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Technology Roadmaps Ta/KO/AO March, 2006

Technology Roadmaps Ta/KO/AO March, 2006. 1µF-1,000µF Comm. T491/T494 MnO 2. 15µF- 1,000µF T520 Ta-Poly. Increasing ESR. 330µF-1,500µF T510 MA. 8.2µF- 470µF A700 Al-Poly. 220µF-1,500µF T530 MP. Capacitance & ESR. 4.7µF- 1,0000µF Low-ESR T495 MnO 2. 1µF- 47µF Ceramic. 1.E+09. 1.E+09. 10.

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Technology Roadmaps Ta/KO/AO March, 2006

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  1. Technology RoadmapsTa/KO/AOMarch, 2006

  2. 1µF-1,000µF Comm. T491/T494 MnO2 15µF- 1,000µF T520 Ta-Poly Increasing ESR 330µF-1,500µF T510 MA 8.2µF- 470µF A700 Al-Poly 220µF-1,500µF T530 MP Capacitance & ESR 4.7µF- 1,0000µF Low-ESR T495 MnO2 1µF- 47µF Ceramic

  3. 1.E+09 1.E+09 10 10 3 3 1.E+08 1.E+08 10 10 2 2 F F m m 1.E+07 1.E+07 10 10 1.E+06 1.E+06 1 1 1.E+05 1.E+05 10 10 2 2 Capacitance Capacitance nF nF 10 10 1.E+04 1.E+04 1 1 1.E+03 1.E+03 10 10 2 2 1.E+02 1.E+02 10 10 1.E+01 1.E+01 pF pF 1 1 1.E+00 1.E+00 0.1 0.1 1.E-01 1.E-01 2 2 2 2 2 2 DC DC 10 10 10 10 1 1 10 10 10 10 1 1 10 10 10 10 1 1 10 10 Hz Hz KHz KHz MHz MHz GHz GHz Application Frequency Application Frequency Capacitor Applications Space AO KO Ta MnO 2 MLCC Computer X086 X486 Pentium IV Cell Phone/Wireless Communication G1 G2 G3 Power Supply G2 Switching PS Std Power Supply Switching PS Lowest Cost Technical Solution Wins

  4. Tantalum, Polymer & Aluminum Surface Mount Portfolio

  5. Innovation Center—Tantalum/KO • Why? • Speed Introduction of New Products • Who? • Technology, Engineering, and Advanced Manufacturing • What? • New Material/Process/Equipment Development to Support New Products & Cost Reductions • Qualification of New Products • Initial Manufacturing of New Products • Where? • Greenville, SC – Plant Headquarters

  6. Innovation Center—Tantalum/KO 41,000 Sq Ft • $1 MM (us) capital investment • $13 MM (us) annual Ta R&D investment • New parts released in last 22 months • 295 TaMnO2 44 first to market • 157 KO • 119 first to market

  7. Green Roadmap • Skip ‘Green’

  8. EU Directive Compliance (Surface Mount) 1 Criteria for End of Life Vehicles (ELV) per EU Direction 2000/53/EC. Criteria for Restriction on the use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) per EU Directive 2002/95/EC as amended by 2005/618/EC requiring at the homogeneous level: 1000 PPM maximum content for Lead, Hexavalent Chromium, Mercury, PBD, and PBDE and 100 PPM maximum content for Cadmium, unless covered under exemption in Annex I.

  9. EU Directive Compliance (Through Hole) 1 Criteria for End of Life Vehicles (ELV) per EU Direction 2000/53/EC. Criteria for Restriction on the use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS) per EU Directive 2002/95/EC as amended by 2005/618/EC requiring at the homogeneous level: 1000 PPM maximum content for Lead, Hexavalent Chromium, Mercury, PBD, and PBDE and 100 PPM maximum content for Cadmium, unless covered under exemption in Annex I.

  10. Pb (Lead)-Free Termination Status [SMD]

  11. Pb (Lead)-Free Termination Status [SMD]

  12. T491/4/5 & T510 Standard and Low ESR Ta-MnO2 Chips

  13. 1000 18% Growth/yr. 100 Capacitance (µF) @ 10 V 10 1 1986 1991 1996 2001 Tantalum Technology Drivers A Case 3216-18 B Case 3528-21 C Case 6032-28 D Case 7343-31 Volumetric Efficiency Increases Driven By • Powder Charge (CV/g) • Formation Technology • Impregnation Technology • Skip Face-Down

  14. Construction Improvements Face Down Termination Standard Construction Push Volumetric Efficiency To Even Higher Levels

  15. T491/4 Standard Height Cases

  16. T491/4 Low-Profile Cases

  17. Industry Leaders! T495 & T510 • T495 • B105*035 E1K5 Released • C475*035 E450 Released • D336*025 E090 Released • X477*006 E030 Released • V337/010 E150 Date TBD • E337/010 E100 Released • T510 • E107*025 Released • X108*004 Released • X226*035 Released • E476*035 Released • X157*016 Released • E477*006 E055 Released • X477*010 E045 Date 7/06 • D157*016 E060 Date 7/06 • E227*016 E075 Date 6/06 • E107*020 Released • X107*020 E150 Date 9/06 • X106*050 Date4/06 • X227*016 Date4/06 • X107*020 Date TBD • X336*035 Date 4/06 • X476*035 Date 4/06

  18. Niobium Capacitor Development • Technology Implemented • Powders • Nitrogen/Oxygen Doped • Higher CV/g • New Impreg. Schedule • Part Types Produced • V Case Size 68uF/10V • D Case Size 150uF/6V, 220uF/6V • X Case Size 330uF/6V

  19. NbO KO Niobium can ignite! SSST test of NbO (Orange) vs KO (Gold) # 19

  20. T520/T525/T530 Organic Polymer Capacitors

  21. T520/530 Series KO-CAP Product Features • KEMET Organic Capacitor (KO-CAP) • Conductive Polymer Cathode • Replaces MnO2 • Reduces ESR • Non-ignition failure mode • Can be used up to 90% of Rated Voltage for part types </= 10V and up to 80% of Rated Voltage for part types >10V • Series Name/Sizes • T520 (Single Anode) • B, T, V, D, Y, and X Sizes • New A, C and W (1.5mm Max height) Cases! • Developing New U(6032-15) and L(6032-19) Cases! • T530 (MAT) • D, Y, X Sizes, New 4 mOhm part types! • T526 (Fail Open Polymer)Under Development!

  22. KO-CAP Technology Drivers ESR Volumetric Efficiency

  23. T520 – Small Case Size – Standard Height FY07 CV Extensions: ESR values (mOhms) listed in parenthesis TBD Dates:will align with Customer needs

  24. T520 – Large Case Size – Standard Height FY06 CV Extensions: ESR values (mOhms) listed in parenthesis TBD Dates:will align with Customer needs

  25. T520 – Low Profile FY07 CV Extensions: ESR values (mOhms) listed in parenthesis TBD Dates: will align with Customer needs

  26. T525 Series – High Temperature Polymer CY2006 – FY07 CV Extensions: ESR values (mOhms) listed in parenthesis

  27. T530 Multiple Anode KO-CAP T530D477M2R5 5, 6 & 10 mOhm T530D687M2R5 6 & 10 mOhm T530D337M004 5 & 6 mOhm T530D477M004 10 mOhm T530D227M006 5 & 6 mOhm T530D337M006 6 & 10 mOhm - New T530D157M010 5,6 & 10 mOhm T530D227M010 10 &6 mOhm T530D567M2R5 5 mOhm T530X157M016 40,25 &15 mOhm New! T530X337M010 5, 6 & 10 mOhm- T530X477M006 5, 6 & 10 mOhm T530X687M004 4, 5, 6 & 10 mOhm T530X108M2R5 6 mOhm T530X108M2R5 5 & 6 mOhm T530X158M2R5 5 mOhm T530Y687M2R5 5 & 6 mOhm T530Y108M2R5 5 mOhm – New! T530Y687M004 5 mOhm – New! T530Y477M006 5 mOhm – New! T530Y227M010 6 mOhm – New! Case Sizes - Size (mm) KEMET EIA Length Width Height ‘D’ Case 7343-31 7.3 ± 0.3 4.3 ± 0.3 2.8 ± 0.3 ‘Y’ Case 7343-40 7.3 ± 0.3 4.3 ± 0.3 4.0 max ‘X’ Case 7343-43 7.3 ± 0.3 4.3 ± 0.3 4.0 ± 0.3

  28. T530 Series – KO-MAT Development TBD = To Be Determined (customer interest will help set priority)

  29. KO-CAP Future Activities • Face Down Termination • 7343 Footprint: Low ESR/Low ESL – 9mOhm/< 0.8nH • 3528 Footprint (T case) – maximize CV • 1.0mm A and B case footprints: I case (3216-10), K case (3528-10) • Low Profile • <1.5 mm in large case and <1.0 mm in small case • Fail Open Devices

  30. A700 Aluminum-Polymer Chips

  31. AO-CAP--Aluminum Organic Capacitor • Extremely Low ESR • Non- Ignition Failure Mode • True Surface Mount Al Capacitor • Solid Counter-Electrode Material (No Dry Out Failure Mechanism as in Al Electrolytics) • Very Little Capacitance Loss at High Operating Frequencies • Competes with High Cap Ceramics on Performance and Cost Basis • Can be used at Rated Voltage, De-rating not required • 125°C capability • Lower DC Leakage values than Ta polymer

  32. AO-CAP Technology Drivers • Enhanced Electrical Performance • Lower ESR • V Case = 25 mOhm <= 9 mOhm • D Case = 15 mOhm <= 7 mOhm • Lower Leakage • Higher Voltage Ratings • 8, 10, 12.5,16, 25 V ratings • Increased Volumetric Efficiency • Higher Cap

  33. A700 Product Roadmap

  34. AO-CAP Future Activities • Continue with CV Extension, Downsizing, Low ESR • X540 µF/2V , D330 µF/2V, V220 µF/1.5V • D size <7 mOhm, V size <9 mOhm • Alternative Sizes • E-Size (7.3 x 6.0 x 3.9), 1812, 2225 • Lower Profile (1.5 mm, 1.0 mm) • Alternative Voltages • 20V, 35V • 1.5V • Low Inductance • Termination Modifications • Interdigitated AO-CAP Design

  35. T492 & T493 MIL-SPEC and MIL COTS Ta-MnO2 Chips

  36. New Series: T493: Military COTS What Is T493? • Surface Mount Ta Product with options: • Terminations • B Gold Plated (50 micro inch) • C Hot Solder Dipped (60 micro inch) • H Solder Plate (100 micro inch) • K Solder Fused (60 micro inch) • T 100% Matte Tin(160 micro inch) • Weibull Graded • B Failure Rate (0.1%/1000 hrs.) • C Failure Rate (0.01%/1000 hrs.) • Surge Current • None • 10 Cycles, +25°C • 10 Cycles, -55°C & +85°C • ESR • Standard • Low

  37. T493 – Military COTS Standard Height Cases

  38. T492 and New Military Series Expansion • T492 Expansion of 4V and 50V part types – CWR11 style • Surge current options – available now • Termination options – under qualification • Target Completion QPL Expansion Q2, 2007 • Expanded Military Offerings: CWR09/19/29 – New Case Sizes • New Series: T409 / T419 / T429 • Target Release April, 2006 4-25V part Types • Target Release Q2, 2006 35 & 50V part Types

  39. T497 High Grade COTS

  40. Tantalum T497 High Grade COTS Released Oct 31, 2005

  41. Tantalum T497 High Grade COTS • Target Markets: high end industrial power supplies, military designs, portable communication systems and other critical filtering and decoupling applications. • This product line offers many unique features. • New Case Sizes - correspond to Military sizes CWR09/19/29 • Small Footprint / Low Profile Available • Conservative Designs • Inherently Lower DC Leakage • Robust Performance - Capable of < 0.1%/1000 pc hrs Failure Rate • Stringent Electrical Screening: 100% Accelerated Steady State Aging 100% Thermal Shock 100% Surge Current Options Available Weibull Grading Options Available 100% X-ray Option Available • RoHS Compliant Available • Meets 260C Reflow / 3 Passes

  42. T498 / T499 150°C / 175°C Rated Ta-MnO2 Chips

  43. New Series: T498/T499 150°C & 175°C Tantalum What Is T498? • Rated for use at -55°C to 150°C What Is T499? • Rated for use at -55°C to 175°C Both: • Automotive / Harsh Environments • Standard Ta/MnO2 Construction • Lead (Pb) free leadframe Available • RoHS Compliant Available

  44. T498 150C Ta Features • 5 EIA Standard Case Sizes • Temperature De-rating: 2/3 at 150° C • Voltage Ratings: 6 - 50VDC • Capacitance Range: 0.47 - 220mF • Three Termination Options • 100% Matte Sn (Standard) • 90/10 SnPb Solder • Au Plating • 100% Accelerated Steady State Aging • 100% Surge Current Tested • Thermal Shock: -65° C to 175° C • Reliability: 0.5%/1000 hr @ Rated Voltage @ Rated Temperature

  45. T498: 150°C Tantalum Standard Height Cases

  46. T498 Temp / Voltage Derating Guidelines AVX: 25%! Epcos:25%!

  47. T499: 175°C Tantalum Standard Height Cases

  48. T499 Application-Temperature-Voltage Derating -55°C through +85°C Application = 50% Nameplate Voltage @+175°C T499 Application = 25% Nameplate @+125°C Std.Ta Application = 33% Nameplate T499 Application = 39% Nameplate

  49. T499 Power Derating(Assuming Power @+20°C Rise) -55°C through +155°C Power = 25°C Power Rating (T499) Std.Ta Power Reduction from 100% (+20°C) @+105°C to 10%(+2°C) at +125°C T499 Power Reduction from 100% (+20°C) @+155°C to 10%(+2°C) at +175°C

  50. AUTO Series Announced AUTO Series October 18th, 2004 Key Facts • KEMET provides ceramic and tantalum automotive grade product • KEMET supports the automotive market via Direct Sales, Distribution and EMS channels • KEMET has been an automotive supplier for 30+ years

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