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Report From Berkeley

Report From Berkeley. March 9, 2012 Carl Haber. Outline. Progress on shield-less stavelet Measurements of co-cured thermo-mech stave LOI backup document New HSIO boards Plans for SLAC AUW. Shield-less Stavelet. Idea is to co-cure cable with no Al shield inside a 0-90-0 facing

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Report From Berkeley

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  1. Report From Berkeley March 9, 2012 Carl Haber

  2. Outline • Progress on shield-less stavelet • Measurements of co-cured thermo-mech stave • LOI backup document • New HSIO boards • Plans for SLAC AUW

  3. Shield-less Stavelet • Idea is to co-cure cable with no Al shield inside a 0-90-0 facing • Assemble core from these facings at BNL/Yale • One side will be serial powered • One side will be DC-DC • Electrical issue from Oxford meeting: no Al to use as a local ground reference between hybrids within a module

  4. Added large copper ground references on one side. Will these suffice? • Added pads for discrete inductors on serial links • Issue also of inductive current return • 3 week fabrication cycle expected

  5. DC-DC side shield • Unlike 1st DC-DC stave, this will use a BNL/Yale core and therefore the converter support must mate with the cylindrical closeout power Al block

  6. Assembly and Components • 3 modules built and in test (Sergio) • New assembly tools are in design, to place modules on this stavelet - these will be conceptually simple “static” fixtures for “good enough” positioning. • Cable to be fabricated • Co-cure at LBNL as before

  7. Results on Co-Cure TM Stave • Two co-cured 0-90-0 facings, laminated at BNL/Yale • Length changes between co-cure and lamination – minimal • Thickness – see slide • Flatness – measured on CMM, results are inconsistent and need to be repeated, stave is now in BNL and will next be measured there • We see bowing of 0.3-0.5 mm but the data don’t make sense front to back

  8. Stave Thickness Mainly parallel with a bulge seen at the far right end Maximum variance is 0.1900 to 0.1955 inches (~125 microns) Should have measured the co-cured facings first

  9. Difference in length, microns per 98 mm segment, before/after lamination

  10. R&D Backup Document • Stave Core Fabrication: Tim Jones and David Lynn • Petal Core Fabrication: Carlos Lacasta • Mechanical Bus Co-Cure: Georg Viehhauser and Carl Haber • Supermodule Mechanics: Frank Cadoux DECLINED • P-type Sensor Development: NobuUnno, HartmutSadrozinski • Cooling Studies: Georg Viehhauser • Development of the ABC-next 130 nm Chip: Francis Anghinolfi • Development of the Hybrid Controller Chip: Mitch Newcomer DONE • Development of the SPP Serial Powering Chip: Mitch Newcomer • Development of the DC-DC Conversion ASIC and PCB Package: Georges Blanchot • Hybrid: Ashley Greenall • Module: Tony Affolder • Stavelet Test Program: Peter Phillips • Petal Electrical Program: Ingrid Gregor • Supermodule Electrical Test Program: Didier Ferrere DECLINED • Digital Data Transmission on the Stave and the BCC Chip: Carl Haber DONE • Power Protection and Serial Powering: David Lynn and Mitch Newcomer DONE • Cabling and Services Survey and Analysis: Sergio Diez Cornell • Hybrid Assembly Process: Ashley Greenall • Module Assembly Process: Tony Affolder • Stave Mounting Process: Martin Gibson DONE • Low Mass Tape Development: Tony Weidberg DONE • HSIO Data Acquisition System: David Nelson and Carl Haber • Alignment R&D: Richard Nickerson • Level-1 Track Trigger R&D ROI based: NEED Author • Level-1 Track Trigger R&D Self Seeded: Maurice Garcia-Sciveres

  11. New HSIO • A number of new HSIO and interface boards are under test at SLAC and LBNL • Thanks to Dave Nelson and Sergio Diez-Cornell • Need an accounting of who and where these go please.

  12. SLAC AUW: 3.5 h on Tue 27-Mar PM • Red would be suggested for combined electrical/mechanical “stave” session, black for modules, but still need to hear from other groups (mechanical, petals,…) • Time for ~10, 20min talks • List from Tony • 250 nm stave module + program plans for staves, new DC-DC converter • 130 nm hybrid/module plans • Irradiation at b’ham-10 min • B180 infrastructure • B180 DC-DC stavelet status • SP stavelet update • 250 nm petalet • 130 nm EOS • 130 nm bus cables • Report back from ASIC CDR w/open questions • Plans for powering 130 nm • Within module • SPP and DC-DC converters • 130 nm bonding trials • LOI backup document status in both sessions • List from Didier • KEK module production status (Nobu) • Super-module with multi-module readout - Status and plan (Yosuke or Allan) • Proposal for future design with ABCN130 - focus on service bus and hybrid (Allan)

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