1 / 18

Activities in the Electronics Group « GrElec »

Activities in the Electronics Group « GrElec ». GrElec in 2012. 3+1 Electronics Engineers Daniel La Marra Stéphane Débieux Yannick Favre Alessandro La Rosa IBL 2 Technical Assistants Gabriel Pelleriti Javier Mesa. Projects Highlight. ATLAS (LHC) IBL (upgrade phase0 2013-2014)

freya
Télécharger la présentation

Activities in the Electronics Group « GrElec »

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Activities in theElectronics Group« GrElec »

  2. GrElec in 2012 • 3+1 ElectronicsEngineers • Daniel La Marra • Stéphane Débieux • Yannick Favre • Alessandro La Rosa • IBL • 2 Technical Assistants • Gabriel Pelleriti • Javier Mesa 2012 ElectronicHighlights

  3. Projects Highlight • ATLAS (LHC) • IBL (upgrade phase0 2013-2014) • ABCn130 (upgrade phase2 2022) • Neutrinos • MICE (production) • Astrophysique • LOFT • POLAR 2012 Electronic Highlights

  4. IBL : Local support - stave 2012 Electronic Highlights

  5. IBL :Dressed module withflex 2012 Electronic Highlights

  6. IBL - Loadingprocedure 2012 Electronic Highlights

  7. IBL : Test bench for PCB/Flex Saver production • Purpose : Full production test : ~80 PCB savers, 500 Flex savers • Details : • 320 signals / PCB saver : automatic test for short & open circuit on each signal • FPGA firmware development for signals stimulus & PC communication (Yannick) • PC software development for checking & reporting (Yannick) • Test execution (Gaby) PCB saver Flexsavers Xilinx Stimulus Board PC interface Saverunder test Checked OK for ID=1 2012 Electronic Highlights HW interface

  8. IBL : IST & beam pipe EMI qualification • Purpose : Screening qualification against ElectroMagnetic Interference • Measurement : Transfer impedance + Screening attenuation vs frequency : • Tube under test inserted into a copper tube for environment insensitivity • IBL Support Tube (IST) qualification (carbon fiber + Ag glue + end rings) • Beam pipe shielding methods investigation & qualification • Hardware : Vector Network Analyzer [100KHz-4GHz] Tubes under test IST Beam Pipe VNA Bad shielding Copper tube enclosure 2012 Electronic Highlights Good shielding

  9. ABCn-130 :Main improvements 2012 2012 Electronic Highlights

  10. ABCn-130 : Layout (not final) Submission Scenarios • Independent of HCC • Regular MOSIS MPW on 4th February 2013 (reachable for ABC130, not for HCC) • Shared Engineering run with the NA62/TDCpixsubmission (forecast 1Q 2013, may be very close to the MOSIS MPW date, but with some flex.) • With HCC : • Engineering Run, attached to HCC schedule Preferred scenario Chip size7900 um x 6700 um 2012 Electronic Highlights

  11. DBB : Digitizer & Buffer Board • Context : • MICE experiment (RAL/UK) • Electron Muon Ranger detector (EMR) • Part of a collaborative team with the Front End Board • Board & FPGA design + test : StéphaneDébieux Mice experiment EMR 2012 Electronic Highlights

  12. DBB : Overview DIP switch for Board ID AlteraStratixII FPGA Power Supply : 3 DC/DC Connector for FPGA programming 2 Gigabit transceivers LVDS Connections to FEB DAQ SMA Connectors Connectors for DBBs daisy-chain 2012 Electronic Highlights

  13. DBB : Current status • Further tests in the lab qualified the DBB for production • 54 boards to be produced identically to the first 6 prototypes • 2 to 3 months delay expected for the production, delivery in March/April 2013 2012 Electronic Highlights

  14. LOFT : Large Observatory For x-ray Timing • Context : • Matter in neutrons Stars & close to black hole event horizon • ESA program, launch 2020-22 • Wide Field Monitor : high resolution • Large Area Detector : 10m² of detector 2-30keV : • 6 panels • 7x3 modules/panel • 4x4 Front End Electonics/modules => 2016 FEE overall : DPNC/ISDC design responsibility Panel • FEE : • ~130x70mm • Very low noise • Silicon Drift Detector technology (used in ALICE) • 14 ASICs per FEE, 16 channels/ASIC • Chip On Board technology, very small pads (39µ) • Bonding: ASIC to SDD (17µ),Through PCB Bonds, ASIC to PCB • PCB: Flex-Rigid technology Module Back End Electronics FEE 2012 Electronic Highlights SDD (bottom)

  15. LOFT : Large Observatory For x-ray Timing • FEE Prototype 2012 : • Large PCB for measurements access, Small SDDetector Proto, EMC & HV constraints • Components: 4 ASICs, linear regulators, digital interfaces, HV/MV filters • Labview interface • Board Design Schematics + Layout: Yannick • Components & ASIC mounting/bonding: Gaby, Maarten • Tests : in progress at BOLOGNA 75um PCB trace width Trough PCB hole for bonding ASIC SDD location 39um square pads 2012 Electronic Highlights

  16. POLAR : An instrument to measureGamma Ray Burstspolarization • 2 layers flex with stiffener: • Design made by PSI • Schematics and Layout was imported into our Cadence tools • Modification with close relationship with the mechanics group • Added a rigid part (stiffener) • Length changed 2012 Electronic Highlights

  17. POLAR : An instrument to measureGamma Ray Burstspolarization • News in this design: • Very small via between 2 layers • Hole: 0.09mm • Pad: 0.15mm 2012 Electronic Highlights

  18. This year was going on with some works initiated last year or even before: IBL ABCn130 MICE There was also new works for several different projects like: LOFT POLAR But we also started some studies for new projects like: NA61 (neutrinos) DAMPE (astrophysics) JEM-EUSO (astrophysics) Conclusion 2012 Electronic Highlights

More Related