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Thermal Management

Thermal Management. Must do thermal management at the device, the board, and the box levels Device: proper package heat sinking Thermal vias to Cu planes Unobstructed airflow Soldering the device thermal pad to the PCB Board level Heat flow out of the board

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Thermal Management

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  1. Thermal Management • Must do thermal management at the device, the board, and the box levels • Device: proper package heat sinking • Thermal vias to Cu planes • Unobstructed airflow • Soldering the device thermal pad to the PCB • Board level • Heat flow out of the board • Air flow, PCB card guides, PCB with metal heat sinks • Other Devices • Other Active parts generate Heat • Can cause localized hot-spots on PCB – effectively reducing thermal flow and increasing Silicon Temp.

  2. Thermal Calculations ΘJC= Thermal Resistance Junction to Case (°C/W) ΘCA= Thermal Resistance Case to Ambient (°C/W) ΘJA= Thermal Resistance Junction to Ambient (°C/W) YJT is useful to calculate Junction Temperature YJT is NOT a true Thermal Resistance – Only used as a Tool Remember qCA is dependant upon package, PCB design, and external environment. Thus, qJA can fluctuate considerably from design to design!!!

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