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TTM Co., Ltd. Company Introduction

TOTAL. THERMAL SOLUTION. PROVIDER. MTRAN-Memory. MTRAN-PCB. MTRAN-Basic. TTM Co., Ltd. Company Introduction. Company Introduction Product Overview Overall Summary. MISSION & VISION. MISSION. STATEMENT. We will be the leader of technology development in the field of electronic &

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TTM Co., Ltd. Company Introduction

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  1. TOTAL THERMAL SOLUTION PROVIDER MTRAN-Memory MTRAN-PCB MTRAN-Basic TTM Co., Ltd. Company Introduction Company Introduction Product Overview Overall Summary

  2. MISSION & VISION MISSION STATEMENT We will be the leader of technology development in the field of electronic & telecommunication by providing innovative and competitive Thermal Solution.

  3. CORPORATE IDENTITY TOTAL THERMAL SOLUTION PROVIDER TTM was founded in November 2003 with our mission statement; We will be the leader of technology development in the field of electronic & telecommunication by providing innovative and competitive Thermal Solution. We are the first total cooling solution provider and we develop and manufacture optimized cooling solution for customers with complicated heat flow problems. With high technologies and heat flow management experiences, we pioneer a new field of cutting-edge engineering service for heat flow area. We put our best effort to develop future-generation cooling kit using Nano & MEMS technologies.

  4. CORPORATE OVERVIEW General Overview Organization Structure R&D 34% Manufacture 31% Administration 21% Sales&Marketing 14% Human Resources 20 Forces (2006.11)

  5. CORPORATE HISTORY Investment from Venture Capital Conclude a MOU with LG Micron Headquarter move out to Metropolitan Area (Anyang City) Selected as Display Thermal Solution Research Company by Korean Government Selected as Small Enterprise Technical Innovation Company by Korean Government Conclude a Basic Purchase Contract with Samsung Corporation. Acquired ISO9001/ISO14001 Acquired Korean New Technology Mark (KT Mark) Authenticated Venture Company with Innovative Technology by Korean Government Selected as The Center of Excellence by UGS Selected as New Technical Incubation Company by Korean Government Foundation of TTM Co., Ltd. Research & Development Center Conclude Technology Transfer Agreement Contract with ETRI (Electronics &Telecommunications Research Institute) TTM Co., Ltd. Foundation 2006 year 2005 year 2004 year 2003 year

  6. INTELLECTUAL PROPERTY RIGHTS Patents Non-exclusive Patents Rights Patents on New Device Liquid Cooler for Microprocessor (10-2004-0012462) Heat Pipe using Carbon Nano Tube (10-2004-0017842) Nanofluid with Carbon Black (10-2005-0015555) Thermal Grease with Carbon Nano Particle (10-2005-0044712) Printed Circuit Board for LED Package with Cooling System (10-2005-0072538) Flat-type Heat Pipe Enclosure Equipment and Manufacturing Procedure (10-2005-086991) Multi-side Structure Sectioned Micro Heat Pipe using Extrusion/Drawing Process (ETRI Technology Transfer) Multi-side Structure Sectioned Micro Heat Pipe & Manufacturing Procedure (ETRI Technology Transfer) Cooling System furnished with Wick using Photo Etching Process (ETRI Technology Transfer) Liquid Cooler Using Nanofluid (0352690) Water Jacket Using Foam Metal (0352695) Heat Pipe with Foam Metal (0360090) Heat Pipe with Foam Metal (0361445) Heatsink with Flat Plate Heat Pipe (0361492) Cooling System Structure for LCD with LED BLU (0384912) PCB for LED Package with Cooling Section (0022957) Heat Dissipating Structure of PCB with Heat Dissipation Device Package (0400909) LED BLU Unit furnished with Heat Dissipating Body (0399741) Heat Dissipating Structure of LCD (0401354) Ram Module furnished with Heat Dissipating Body (0031567)

  7. CUSTOMER SATISFACTION “Approach Customers with Innovative Mind” We make all of our effort to provide better quality for our customers by developing novel technologies. Customers’ satisfaction is guaranteed with KT Mark (Korea Good Technology Mark), ISO9001/14001 authentication, and our innovative mind with providing flexible terms of payment and competitive price. All of these are derived from our commitment, “Approach Customers with Innovative Mind.” Throughout continuous quality innovation, improvement and research, we will make full customer satisfaction into a reality.

  8. MTRAN® Feature MEMS Technology Applied Working Fluid : Acetone, Nanofluid Thermal Performance : 11W ~ 77W for TMT-1630A200A Ultra-Slim Flat-Type HEATPIPE (Thickness:1.0 ~ 2.5T) Lightweight, Great Uniformity Customizable Product Sizes for Various Spec. Application Application for Flat-Type Display Cooling Module ex> LCD-TV, PDP, LED BLU Ultra-Slim Electronics/Telecommunication Devices ex> Post PC, PDA, etc High Heat Radiating Memories sized over 1Gb MTRAN-CPU Cooler , VGA Cooler Research in Progress Specification

  9. MTRAN® Characteristic

  10. Panel LED MTRAN® - PCB Feature MEMS Technology Applied Working Fluid : Acetone, Nanofluid Thermal Performance : 11W ~ 77W Ultra-Slim Flat Type HEATPIPE (Thickness:1.0 ~ 2.5T) Lighter Weight than MCPCB Customizable Sizes Application Application for Display Cooling Module using LED Source Application for Cooling Module for Lighting System using LED Application for Electronics/Telecommunication Devices and other devices need cooling through PCB Specification

  11. MTRAN® - MM (Memory Module) Feature MEMS Technology Applied Working Fluid : Acetone Thermal Performance : 5W ~ 12W Ultra-Slim Flat Type HEATPIPE (Thickness:1.0 ~ 2.5T) Excellent Heat Spreader Customizable Sizes Application Cooling module for FBDIMM and other RAM devices Spot cooling for FBDIMM’s AMB Specification

  12. NANOTIM® – THERMAL GREASE (TGS Series) Feature Nano Power Material Application mediates device’s small surface imperfections and raises thermal conductivity Great oxidization stability on high temperature Patent Pending for lowering the rate of base oil vaporization. Products Ready to Ship – 2 heat radiation type, 1 conductor type Application Thermal conductive material between Heatsink and CPU Used as filler between electronic parts (diode) and heat radiating unit Specification

  13. NANOTIM® – PCM (Phase Change Material) Application Feature High thermal conductivity Low thermal resistance Phase change temperature of 45 ℃ Electrical stability & high reliability Meets international environmental requirements Competitive price Memory module Micro processor unit Graphic processor unit Chipsets Specification

  14. CDM – THERMAL & FLOW CONSULTING Feature Overall heat flow analysis consult Suggest cooling solution methodical thesis appropriate for characteristics of variable systems Process Example SFT Module / LED BLU System / Home Sever / DVR System / 1U Server System Burn Wet Scrubber System / 300mm Dryer

  15. CDM – CUSTOMIZED DESIGN MODULE Feature Customized design module by distinguished heat flow analysis consult Suggest cooling solution methodical thesis appropriate for characteristics of various systems Process 1.5 U Sever Cooling System / Network Processor Cooling Module Car PC Cooling Module / Power PC Cooling Module / IGBT Cooling Module Example

  16. TOTAL THERMAL SOLUTION PROVIDER

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