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Comprehensive Guide to Product Testing in IC Development

This document outlines the rigorous process of product testing in Integrated Circuit (IC) development at Micrel Inc. Key phases such as correlation, characterization, wafer sort, and final testing are detailed. Engineers are responsible for ensuring the product adheres to specifications established in datasheets, including absolute maximum ratings and operating conditions. The guide also emphasizes the importance of accurate measurement methods using specialized equipment like oscilloscopes, digital multimeters, and parametric analyzers. The characterization process aims to uncover device capabilities, limitations, and performance across varying temperatures.

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Comprehensive Guide to Product Testing in IC Development

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  1. Andy Cheung New Product Development Engineer Micrel Inc. November 26, 2003

  2. Product Design Cycle Product

  3. Datasheet Specification Example

  4. Absolute Maximum Ratings

  5. Operating Ratings

  6. Testing IC’s • Correlation • Characterization • Wafer Sort • Final Test

  7. Correlation • Test Matrix by design • All tests listed • Typically follows datasheet • Tests implemented on automatic tester • Responsibility of test engineer • TMT, Eagle Test Systems

  8. Test Matrix-LDO

  9. Handler

  10. Handler

  11. Test Floor

  12. Correlation • Bench • Confirm all TMT data • Learn Device • Find problems • Accurate measurements • Equipment • Method

  13. Typical Equipment Setup • Oscilloscope with Probes • Pair of DC Power Supplies • 0-25V • 0-4A • Pair of Digital Multi Meters • Test Board • Solder Station • Parametric Analyzer • Source Meter • Current Probe • Freeze Spray and Heat gun

  14. Bench Setup

  15. Correlation -Test Board

  16. Dropout Voltage & Ground Current Measurement • DC Errors • Ground wire length • 100mOhm*500mA = 50 μV • Introduces losses in current measurements • Need voltage accuracy to 1 or 2 μV • 4 wire sense • Kelvin contacts

  17. Dropout Voltage & Ground Current Measurement + - V I Sense Node (Kelvin Contact) Normal Wire LDO Vin Ammeter Ground

  18. Correlation Worksheet

  19. Characterization • Characterization is Done to: • Find the Device’s Capabilities and Limitations • Performance over Temperature • Find Randomness • Results: • Single Insertion Test Limits • Specification Change • Determine Problems

  20. Characterization • Parts typically follow a normal (gaussian) distribution. • Test parts at all possible operating conditions per specification parameters. • Typically done on handlers to simulate production environment. • Most stringent testing.

  21. Datasheet Review • Device Realized? • Changes? • Deletions? • Yield Improvements? • Problems?

  22. SIT Limits • Use characterization data to ensure device operation over temperature. • Guardbands • Temperature • Tester

  23. Wafer Sort • Tightest Limits • Wafer Trim • Bandgap • Frequency • Wafer Probe Station for Bench Testing • Gate Stress Pads • Ensure Test is Correct

  24. Wafer Probe Station

  25. Final Test • Guarantee parts operated as written on datasheet. • Uses SIT limits generated from characterization.

  26. HAPPY THANKSGIVING!!! • Major Test Checkpoints • Correlation • Characterization • Wafer Sort • Final Test • Questions?

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