1 / 9

Candidacy Diagrams

Candidacy Diagrams. Capacitor Uses. Power. Load Circuit. Decoupling. Ground. Precision. Bypass. AC Signal. Capacitor Applications. Commercially Available Composites. CWFC fabrication. Ferroelectric Growth on LiF. Au Metallization of Ferroelectric.

hieu
Télécharger la présentation

Candidacy Diagrams

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Candidacy Diagrams

  2. Capacitor Uses Power Load Circuit Decoupling Ground Precision Bypass AC Signal

  3. Capacitor Applications

  4. Commercially Available Composites

  5. CWFC fabrication Ferroelectric Growth on LiF Au Metallization of Ferroelectric Fabrication and Au Metallization of Target Cold Welding of Au Surfaces Dissolving of LiF Metallization for Top Electrode

  6. Multilayer Capacitor Pad Pad Feroelectric

  7. CWFC on Reverse of chip Ferroelectric Growth on LiF Fabrication of Device on Top Si Surface Au Metallization of Ferroelectric Au Metallization Si Bottom Surface Cold Welding of Au Surfaces Dissolving of LiF Metallization for Top Electrode Creation of Through Wafer Vias Dicing of wafer Wire Bonding and Packaging

  8. FeRAM Ferroelectric Growth on LiF Fabrication of Driving Circuitry Au Metallization of Ferroelectric Patterning and Au Metallization of Si Cold Welding of Au Surfaces Dissolving of LiF Patterning and Etching (RIE) Patterning and Metallization of Top Electrodes Dicing of wafer Wire Bonding and Packaging

  9. CWFC on Pin Ferroelectric Growth on LiF Au Metallization of Ferroelectric Au Metallization Pin Cold Welding of Au Surfaces Dissolving of LiF Patterning and Etching (RIE) Patterning and Metallization of Top Electrodes Dicing of wafer Wire Bonding and Packaging

More Related