4 Package: SOT23 Max. Cap: 5pF ESD: IEC61000-4-20 Surge: 300W P/N: USB208 Package: SOT-23-6 Max. Cap: 5pF ESD: IEC61000-4-2 P/N: NUP1301ML3 Package: SOT-23 Max. Cap: 1.5pF ESD: IEC61000-4-2 P/N: NUP2201MR6 Package: TSOP-6 Max. Cap: 5pF ESD: IEC61000-4-2 Surge: 300W P/N:NUP4201DR2; NUP4201MR6 Package:SO-8; TSOP-6 Max. Cap: 5pF: 5pF ESD: IEC61000-4-2 Surge: 300W; 300W Under Proposal Development P/N: NUP2301MW6 Package: SC-88 Max. Cap: 5pF ESD: IEC61000-4-2 P/N: NUP4301MR6 Package: TSOP-6 Max. Cap: 5pF ESD: IEC61000-4-2 USB Interface ESD:Cross Reference (USB 2.0)

  49. 1 line 1 port (2 lines) 2 ports (4 lines) P/N: SLxx Package: SOT23 Max. Cap: 5pF ESD: IEC61000-4-2 P/N: SR05 Package: SOT-143 Max. Cap: 10pF ESD: IEC61000-4-2 Surge: 500W P/N: SRDAxx-4 Package: SO-8 Max. Cap: 15pF ESD: IEC61000-4-2 Surge: 500W ProTek Device P/N: USB004 Package: SOT-143 Max. Cap: 6pF ESD: IEC61000-4-2 P/N: USB208 Package: SOT-23-6 Max. Cap: 5pF ESD: IEC61000-4-2 P/N: PSR05 Package: SOT-143 Max. Cap: 10pF ESD: IEC61000-4-2 Surge: 500W P/N: PUSB3B; PUSB6B Package: SO-8 Max. Cap:15pF; 15pF ESD: IEC61000-4-2 Surge: 500W; 500W USB Interface ESD: Cross Reference (USB 1.1)

  50. USB Interface ESD: Cross Reference (USB 1.1) 1 line 1 port (2 lines) 2 ports (4 lines) P/N: USB6Bx; Package: SO-8 Max. Cap: 25pF ESD: IEC61000-4-2 Surge: 500W Littelfuse P/N: SP0502AAHT Package: SOT-143 Max. Cap: 6pF ESD: IEC61000-4-2 Microsemi P/N: USB6B1 Package: SO-8 Max. Cap: 14pF (typical) ESD: IEC61000-4-2 Surge: 500W P/N: SRLC05 Package: SOT-143 Max. Cap: 6pF (typical) ESD: IEC61000-4-2 Surge: 200W P/N: SL05T1 Package: SOT23 Max. Cap: 5pF ESD: IEC61000-4-2 P/N: LC03-6R2 Package: SO-8 Max. Cap: 25pF ESD: IEC61000-4-2 Surge: 2000W P/N : SRDA05-4R2 Package: SO-8 Max. Cap: 10pF; 15pF ESD: IEC61000-4-2 Surge: 500W: 500W

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