1 / 16

Congrès du regroupement de l’industrie électronique RIE Le virage au sans-plomb Bienvenue - Welcome

Congrès du regroupement de l’industrie électronique RIE Le virage au sans-plomb Bienvenue - Welcome. Les impacts de la technologie sans-plomb sur la fabrication des cartes par Serge St-Martin.

fruma
Télécharger la présentation

Congrès du regroupement de l’industrie électronique RIE Le virage au sans-plomb Bienvenue - Welcome

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Congrès du regroupement de l’industrie électroniqueRIELe virage au sans-plombBienvenue - Welcome Les impacts de la technologie sans-plomb sur la fabrication des cartes par Serge St-Martin Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  2. Impact de la réglementation du sans plomb pour les fabricants de circuits imprimés qui prendra effet en juillet 2006 The impact of lead-free soldering on the printed circuit board fabricators starting July 2006 Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  3. Industry Response to Lead-Free Transition HDP User Group Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  4. Participants to the Lead-Free Transition Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  5. Lead-Free Regulations • The European Union Directive (WEEE)* on the Restriction of Hazardous Substances (RoHS) • Lead • Cadmium • Mercury • Hexavalent Chromium • Polybrominated biphenyls (PBB) • Polybrominated biphenyl ethers (PBDE) • * Waste Electrical & Electronic Equipment • In red, related to PCB fabrication Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  6. Lead-Free Definition • The quantity of lead contained in the prescribed parts for lead-free adoption should be: • Less than 0.1W % (European) Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  7. Electronic Industry Requirements • Higher soldering temperature for lead-free (up to 245oC) • Multiple reflow (SM1 / SM2 / THC / Repair) • Higher laminate Tg (180oC minimum) • Halide-free laminate • Lower ``Dk`` for high speed components • Increase number of embedded components (resistors, capacitors, coils, flip-chips) • Competitive cost Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  8. Lead-Free Ass’y Temperature Variation Sn63/Pb37=$2.94/US/lb Sn95.5/Ag3.8/Cu0.7=$7.67/US/lb HDP User Group Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  9. Industry Segments affected by the Lead-Free transition Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  10. PCB Material Challenges(bromine-free & higher Tg) • Copper clad laminate • Resin coated foil • Soldermask • HAAL (hot air/N alloy leveler) • Legend ink • Conductive polymer • Plug Via Material • Fluxes Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  11. Laminate Materials Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  12. PCB MANUFACTURING HIGHLIGHT FLOW CHART LF IMPACT Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  13. PCB Surface Finishes • OSP • Electroless tin • Electroless silver • HAAL (Sn / Ag / Cu) • Electroless nickel-gold • Electroplated nickel-gold AR = 16.6 / 1 Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  14. Nickel-Gold Finish Seal surface or full conductors with nickel-gold Nickel / Gold / Slivers Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  15. LEAD-FREE SOLDERING IMPACT ON THE PCB FABRICATION PROCESSES¨CONCLUSIONS¨ • AS WE CAN REALIZE, MORE THAN 50% OF THE PCB FABRICATION PROCESSES ARE AFFECTED AT DIFFRENT LEVEL • ALL MAJOR MATERIALS SUCH AS: LAMINATE & PREPREGS, SOLDERMASK, LEGEND INK, CONDUCTIVE POLYMER SHOULD BE RE-EVALUATED FOR THEIR RESPECTIVE ABILITY TO SUPPORT THE 25`C TEMPERATURE INCREASE FOR LEAD-FREE SOLDERABILITY WITHOUT DEGRADATION….REJECTS. • WITH ONLY 19 MONTHS TO GO BEFORE JULY 2006, AN AGRESSIVE LEAD-FREE PLAN OF ACTION SHOULD BE PUT IN PLACE IMMEDIATELY WITH DEDICATED HUMAIN RESSOURCES AND FINANCIAL BUDGET TO MEET THE DEADLINE AND SUPPORT THE CUSTOMERS. • ALSO WE HAVE TO BECOME A ``GREEN PARTNER`` WHICH IS THE ELIMINATION OF HALLOGEN / ``BROMINE`` IN LAMINATE / PREPREGS, SOLDERMASK, CONDUCTIVE POLYMER, FLUXES AND CLEANING SOLUTIONS. SO, WHY NOT MERGE ALL THOSE NEW REQUIREMENTS IN ONE MAJOR PROGRAM WITH THE NECESSARY VISIBILITY AND AUTHORITY TO TAKE ACTION. • GET NEW APPROVAL FROM ``UL`` AND CUSTOMERS FOR ALL NEW MATERIALS AND REVISED FABRICATION PROCESSES. Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

  16. REGROUPEMENT DE L’INDUSTRIE ÉLECTRONIQUERIE THANK YOU FOR YOUR ATTENTION MERCI DE VOTRE ATTENTION QUESTION(S)!!! Groupe Conseil St-Martin / Fontaine www.geocities.com/groupe_stmf

More Related