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DC-DC converter R&D US ATLAS Upgrade. UCSC May 2007. Credits. FY07: P. Denes, R. P. Ely, M. Garcia-Sciveres, M. Gilchriese, J. Alonso. FY08: ~same. Progress in FY07. Irradiation of FY06 test chip at LBNL 88” cyclotron Design and submission of new realistic size test chip
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DC-DC converter R&D US ATLAS Upgrade UCSC May 2007 DC-DC --- US ATLAS Upgrade R&D --- Garcia-Sciveres
Credits • FY07: P. Denes, R. P. Ely, M. Garcia-Sciveres, M. Gilchriese, J. Alonso. • FY08: ~same. DC-DC --- US ATLAS Upgrade R&D --- Garcia-Sciveres
Progress in FY07 • Irradiation of FY06 test chip at LBNL 88” cyclotron • Design and submission of new realistic size test chip • Multi-project run submission in Feb. • Chips have been already received April 17, 2007. • Initial basic testing with probes in progress • PCB test board in fabrication • If test boards results as expected, produce strip stave compatible power card that can be used in place of serial power adapter. DC-DC --- US ATLAS Upgrade R&D --- Garcia-Sciveres
Top level schematic Charge to gate drivers Clock inputs (same freq. with varying delays) 1mF pump capacitors These components could be internal eventually Load DC-DC --- US ATLAS Upgrade R&D --- Garcia-Sciveres
Simulation results 1 Charge lost in switch parasitics Dominated by switch resistance DC-DC --- US ATLAS Upgrade R&D --- Garcia-Sciveres
Simulation results 2 Startup circuit 1MHz, 1mF pump caps DC-DC --- US ATLAS Upgrade R&D --- Garcia-Sciveres
Plans for FY08 • Collaborate with CERN for testing and irradiation of FY07 test chip • In 2006/7 CERN has started an aggressive DC-DC R&D program already funded at the 1.5 FTE level • >$300K additional Europe-only funding for DC-DC is being sought by CERN in the form of an FP7_CNI proposal to be submitted in May 07. • CERN IC group now working on a switching chip for an inductive converter along similar lines as the LBNL DC-DC work (with a different foundry) • They Plan to explore piezo-electric converter options as well and establish a test program to compare all 3 approaches (inductive, capacitive, & piezo). • They have X-ray irradiation equipment for total ionizing dose characterization. • Work on design and submit next version of switched capacitor DC-DC chip • Aim of this next chip would be miniaturization for production of a stand-alone device. • Main challenges of miniaturization • Reduction of external components • Control circuitry to internally produce required switching signals DC-DC --- US ATLAS Upgrade R&D --- Garcia-Sciveres
FY09 • Depends on success of FY08 effort • To be conservative assume a new chip iteration • An important possibility if FY07 and F708 chips are successful is to shift to improving radiation hardness, which may require migrating working design to a different switch technology • Complete miniaturization work by producing a ceramic hybrid to achieve the smallest possible package • Produce parts that can be used like “off the shelf” components DC-DC --- US ATLAS Upgrade R&D --- Garcia-Sciveres
DC-DC Cost breakdown FY08-09 DC-DC --- US ATLAS Upgrade R&D --- Garcia-Sciveres