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Algorithms for VLSI Design Automation

Algorithms for VLSI Design Automation. Instructor D. Zhou zhoud@utdallas.edu Phone: 972 883 4392 Office: ECN 4.610. Outline . History and the road map Traditional design flow Physical design fundamentals Performance issues System on chip. History and the road map. The history of IC

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Algorithms for VLSI Design Automation

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  1. Algorithms for VLSI Design Automation Instructor D. Zhou zhoud@utdallas.eduPhone: 972 883 4392Office: ECN 4.610

  2. Outline • History and the road map • Traditional design flow • Physical design fundamentals • Performance issues • System on chip Dragon Star Shot Course

  3. History and the road map • The history of IC • The invention of transistor • The invention of integrated circuit • IC has changed our life • Moore’s Law • IC performance and complexity have been doubled in every two years • Road Map Dragon Star Shot Course

  4. The invention of transistor • John Bardeen, Walter Brattain & Wiliam Shockley in vented “The first transistor” in 1947. Dragon Star Shot Course

  5. The invention of integrated circuit • Jack Kilby & Robert Noyce inveted “The Integrated Circuit” in 1958. Dragon Star Shot Course

  6. Moore’s Law • In 1965, Gordon Moore predicted that the number of transistors that can be integrated on a die would double every 18 to 14 months (i.e., grow exponentially with time). • Amazingly visionary – million transistor/chip barrier was crossed in the 1980’s. • 2300 transistors, 1 MHz clock (Intel 4004) - 1971 • 16 Million transistors (Ultra Sparc III) • 42 Million, 2 GHz clock (Intel P4) - 2001 • 140 Million transistor (HP PA-8500)

  7. Intel 4004 Microprocessor

  8. Intel Pentium (IV) Microprocessor

  9. 1000 2X growth in 1.96 years! 100 10 P6 Pentium® proc 486 1 Transistors (MT) 386 0.1 286 8086 8085 0.01 8080 8008 4004 0.001 1970 1980 1990 2000 2010 Year Moore’s Law in Microprocessors Transistors on lead microprocessors double every 2 years Courtesy, Intel

  10. human memory human DNA book encyclopedia 2 hrs CD audio 30 sec HDTV page Evolution in DRAM Chip Capacity 4X growth every 3 years! 0.07 m 0.1 m 0.13 m 0.18-0.25 m 0.35-0.4 m 0.5-0.6 m 0.7-0.8 m 1.0-1.2 m 1.6-2.4 m

  11. 100 P6 Pentium ® proc 486 10 Die size (mm) 386 286 8080 8086 ~7% growth per year 8085 8008 ~2X growth in 10 years 4004 1 1970 1980 1990 2000 2010 Year Die Size Growth Die size grows by 14% to satisfy Moore’s Law Courtesy, Intel

  12. Clock Frequency Lead microprocessors frequency doubles every 2 years 10000 2X every 2 years 1000 P6 100 Pentium ® proc 486 Frequency (Mhz) 386 10 8085 286 8086 8080 1 8008 4004 0.1 1970 1980 1990 2000 2010 Year Courtesy, Intel

  13. Power Dissipation Lead Microprocessors power continues to increase 100 P6 Pentium ® proc 10 486 286 8086 Power (Watts) 386 8085 1 8080 8008 4004 0.1 1971 1974 1978 1985 1992 2000 Year Power delivery and dissipation will be prohibitive Courtesy, Intel

  14. 10000 1000 Rocket Nozzle 100 Nuclear Power Density (W/cm2) Reactor 8086 10 4004 P6 Hot Plate 8008 Pentium® proc 8085 386 286 486 8080 1 1970 1980 1990 2000 2010 Year Power Density Power density too high to keep junctions at low temp Courtesy, Intel

  15. Technology Trend International Technology Roadmap for Semiconductors (ITRS)

  16. Traditional design flow • Traditional design flow (see slides design-flow) • What has not been addressed in depth • Understand application • Architecture synthesis • Verification is not complete Dragon Star Shot Course

  17. Dragon Star Shot Course

  18. Performance issues • Speed • Noise • Clock distribution • Power distribution • Low power Dragon Star Shot Course

  19. SOC • A low cost solution • Challenges • Modeling • Simulation • Mixed signal • Different processing • Timing Dragon Star Shot Course

  20. Agenda • Dealing with technology • Masks • Front-end manufacturing • Back-end manufacturing • Application requirements • Putting it all together Dragon Star Shot Course

  21. Agenda • Dealing with technology • Masks • Front-end manufacturing • Back-end manufacturing • Application requirements • Putting it all together Dragon Star Shot Course

  22. Mask Data Design Semiconductor Process Flow Masks $2.8B EDA $3.6B Systems $1050B • Manufacturing $2.3B • Tools $0.5B • Computers • Communications • Consumer • Industrial, Military… EDA $2.7BComp Platforms Masks Front-End Manufacturing $24B Embedded SW $0.8B • Process Auto $1B • Lithography $6B • Etch/Doping $6B • Diffusion $1B • Deposition $5B • Other (CMP, Ion, Photoresist, etc.) $5B IP $0.9B Semiconductors $119B • Micros, DSP $45B • Memory $25B • ASIC, ASSP $25B • Analog, Discrete $25B Wafer $4B Back-End Manufacturing $6B • Bonding $1B • Packaging $2B • Test equipment $3B Chips Dragon Star Shot Course Market size for 2001 Sources: Thomas Weisel Dataquest, ICI, Synopsys Estimates

  23. Data 16GB 64GB 256GB 1024GB Exploding Mask Costs Year 1999 2002 2004 2007 • Raster scan patterning exposure time for a 110mm x 110 mm mask is 6.5 hrs and 20 hrs with fine granularities (60nm vs. 120nm pixel size) • Largest cost contribution to mask making is mask exposure time (capital cost ~$20M) • RET is being absorbed by CAD vendors into layout verification / tape-out suites. • RET may move up into routing, placement Node .18µm .13µm .9µm .065µm Cost $200-400K $500K-1M $800K-1.2M $1-2M Dragon Star Shot Course Source: Thomas Weisel Partners

  24. Front-End Processing Masks $2.8B EDA $3.6B Systems $1050B Mask Data • Manufacturing $2.3B • Tools $0.5B Design • Computers • Communications • Consumer • Industrial, Military… EDA $2.7BComp Platforms Masks Front-End Manufacturing $24B Embedded SW $0.8B • Process Auto $1B • Lithography $6B • Etch/Doping $6B • Diffusion $1B • Deposition $5B • Other (CMP, Ion, Photoresist, etc.) $5B IP $0.9B Semiconductors $119B • Micros, DSP $45B • Memory $25B • ASIC, ASSP $25B • Analog, Discrete $25B Wafer $4B Back-End Manufacturing $6B • Bonding $1B • Packaging $2B • Test equipment $3B Chips Market size for 2001 Sources: Thomas Weisel Dataquest, ICI, Synopsys Estimates Dragon Star Shot Course

  25. Interconnect • Exploding number of metal layers, mask cost • Large number of vias diminishes yield • Increasingly complex process rules • Via • Stack • Multiple • Array • Metal • Min, max, spacing, width • Antenna • Signal EM • Number of vias for a given load, frequency • Include pattern density & shape management in layout, extraction • Limit vias / multiple vias Dragon Star Shot Course

  26. x 10-7 2.3 2.2 LineWidth [nm] 2.1 2.0 1.9 1.8 150 60 100 40 50 20 Wafer Y 0 0 Wafer Y CD Variation Across a Wafer Wafer Map for No-DPC Horizontal Isolated Structures Incorporate analysis of timing variation into extraction & static timing analysis Dragon Star Shot Course Source: Spanos, UCB

  27. Insert redundant vias • Space / Width Physical design for Yield / Reliability • Aggressive via minimization in routing • Limit Current Density Dragon Star Shot Course

  28. Back-End: Assembly and Packaging Masks $2.8B EDA $3.6B Systems $1050B Mask Data • Manufacturing $2.3B • Tools $0.5B Design • Computers • Communications • Consumer • Industrial, Military… EDA $2.7BComp Platforms Masks Front-End Manufacturing $24B Embedded SW $0.8B • Process Auto $1B • Lithography $6B • Etch/Doping $6B • Diffusion $1B • Deposition $5B • Other (CMP, Ion, Photoresist, etc.) $5B IP $0.9B Semiconductors $119B • Micros, DSP $45B • Memory $25B • ASIC, ASSP $25B • Analog, Discrete $25B Wafer $4B Back-End Manufacturing $6B • Bonding $1B • Packaging $2B • Test equipment $3B Chips Market size for 2001 Sources: Thomas Weisel Dataquest, ICI, Synopsys Estimates Dragon Star Shot Course

  29. Assembly and Packaging • The chip is assembled into a package that provides the contact leads for the chip. A wire-bonding machine attaches wires to the leads of the package; or this is achieved using flip chip die attach. • Modern packages can be very complex • The package is the bridge between silicon and system • Differentiator: Performance, form factor, fit, thermal conduction, reliability, and cost Dragon Star Shot Course

  30. IC / Package Co-Design for Flip Chip Lid Chip Package Pwr, Gnd Signal Solder balls Board • Design • Package feasibility • Bump patterning, assignment • P/G assignment • Driver placement • Routing • Analyis • Extraction RLC • Simulation Spice Dragon Star Shot Course

  31. SoC Packaging • Trends by 2005 • Cost: 0.29¢ to 2.28¢ / pin • Pins / package: 120 – 3000 • Performance: 600 MHz – 2GHz • Integrating complete (sub)systems on a chip is often driven by packaging • Less I/O, power, area, & cost • Higher on-chip speed, reliability • Complex packages and Multi-chip modules that require routing and analysis, driven by mixed-signal, RF, memory integration Dragon Star Shot Course

  32. Back-End: Testing and Automatic Test Equipment Masks $2.8B EDA $3.6B Systems $1050B Mask Data • Manufacturing $2.3B • Tools $0.5B Design • Computers • Communications • Consumer • Industrial, Military… EDA $2.7BComp Platforms Masks Front-End Manufacturing $24B Embedded SW $0.8B • Process Auto $1B • Lithography $6B • Etch/Doping $6B • Diffusion $1B • Deposition $5B • Other (CMP, Ion, Photoresist, etc.) $5B IP $0.9B Semiconductors $119B • Micros, DSP $45B • Memory $25B • ASIC, ASSP $25B • Analog, Discrete $25B Wafer $4B Back-End Manufacturing $6B • Bonding $1B • Packaging $2B • Test equipment $3B Chips Market size for 2001 Sources: Thomas Weisel Dataquest, ICI, Synopsys Estimates Dragon Star Shot Course

  33. Key Trends • By 2005 • Cost: $2-5k/pin ( high performance) • Pins / package: 1900 • Performance: up to 2 GHZ • Tester timing accuracy growing at 12% per year • ASIC speeds growing at 30% per year • IDDQ becoming less meaningful • For every 80mV of VT decrease Ioff increases 10x!! • Higher leakage currents make IDDQ values increase dramatically as transistor density increases • More mixed-signal testing Dragon Star Shot Course

  34. Agenda • Dealing with technology • Masks • Front-end manufacturing • Back-end manufacturing • Application requirements • Putting it all together Dragon Star Shot Course

  35. Application Requirements Masks $2.8B EDA $3.6B Systems $1050B Mask Data • Manufacturing $2.3B • Tools $0.5B Design • Computers • Communications • Consumer • Industrial, Military… EDA $2.7BComp Platforms Masks Front-End Manufacturing $24B Embedded SW $0.8B • Process Auto $1B • Lithography $6B • Etch/Doping $6B • Diffusion $1B • Deposition $5B • Other (CMP, Ion, Photoresist, etc.) $5B IP $0.9B Semiconductors $119B • Micros, DSP $45B • Memory $25B • ASIC, ASSP $25B • Analog, Discrete $25B Wafer $4B Back-End Manufacturing $6B • Bonding $1B • Packaging $2B • Test equipment $3B Chips Market size for 2001 Sources: Thomas Weisel Dataquest, ICI, Synopsys Estimates Dragon Star Shot Course

  36. Analog RF Power MEMs IP Digital Control µP DSP Interfaces Memory SRAM DRAM FLASH Heterogeneity - SoC Dragon Star Shot Course

  37. What EDA Must Provide… • System level design • Soc design&test, verification methodology • Need hierarchy in the design flow • Analog, digital, RF, MEMs • IP for soc construction / verification: processors, memory, peripherals, etc. • Soc design for debug (debug busses and controllers) Dragon Star Shot Course

  38. ASIC, ASSP, ASIP, GA, FPGA • ASIC & ASSP differ only by how they are sold and used, not by how they are designed • Early market characteristics  ASICs • Late market characteristics  ASSPs • Trend toward application-specific instruction processors • Many processors on a chip • Metal Programmability (GA) gaining attention again • SW Programmable (FPGA), reconfigurable parts gaining importance • Embedded FPGA / GA Dragon Star Shot Course

  39. Power 1400 Dynamicpower density 1200 1000 800 mW/mm2 600 Leakage power density 400 200 0 0.18 µm 0.13 µm 0.10 µm 0.05 µm Dragon Star Shot Course

  40. Solutions for Low Power Design • Power modeling and analysis • Clock gating and clock tree optimization • Variable Vdd • Power gating • Multi - Vdd • Dynamic voltage scaling • Leakage optimization using multi-Vt • Modelling process variation • Support Asynchronous design Dragon Star Shot Course

  41. Dual Vt 130nm 180nm Leakage power [0.0-240.0] nW Leakage power [0.0-1.0] nW Cell number [0-519] Cell number [0-467] typical version Dragon Star Shot Course From Ali Dasdan

  42. V D V = IR R dd V - D V I dd R V ss Speed • Determined by interconnect • The primary physical effect of concern is cross-coupled capacitance plus the Miller effect. This may cause: • functional errors in analog circuitry or dynamic logic • timing errors in static digital circuitry • IR Drop (static leakage and dynamic IR drop) handled in power • Other important effects & features are Inductance, CD variation, EM Dragon Star Shot Course

  43. Agenda • Dealing with technology • Masks • Front-end manufacturing • Back-end manufacturing • Application requirements • Putting it all together Dragon Star Shot Course

  44. Putting it All Together: EDA Masks $2.8B EDA $3.6B Systems $1050B Mask Data • Manufacturing $2.3B • Tools $0.5B Design • Computers • Communications • Consumer • Industrial, Military… EDA $2.7BComp Platforms Masks Front-End Manufacturing $24B Embedded SW $0.8B • Process Auto $1B • Lithography $6B • Etch/Doping $6B • Diffusion $1B • Deposition $5B • Other (CMP, Ion, Photoresist, etc.) $5B IP $0.9B Semiconductors $119B • Micros, DSP $45B • Memory $25B • ASIC, ASSP $25B • Analog, Discrete $25B Wafer $4B Back-End Manufacturing $6B • Bonding $1B • Packaging $2B • Test equipment $3B Chips Market size for 2001 Sources: Thomas Weisel Dataquest, ICI, Synopsys Estimates Dragon Star Shot Course

  45. Synthesis Physical Power Test IP SoC Design Design Services Architecture Design Design Planning Verification IP Languages Assertions and Testbenches Design Database Timing and Signal Integrity Physical Implementation Smart Verification Extraction Physical Verification Mixed Signal / Analog Mask Synthesis / OPC Dragon Star Shot Course

  46. Implementation Nodes Dragon Star Shot Course

  47. Implementation Nodes Dragon Star Shot Course

  48. ArchitectureDesign Languages Assertions and Testbenches SmartVerification Verification IP Mixed Signal /Analog Functional Verification • Driven by complexity • Verification models (IP) • Avenues of development • Higher levels • Performance • Integration • New (formal) technologies • Emulation competes with • Prototyping (enabled by multi-million gate FPGAs) • Compute farms (Linux) Dragon Star Shot Course

  49. ArchitectureDesign Languages Assertions and Testbenches SmartVerification Verification IP Mixed Signal /Analog Functional Verification 2003 • Standard based IP, Star IP on AMBA • (System) Verilog for HW • SystemC for system level design (SW) • Languages for testbenches, assertions being standardized • Integrated simulation • (System)Verilog/VHDL • Fast Spice/Spice • Testbenches • Language • Assertions (monitor) • Constraint solver • Formal verification • Equivalence checking • Semi-Formal property checking Dragon Star Shot Course

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