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產品設計 (Product Design)

產品設計 (Product Design). 規格審核 (Specification Review) 架構選擇 (Topology Selection) 電路設計 (Circuitry Design) 磁性元件計算 (Magnetic Devices Calculation) 零件評價 (Components Evaluation) 電路板佈圖 (PCB Layout) 機構模具 (Mechanical Tooling) 樣品組裝、除錯與測試 (Sample Assembly, Debug & Test)

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產品設計 (Product Design)

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  1. 產品設計(Product Design) 規格審核(Specification Review) 架構選擇(Topology Selection) 電路設計(Circuitry Design) 磁性元件計算(Magnetic Devices Calculation) 零件評價(Components Evaluation) 電路板佈圖(PCB Layout) 機構模具(Mechanical Tooling) 樣品組裝、除錯與測試(Sample Assembly, Debug & Test) 承認書與工程資料(Approval Sheet & Product Documents) 試產量產的反饋、評定與修正(Feedback, Assessment & Correction by PP/MP)

  2. 規格審核(Specification Review) 1.輸入規格(Input Specification)：電壓(Voltage), 頻率(Frequency), 電流(Current), 突入電流(Inrush Current) 2. 輸出規格(Output Specification)：定電壓定電流(CVCC), 漣波雜訊(Ripple&Noise), 反灌電流(Reverse Current), 效率(Efficiency) 3. 保護特性(Protection Features)：過電壓(OVP), 單一異常(Single Fault), 過電流(OCP), 短路(Short) 4. 環境規格(Environment Specification)：工作溫度(Operating Temp), 儲存溫度(Storage Temp), 高度(Altitude), 振動(Vibration), 5. 國際標準(International Standards)：安全規格(Safety Standard), 電磁干擾(EMI), 電磁相容(EMC) 6. 機構規格(Mechanical Specification)：外型尺寸(Outline Dimensions), 線材(Cable), 連接器(Connector), 銘版(Label), 包裝(Package) 7. 可靠度(Reliability)：平均失效時間(MTBF), 燒機(Burn in)

  3. 架構選擇(Topology Selection) 返馳式 ( Flyback ) PI, Fairchild, etc.--- ~100W 鈴流扼制式 ( Ringing Choke Converter ) --- ~20W 順向式 ( Forward ) --- 60W~600W 半橋式 ( Half-Bridge ) --- 200W ~ 500W 全橋式 ( Full-Bridge ) --- 500W~ 推挽式 ( Push-Pull ) --- 500W~ CUK式 --- 無輸出漣波(Output Ripple-less) SEPIC式 --- 無輸入漣波(Input Ripple-less) 共振式 ( Resonant ) --- 低損失(Loss-less)

  4. 電路設計(Circuitry Design) 典型的離線高頻交換式電源供應器之方塊圖 Block Diagram of Off-Line Switching Power Supply 輔助電源 與電流限制 Auxiliary Power and Current Limit 輸出週邊附屬電路 與過電壓保護 Extra Function and O.V.P. 功率隔離 變壓器 Isolated Power Transformer 交流電源輸入 AC Input 電磁干擾 濾波器 EMI Filter 整流與濾波 Rectifier and Filter 交換元件 Switching Device 整流與濾波 Rectifier and Filter 直流電源輸出 DC Output 迥授與控制 Feedback Control 隔離元件 Isolated Device

  5. 磁性元件計算(Magnetic Devices Calculation) • 法拉第定律(Farady’s Law) V=NAdB/dt • 安培定律(Ampere’s Law) ΣNI=∮Hdl • 導磁率(Permeability)為磁通密度與磁場強度的特性曲線(B-H Characteristics) u=B/H • 形狀(Size)、工作週期(Duty Cycle)、 線徑(AWG)、圈數(Turn)、繞法(Winding)、氣隙(Gap)、感量(Inductance) • 損失計算(Loss Calculation)為鐵損(Core Loss)及銅損(Copper Loss) • 漏磁的影響(Effect of Leakage Inductance) • 電磁干擾(EMI) • 安全規格(Safety)

  6. 零件評價(Components Evaluation) • 1. 變壓器、扼流圈、濾波器 (Transformer / Choke / Filter) • 電磁原理(Electromagnetic)、磁性材料(Magnetic Material)、繞線(Winding) • 2. 電容器 (Capacitor) • 整流原理(Rectifier)、生命週期(Life Time)、穩定度考量(Stability) • 3. 功率電晶體 (Power Transistor) • 電晶體特性(Characteristics)、損失計算與量測(Loss)、保護電路(Protection) • 4. 整流二極體 (Rectifier Diode) • 二極體特性(Characteristics)、損失計算與量測(Loss)、保護電路(Protection) • 5. 控制器 (Controller) • 迴授原理(Feedback Control)、頻率響應(Response)、驅動電路(Driver) • 6. 保護電路 (Protection) • 過電壓(OVP)、過電流(OCP)、過功率(OPP)、柔和起動(Soft-Start) • 7. 印刷電路版 (Printed Circuit Board) • 絕緣層(Insulation)、銅箔層(Copper)、文字印刷(Printing)、孔位孔徑(Hole) • 8. 機構零件 (Mechanical Parts) • 散熱片(Heat Sink)、線材(Wire)、外殼(Case)、連接器(Connector)、包裝(Package)

  7. 電路板佈圖(PCB Layout) • 安全規格(Safety Standard) • 電磁干擾(EMI) • 熱源分佈(Thermal Distribution) • 自動、人工插件及表面黏著技術(AI, MI & SMT) • 區域同極性化及防呆設計(Local Polarization & Foolproof) • 零件的機械應力(Mechanical Stress on Devices) • 舖銅的重點(Copper Pattern Placement) • 文字面、商標、料號、版次(Silkscreen, Logo, P/N, Revision)

  8. 機構模具(Mechanical Tooling) • 造型設計(Industrial Design) • 安全規格(Safety Standard) • 超音波熔接(Ultrasonic Welding) • 射出成型(Injection Molding) • 組裝干涉(Assembly Interference) • 熱流效果(Thermal Management) • 連接裝置(Connection Device) • 包裝考量(Packing Consideration)

  9. 樣品組裝、除錯與測試(Sample Assembly, Debug & Test) • 組裝干涉(Assembly Interference) • 理論與實驗誤差分析(Tolerance Analysis of Theory & Experiment) • 穩定度與可靠度(Stability & Reliability) • 測試儀器與治具的校正(Calibration of Equipment & Fixture) • 最差條件與異常狀況的考量(Worst Case & Abnormal) • 安規、電磁干擾及溫昇(Trade-off in Safety, EMI, Thermal) • 格式化、條列化、圖表化的報告(Report by Table, Item & Figure) • 設計手冊與歷史(Design Handbook & History)

  10. 承認書與工程資料(Approval Sheet & Product Documents) • 規格書(Specification) • 線路圖(Schematic) • 材料清單(Bill of Materials) • 電路板佈圖(PCB Layout) • 機構尺寸圖(Mechanical Drawings) • 測試報告(Test Report) • 生產注意事項(Notice of Production) • 樣品(Golden Sample)

  11. 試產量產的反饋、評定與修正(Feedback, Assessment & Correction by PP/MP) • 試產說明會(Pilot-run Meeting)：資料與樣品審核(Documents & Sample Review)、材料準備(Materials)、測試治具(Test Fixture) • 試產檢討會(Pilot-run Review Meeting)：維修報告(Repair Report)、追蹤事項(Follow up issues) • 量產說明會(Mass-Production Meeting)：作業指導書(Manual Instruction)、品管工程圖(QC Flowchart)、可靠度驗証(Reliability Verification)、生產失效模式及後果分析(DFMEA) • 量產檢討會(Mass-Production Review Meeting)：統計過程控制(Statistical Process Control)、客戶報怨(Customer’s Complaint)、品質異常矯正(Quality Corrective Action)

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