1. AOI(Automatic Optical Inspection ) Presented by: 傅楸善 & 何育哲 0937960615 r94922131@ntu.edu.tw 指導教授: 傅楸善 博士 Digital Camera and Computer Vision Laboratory Department of Computer Science and Information Engineering National Taiwan University, Taipei, Taiwan, R.O.C.

2. 歐壹科技 (EeVision) DC & CV Lab. NTU CSIE

3. Company Mission • Improve Customers' Quality and Competitiveness through Image Processing Technology DC & CV Lab. NTU CSIE

4. Company Mission • 以人工智慧(AI) • 做製程前、中、後100%的檢查(Inspection) • 做1D/2D/3D之搜索、定位及調整(Searching , Positioning and Alignment) DC & CV Lab. NTU CSIE

5. Management Principle • 以誠為本，尊重個人，強調團隊合作，創造良好的工作環境及多贏的局面 DC & CV Lab. NTU CSIE

6. Major Products • CD (Compact Disc)碟片印刷品質檢測系統—線上及線外 • CD碟片身份辨識系統及裂片、濺料檢查 • CD碟片數片機 • 光碟片即時生產資訊整合系統 • 運用視準儀(Auto-Collimator)及影像處理技術之光碟機調整系統 • 陶瓷套筒(Ferrule)偏心量(CFE)及內徑之量測 • 干涉儀(Interferometer)光纖跳接線接頭品質之檢測 • 其他以影像處理為基礎之自動化檢測及調整系統 DC & CV Lab. NTU CSIE

7. Major Achievement • 使用分光鏡及兩組以上不同特性CCD (Charge-Coupled Device)攝影機之取像裝置 • 提高待檢物件之取像品質；藉由了解各種欲檢測之項目或特徵，而使用不同特性之CCD攝影機予以讀取之 • 檢測圓形物件之照明裝置 • 僅使用一組可自動調整亮度之環形光源即達成對物件表面之多種照明模式，使欲檢測之項目或特徵更為明顯 DC & CV Lab. NTU CSIE

8. Major Achievement • 光碟片裂片檢查裝置－專利申請中 • 運用特殊之光源裝置，使光碟片中心孔處之裂紋由高解析度CCD偵出 • 可裝在CD-R (Compact Disc-Recordable )前段製程中印刷機處分檢機上 • 光源亮度自動調整、光碟片由機械手抓住下也能偵測 • 以自行開發之軟體程式，使待測物件之照明裝置的亮度自動調整至最佳取像品質 • 陶瓷套筒之夾治具及光源：偏心量之量測值重現性在0.08um之內 DC & CV Lab. NTU CSIE

9. EVLEDC • LED Dice Counter System DC & CV Lab. NTU CSIE

10. Function • This system can correctly count the amount of LED (Light Emitting Diode) chips in the inspection area • It can improve the exact amount of LED CHIP shipment for LED makers DC & CV Lab. NTU CSIE

11. Major Features • Suitable for counting diverse LED dice without changing the light source • Suitable for counting the LED with bounding-pad (transparent) and without bounding-pad (un-transparent) • Use high-resolution camera with top light to snap the image (Back lighting module can be selected depending on products) DC & CV Lab. NTU CSIE

12. Major Features • Countable LED dice arrangement • Dice which are already sawed and expended, but do not attach to a wafer ring • Dice which are already sawed, expended, and adhered to the paper • Dice which are sorted by chip sorter and adhere to the paper DC & CV Lab. NTU CSIE

13. Major Features • If dice are already adhered to the blue tape, it doesn't need to remove the blue tape when counting. It can prevent the damages caused by the re-attached process, such as decrease of dice number, deviation of dice position, static and so on. • As long as the product is within the detection area, it can be counted with no limitations in angles or positions. DC & CV Lab. NTU CSIE

14. Major Features • Set up individual parameters to detect different products. It only needs a simple "click" to change the parameters. • The brightness of light source can be set depending on products and becomes product's parameter. DC & CV Lab. NTU CSIE

15. Major Features • Bilingual user interface (Chinese/English) which can be switched on-line • Input / Output the counting record in a customized format or upload the data to databases by connecting the server (Depend on need) DC & CV Lab. NTU CSIE

16. Appearance and Basic Specifications • Machine size: 450mmW * 450mmL * 500mmH • Inspection system: P4 3G Hz processor (or above), 15 • Power supply: single phase 110/220 (selected) • Field of View: 140mm * 140mm • Detection area: 120mm * 120mm • Counting precision: within ±0.1% • Smallest pitch: 0.1mm (4 mil) • Detectable dice size: 0.3 mm to 1.0mm (with bounding-pad)0.5 mm to 10.0mm (without bounding-pad ) • Light source: white LED top lighting module (standard)CCFL back lighting module(selected) DC & CV Lab. NTU CSIE

17. Appearance and Basic Specifications DC & CV Lab. NTU CSIE