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Boom Electronics Board (BEB)

Boom Electronics Board (BEB). Jane Hoberman University of California - Berkeley. BEB Review Outline. Overall BEB design goals - Changes since PDR - Reviews Sub circuit design, performance requirements and verification: - Floater Driver

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Boom Electronics Board (BEB)

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  1. Boom Electronics Board (BEB) Jane Hoberman University of California - Berkeley

  2. BEB Review Outline Overall BEB design goals - Changes since PDR - Reviews Sub circuit design, performance requirements and verification: - Floater Driver - Bias, Usher and Guard Driver - EFW/ Emfisis Buffer - Ground Diagram How well does the BEB meet it Specification? - Power - Mass - Specification Table - Parts (including Stress Analysis) Status

  3. EFW BLOCK DIAGRAM

  4. BEB Design Drivers - The Bias Drivers will provide current biasing of sensors. - The Usher and Guard Drivers will provide voltage biasing of photoelectron control surfaces. - The Floating Ground Driver will provide the reference source for each preamp ground, with a range of +/- 215 V with respect to SC ground. - The BEB will provide “Bias”, “Guard”, & “Usher” programmable DC offset potentials with readback. - The BEB will provide an AC test signal source to preamps. - The EMFISIS buffer will deliver buffered, low-noise, analog, difference E-field signals to EMFISIS-WAVES from 10 Hz to 400 kHz.

  5. New RBSP BEB Design Elements BEB is based on CRRES, POLAR, and most recently, THEMIS heritage. Changes from Themis BEB Design (no significant design changes since PDR): +/-225 V output stage increased from +/-100 V, in order to increase Floating Ground and BIAS driver range. - New High Voltage Transistors and Capacitors - Increase in biasing range, thus rail-to-rail op amp required - Layout for 480 V between some parts and traces Floating Voltage increased to +/-15V from +/-10V - change in some bypass capacitors DAC commanding, and AC Test generation in DCB. EMFISIS circuit added - extra power and space requirements - additional noise and frequency response requirement Contingency operation without IDPU interface. Removed from BEB: Actel, braid circuit, RTD

  6. BEB REVIEWS PCB Layout Review 6/30/09 New PCB layout instituted the previously listed changes plus those below. PCB layout and schematic was reviewed . All concerns addressed. Peer design review 9/2/09. No issues. Circuits additions since PDR: Additional filtering for to reduce 200kHz line. Insure no over voltage operation of floaters.

  7. BEB BLOCK DIAGRAM

  8. BEB Floating Ground Driver Performance Requirements Frequency Response: LP: 3 dB roll off at 300 Hz. Output Dynamic Range: ± 215 Vdc wrt. SC GND. Output: references Preamp floating power supply (±15Vdc wrt. FGND). Opposing booms matched to 0.1% accuracy, DC to .5Hz. Output level shall track Vsphere to at least .1% , from DC to.5Hz, 0V to 215V

  9. BEB BIAS DRIVERSchematic almost identical to Guard, Usher driver Performance Requirements Frequency Response: LP: 3 dB roll off at 300 Hz. Dynamic Range: ± 175 ± 40 (Vref) Vdc wrt. AGND, where full-scale DAC → Vref = ± 40 Vdc). Opposing booms matched to 0.1% accuracy, DC to .5Hz (BIAS). Gain of 1 with .1% tolerance. (Track Vsphere better than .1% from DC to .5Hz). Noise Level: < 48 uVrms 10 to 10KHz; < 35 uVrms 10K to 400KHz AC distortion < -40dB THD with +/-50VDC +/-100 Vp-p AC DAC Resolution:1 nA DAC Accuracy (BIAS): opposing booms matched to 0.1% DAC step response: <25 ms

  10. BEB BIAS AC DISTORTION Vsphere = 26Vpp AC

  11. BEB Bias, Usher, Guard Frequency Response

  12. EWF to EMFISIS Buffer

  13. BEB GROUNDING

  14. BEB Power Table * The maximum current of the +10V and -10V supplies are interdependent. The maximum current is dependent on the DAC setting. ** The maximum current of the +225V and -225V supplies are interdependent. The maximum current is dependent on the V sphere input.

  15. BEB ETU 1 BEB ETU Mass: 455 grams

  16. BEB Performance Compliance

  17. BEB Performance Compliance (con’t)

  18. BEB EMFISIS Performance Compliance *Includes room noise and EMFISIS instrument **Not expected to be significantly different from Spin Plane test

  19. BEB Parts and Quality assurance Compliance Stress Calculations done on all parts. Spread sheet available.

  20. BEB Summary of Documentation Status

  21. BEB: Test and Build Status Finishing testing of ETU 2 - Complete verification of layout - AC , and AC +DC distortion test - Noise testing 2.Continue Functional Test of BEB with IDPU and Booms - Axial Boom - with 6 preamps - noise characterization 3. EMFISIS Testing - Axial plane test 4. Complete AD822 screening 5. Thermal testing for calibration purposes 6. Update ETU test plan for Flight

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