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Ceramic Focal Plane Components For SNAP B. C. Bigelow, UM Physics 4/13/05

Ceramic Focal Plane Components For SNAP B. C. Bigelow, UM Physics 4/13/05. Ceramic Detector Packages. AlN detector package material already demonstrated Ground and space heritage well established Cryo epoxies known, package assembly procedures established

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Ceramic Focal Plane Components For SNAP B. C. Bigelow, UM Physics 4/13/05

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  1. Ceramic Focal Plane Components For SNAPB. C. Bigelow, UM Physics4/13/05

  2. Ceramic Detector Packages • AlN detector package material already demonstrated • Ground and space heritage well established • Cryo epoxies known, package assembly procedures established • See Oluseyi, Bercovitz, et. al. (LBNL) • Package assembly to set height, flatness to ~ +/- 5 microns • See Miyazaki, et al, PASJ • AlN CTE close match to Si, SiC, Invar • Natural match to Si CCD sensor material • Near-match to HgCdTe Si MUX material • Can be machined, polished, epoxy-inserted, etc. • AlN -> near match for SiC • SiC package material base-lined for GAIA mission • More later! Bruce C. Bigelow -- UM Physics

  3. CTE for Focal Plane Materials • CTE plot courtesy of Pat Jelinsky: Bruce C. Bigelow -- UM Physics

  4. Subaru Suprime Camera • On Subaru 8.2m telescope, Mauna Kea, Hi • See Miyazaki, et al • 5 x 2 mosaic of LL-MIT 2K x 4k CCDs - 83 Megapixels • AlN CCD packages • AlN cold-plate • Assembled mosaic is flat to approx. +/- 5 microns • Threaded studs epoxied into AlN packages • Flat interface between packages and cold-plate Bruce C. Bigelow -- UM Physics

  5. Subaru Suprime Camera Miyazaki, et al Bruce C. Bigelow -- UM Physics

  6. Subaru Suprime Camera AlN cold-plate 120mm x 150mm mosaic Bruce C. Bigelow -- UM Physics

  7. Subaru Suprime Camera AlN package and “buffer block” Stud is epoxied into AlN buffer block Bruce C. Bigelow -- UM Physics

  8. Subaru Suprime Camera AlN buffer block and spacer shims in assembly jig Bruce C. Bigelow -- UM Physics

  9. Subaru Suprime Camera AlN CCD package epoxied to buffer block Bruce C. Bigelow -- UM Physics

  10. GAIA mission SiC focal plane • Boostec SiC material: • Sintered fabrication process • Less than 3% porosity • Pure, alpha phase SiC, no free silicon • Boostek SiC Moly • Density: 3100 kg/m^3 10,200 kg/m^3 • Young’s modulus: 420 GPa 330 GPa • Flexural strength: 450 Mpa 415 Mpa • CTE (room temp): 4.0 PPM/C 5.35 PPM/C • Thermal conductivity: 180 W/m·k 138 W/m·k Bruce C. Bigelow -- UM Physics

  11. GAIA mission SiC cold-plate Boostec/Astrium GAIA focal plane demonstrator model: Sintered SiC, 770mm by 580mm by 36mm, 8kg. Bruce C. Bigelow -- UM Physics

  12. GAIA mission SiC cold-plate GAIA cold-plate - detector mounting detail. Note finished bores on mounting holes Bruce C. Bigelow -- UM Physics

  13. Ceramic CCD Packages for SNAP • CCD package features: • All dimensions and mounting features per ICD 00065-AC14A (HDH) • Hypertonics KA series connectors per ICD • All vented hardware – but not always shown! • AlN PCB interfaces between detectors and connectors • Integral filter/aperture assemblies • AlN or SiC package and mount material (interchangeable) Bruce C. Bigelow -- UM Physics

  14. Ceramic CCD package Invar inserts with internal threads for M3 mounting screws Bruce C. Bigelow -- UM Physics

  15. Ceramic CCD package Round insert, diamond insert, undersized insert provide kinematic constraint of in-plane DOF – X, Y, and rot Z. Ground pads define tip, tilt, and piston of package Bruce C. Bigelow -- UM Physics

  16. Ceramic CCD assembly AlN or SiC mount AlN or SiC CCD package epoxy Ribbon cable Invar insert, epoxied in PCB Invar insert, epoxied in Hypertronics KA series, 72 pins Bruce C. Bigelow -- UM Physics

  17. Ceramic CCD package CTE-matching filter frame, with filter and aperture mask Bruce C. Bigelow -- UM Physics

  18. Ceramic MCT Packages • MCT package features: • All dimensions and mounting features per ICD 00065-AC14A (HDH) • Hypertonics KA series connectors per ICD • All vented hardware – but not always shown! • AlN PCB interfaces between detectors and connectors • Integral filter/aperture assemblies • AlN or SiC package and mount material (interchangeable) Bruce C. Bigelow -- UM Physics

  19. Ceramic MCT package Near-copy of CCD PCB, but wraps around for wire-bonding to sensor MUX on top surface AlN/SiC PCB isolates detector package from connector thermal stresses Bruce C. Bigelow -- UM Physics

  20. Ceramic MCT package Bruce C. Bigelow -- UM Physics

  21. Ceramic MCT package Filter frame clearance for wire-bonds Bruce C. Bigelow -- UM Physics

  22. Ceramic MCT package Bruce C. Bigelow -- UM Physics

  23. SNAP ¼ CCD+MCT mosaic CCD MCT Bruce C. Bigelow -- UM Physics

  24. SNAP ¼ CCD+MCT mosaic Section showing mounting interface details Bruce C. Bigelow -- UM Physics

  25. SNAP ¼ CCD+MCT mosaic Section showing mounting interface details Bruce C. Bigelow -- UM Physics

  26. SNAP ¼ CCD+MCT mosaic Back side of FP mosaic showing mounting screws and access to connector Bruce C. Bigelow -- UM Physics

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