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1 st class restricted or banned material

1 st class restricted or banned material. 2 nd class restricted or banned material (Suggest). ROHS COMPLIANCE DECLARATION.

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1 st class restricted or banned material

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  1. 1st class restricted or banned material

  2. 2nd class restricted or banned material (Suggest)

  3. ROHS COMPLIANCE DECLARATION • ROHS directive requires that from 1 July 2006 new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE). • Allowed exemptions are Lead in glass of electronic components. • Lead as an alloying element in steel containing up to 0,35 % lead by weight,aluminum containing up to 0,4 % lead by weight and as a copper alloy containing up to 4 % lead by weight. • Lead in high melting temperature type solders (i.e. tin-lead solder alloys containing more than 85 % lead), • Lead in electronic ceramic parts (e.g. piezoelectronic devices).

  4. Darfon Green Plan Improvement Schedule • Darfon MLCC/MLCI chips without contained the 1st class restricted or banned materials. • Darfon MLCC/MLCI chips termination started to apply Lead free plating process from 1998 and met the requirement of Lead free plan. • Darfon MLCC/NPO chips still contained Lead material due to NPO chips used low temperature sintering powder. But the content of Lead in dielectric powder is acceptable in Sony standard SS-00259 (ver.2.0). • Darfon MLCC/NPO chips will evaluate the Lead free powder with vendor and plan to change before the Q2 of 2004.

  5. Darfon MLCC Inspection Report • Attched files are the inspection report of Darfon chips by SGS. The inspection items included Pb, Cd, Hg. NPO Series X7R Series Y5V Series

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