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Design and Testing of MEMS Sensor Encapsulation for Projectile Applications

The Embedded MEMS Sensor Projectile (EMSP) project at Lockheed Martin focuses on creating an encapsulation technique for a MEMS chemiresistor within a polymeric adhesive material. This sensor will be deployed from a CO2-powered firearm and is designed for Homeland Security applications. The encapsulation must withstand various environmental conditions including impact force, wind speed, temperature, and humidity. The project includes designing a prototype and a firing mechanism, followed by rigorous testing to assess the robustness of the final design.

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Design and Testing of MEMS Sensor Encapsulation for Projectile Applications

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  1. Project #3 Embedded MEMS Sensor Projectile (EMSP) Lockheed Martin Missiles & Fire Control – Orlando, FL Coach: Loc Vu-Quoc, Mechanical and Aerospace Engineering Key Objectives • Design encapsulation for MEMS sensor in EMSP polymeric material. • Identify conditions (force of impact, wind speed, temperature, humidity, length of travel) to which encapsulated system will be exposed. • Construct prototype design, and firing mechanism. Conduct tests to determine robustness of design. Disciplines (desired skills) 2 ME, 2 MSE or CHE, 1 EE, 1 ISE Description: Design encapsulation technique for MEMS (Micro-electro-mechanical system) chemiresistor within adhesive polymeric material to be fired out of a CO2 powered firearm. For use in Homeland Security, the EMSP sticks to a target’s surface providing intimate contact, thus allowing MEMS sensors to provide remote detection of the presence of potentially harmful agents (explosive,...).

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