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Optical Lithography Ghassan Malek Sr. Development Engineer

I ntegrated S ystems N anofabrication C leanroom. Optical Lithography Ghassan Malek Sr. Development Engineer . OUTLINE. Optical Lithography Main Tools Lithography Support Equipment Future Tools and Projects Acknowledgements. SUSS CONTACT ALIGNER. Model MA6 TSA/BSA Alignment

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Optical Lithography Ghassan Malek Sr. Development Engineer

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  1. Integrated Systems Nanofabrication Cleanroom Optical Lithography Ghassan Malek Sr. Development Engineer

  2. OUTLINE • Optical Lithography Main Tools • Lithography Support Equipment • Future Tools and Projects • Acknowledgements

  3. SUSS CONTACT ALIGNER • Model MA6 • TSA/BSA Alignment • Pieces to Full 6” Wafers • 1 um Resolution with Vacuum Contact • Wafer Direct Bonding

  4. SF100 XPRESS • Maskless Lithography • Uses a Range of Wavelengths • Smart Filter Technology • Process Wafers and Non-Wafer Substrates • Process Non-Flat Subs • File in BMP

  5. SF100 EXPRESS

  6. SF100 EXPRESS Photoresist Patterns on Round Substrates

  7. ASML STEPPERModel PAS 5500 /200 5X I-LineSHORT STORY

  8. SOME DIFFICULTIES

  9. SOME DIFFICULTIES

  10. ASML STEPPER • Model PAS 5500 /200 5X I-Line • 2 Point Global Alignment • Resolution < 350nm • Single Machine Overlay < 50nm • Field Size X Y Max 22.0mm x 27.4mm • Pieces to Full 8” Wafers • Variable NA 0.48-0.60 • ArialTM Illuminator

  11. ILLUMINATION PATH

  12. SIZE MATTERS

  13. ASML STEPPER RETICLE • Reticle Size 6” x 6” • Quartz 0.250” for Sub-0.5um • Pellicle • GDSII File • Design can be checked before generating reticle

  14. ALIGNMENT MARK

  15. ANATOMY OF THE ASML JOB • Cells • Die and Exposure Fields • Images and Image IDs • Layer Numbers and Layer IDs • Layer ID, Image ID and Reticle ID • Image Location and Masking Window • Alignment Marks

  16. RETICLE ORDER FORM

  17. ASML JOB ORDER FORM

  18. INITIAL RESULTS • Test Mask • Megaposit SPR 660 • Developer MF-26A • Resist Thickness 750nm • Exposure 130mJ at -0.1um Focus

  19. INITIAL RESULTS

  20. SVG 8800 WAFER TRACK • Two Track System • One Active Coat Track • Send-HMDS-CP-Coat-SoftBake-Receive • Configured for 4” or 6” Wafers • Two Active Resist Pumps • Capable of 3 Resists

  21. SVG 8800 WAFER TRACK

  22. SVG 8800 WAFER TRACK • IDI M450 Photoresist Pumps • ChemNetTM Software • Dispense Volume Range 0.1ml to 50ml • Viscosity Range 1.0cP to 100cP

  23. SVG 8800 WAFER TRACK Coat Program

  24. LITHO SUPPORT EQUIPMENT • Headway Spin Coaters • Headway Stand Alone Coater • Hot Plates • Acid and Solvent Fume Hoods • Carbolite High Temperature Oven • Vacuum Oven • Nanospec Film Thickness Measurement • AST Contact Angle Measurement • Leica and Nikon Microscopes

  25. HEADWAY SPIN COATERS

  26. WAFER SURFACE ANALYSIS • AST VAC-3000S • Contact Angle Measurement

  27. CARBOLITE HIGH TEMP OVEN • Up to 600°C • Programmable • Eurotherm Controller

  28. MICROSCOPES • Leica and Nikon Microscopes • Leica Application Software

  29. FUTURE PROJECTS • Add Developer Track • Add Third Resist Pump • Add Spin Coater for Thick Resist • Applied Material 7830SI CDSEM • Several Fume Hoods

  30. ACKNOWLEGEMENTS • Micron Technology & ASML • Janine Rush-Byers • Micron University Relation Manager • Troy Sych • ASML VP Strategic Account Management • Michael Brennan • ASML Regional Customer Support

  31. ACKNOWLEGEMENTS • International Rectifier Corporation • Oleg Khaykin • President and CEO • Nick Brand • GM & VP, El Segundo & WW Wafer Fab Strategies • Larry Jones • Site Facilities Manager

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