1 / 8

DOM MB Rev 4.2 to Rev 5.0 Changes

DOM MB Rev 4.2 to Rev 5.0 Changes. April 26, 2004 Gerald Przybylski Lawerence Berkeley National Laboratory. History. Rev 1, January 3, 2003, Translation from OrCAD Rev 2, April 9, 2003, Booting & Memory troubles Rev 3, September 2, 2003, Clamping troubles

connie
Télécharger la présentation

DOM MB Rev 4.2 to Rev 5.0 Changes

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. DOM MBRev 4.2 to Rev 5.0 Changes April 26, 2004 Gerald Przybylski Lawerence Berkeley National Laboratory

  2. History • Rev 1, January 3, 2003, Translation from OrCAD • Rev 2, April 9, 2003, Booting & Memory troubles • Rev 3, September 2, 2003, Clamping troubles • Rev 4.1, February 3, 2004, ~ 110 changes incorporated • Rev 4.2, March 15, 2004, ~ 12 more changes Lawerence Berkeley National Laboratory

  3. Status & Requirements • Rev 4.2 Meets Performance Requirements • BOM Mature, Minimized, Qualified • Last batch: 20 cards; not loading errors, 1 solder bridge, 1 cold solder, 1 tombstone. • Mechanical Tweaks • Little Time Left for Improvements • Changes Carry Risk Lawerence Berkeley National Laboratory

  4. Circuitry • Shield between DOMMB and delay for PS noise- Reduce EMI pick-up • Shield over 7W DC-DC converter- Reduce EMI pick-up • Add Bypass capacitors at ATWD for PS noise- Filter noise • Add 1.8V SDRAM Memory Power Option- One 0603 Jumper Footprint • Add enhancement for LC Tx Idle Restoration- Two 0603 Resistor Footprints & Traces Lawerence Berkeley National Laboratory

  5. Design for Manufacturability & for Integration • Move/Modify Signal Connections- Twisted Pair Attachments Become Posts- Relocate RA SMB PMT Signal Connector • DNL (do not load) TP25- Resolve Interference with RA SMB • 0.005” trace/space feasibility- Toward Full IPC 6012Class 3 Compliance • Serial number relocation- Enable inspection for sealed DOM Lawerence Berkeley National Laboratory

  6. Reliability Related • Delete (?) Panasonic CM Inductor • Eliminate Capacitors with Pure Tin Leads- by Footprint Changes, 0603 → 0805 Miscellaneous • No-Load hard and soft reboot push buttons • Various loading clarifications in schematic Lawerence Berkeley National Laboratory

  7. Remaining Issues • Communications Balun(s) • Shielding/Moving DC-DC Converter to Suppress EMI consistently below ¼ SPE • Timely Delivery of Corning Oscillators • Tin on Corning Oscillator Components • Undiscovered Integration Issues Lawerence Berkeley National Laboratory

  8. Conclusion • Significant progress in the last year. • Converging (or converged?) • The performance is there. • Small worries remain Lawerence Berkeley National Laboratory

More Related