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Overview

EE-595 Capstone Design Project. Overview. Capstone Design Project. DESCRIPTION Course Description: Capstone Design Project . 4 Credits U/G. Lecture/Laboratory.

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Overview

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  1. EE-595 Capstone Design Project Overview

  2. Capstone Design Project DESCRIPTION Course Description: Capstone Design Project . 4 Credits U/G. Lecture/Laboratory. Team based design using real-world industrial constraints of an electronic based product including requirements capture, detailed design, prototyping, verification, safety, manufacturing, reliability, and sustainability. Major deliverables; Oral presentation Project Report Prototype The term Capstone is used to describe the “finishing” aspect of this course, just as a capstone or keystone is the finishing stone in an archway support

  3. Capstone Design Project • PREREQUISITES • Senior Standing • ElecEng 335(P) or 332(P) • ElecEng 367(P) Prerequisites by Topic ·Design of basic linear and non-linear analog circuits including amplifiers, filters, oscillators, comparators, timers, pulse generators, and detectors ·Design of basic linear power conversion circuits including basic transformer voltage conversion, passive ripple filtration and linear regulation ·Design of basic digital logic circuits including multi-input/output combinatorial circuits and multi-input/output sequential state circuits ·Design of basic microprocessor based circuits including interface of memory and I/O devices ·Basic time domain and frequency domain simulation analysis utilizing Pspice ·Prototyping (bread boarding) of simple analog and digital circuits ·Verification of circuit functionality utilizing standard test equipment including DMM, DSO, logic analyzer, waveform generator, and frequency counter

  4. Capstone Design Project 12 LEARNING OUTCOMES 1.Students will gain familiarity working in an industry engineering team environment including requirement formulation and flowdown, project planning, constraints, interface specification, and prototype integration 2.Students will learn introductory project management estimating their team resources, project tasks and generating a basic project plan 3.Students will gain experience in preparing and giving technical multi-contributor presentations including integration of their contribution to the team project 4.Students will gain experience in authoring a multi-contributor technical report including documenting and integrating their design contribution 5.Students will gain ability to design and analyze analog and digital circuits for mass production using worst case performance including error voltages, bandwidth, interface compatibility and timing validations as specified in commercial environments 6.Students will be able to assimilate industry device data sheets, find relevant parameters for typical versus worst case operation over an operating environment 7.Students will learn to perform basic cost modeling of designs and perform component package-manufacturing cost and process tradeoffs 8.Students will understand the basics of surface mount and thru hole electronic assembly processes and industry standard electronic assembly quality standards 9.Students will understand the basic elements of a multilayer printed wiring board and ECAD design 10. Students will learn introductory reliability modeling, estimation and stress testing strategies 11. Students will learn about basic product safety and regulatory standards including electromagnetic compliance, testing labs, US government agencies and global standards bodies 12. Students will learn about ramifications of designing products for a global market including commercial power and environmental differences

  5. Capstone Design Project 318-595 Requirements Management Teamwork & Presentation Capstone Project Planning & Communication Prototyping & Testing Electrical Eng Design & Sim Critical Success Factors

  6. Capstone Design Project TOPICS COVERED ·Basic Business Organization, Annual Cycles, Financial Flow, Costs and Contribution Margins ·Business Cases for Product Development Justification ·Product Development Processes, Life Cycles, Requirements, Verification and Validation ·Requirement Allocation, Association and Flowdown ·Safety Standards, Testing Labs and Regulatory Bodies ·Electromagnetic Compliance and Global Power Standards ·Review of Statistics and 6 Sigma Quality ·Reliability distributions, predictions methods, growth strategies and product warranties ·Task Estimating, Project Planning and Management ·Prototyping Methods ·Basic Thru Hold and Surface Mount Electronic Component Packaging ·Printed Circuit Fabrication, Surface Mount and Thru Hole Electronic Assembly Processes ·Printed Circuit Board Testing Strategies, IPC Electronic Assembly Quality Standards ·Analog Circuit Design for Mass Production, Worst Case Analysis and Component Data Sheets ·Mixed Signal Circuits, Analog to Digital Conversion Architectures and Component Data Sheets ·Digital Circuit Design for Mass Production, Families, I/O Structures, and Worst Case Analysis ·Sequential Logic Timing Analysis, Bus Cycles, Meta-stability, PLD Architectures ·Obsolescence, Life Cycles and Sustainability of Electronic Designs ·Technical Reports, Presentations and Communication

  7. Capstone Design Project EE-595 Staff LC 401, THURS 7:00-9:00PM, E225 Jeffrey A. Kautzer Senior Lecturer Office: EMS-E222 Phone: 229-5189 Hrs: Tues 7:00-8:00 PM, Thurs 9:00-10:00 PM Email: kautzer@uwm.edu • gGE Healthcare • _________________________________________ • Jeffrey A. Kautzer • Manager, CT Detector Engineering • 3000 Grandview Blvd, W1180, Waukesha, WI 53188 • Email: jeffrey.kautzer@med.ge.com • ~20 Years Industry Electronic Design • RF, CPU, Mixed Signal, Motion Control • EMC, Micro-electronic Assembly, Compliance • 5 Years Chief Engineer, Electrical Design • Senior Member IEEE, 20 Filed Patents • Senior Lecturer in Dept of EE 25 years

  8. Capstone Design Project LAB ASSISTANTS SEC-801, WED 6:30-10:00PM, E203 SEC-802 TUE 6:30-10:00PM, E203 Mr. Chris Merkl Mr. Kalu Bhattarai Office: EMS-W210 Office: EMS-W209, E1042 Phone: 229-5174 Phone: 229-6139, 5889 Hrs: TBD Hrs: Mon/Tue 4:30-5:30PM W209, E203 Email: cjmerkl@uwm.edu Email: kalu@uwm.edu

  9. Capstone Design Project 318-595 • 1. Electronics Project Management & Design by Stadtmiller, 2nd Edition, Prentice Hall, ISBN 0-13-111136-1 (Earlier 1st Edition pictured may also be used) • 5. 318-355 Electronic Design Laboratory - Handbook of Design by Kautzer, ISBN 0-900-00701-B (on line) Main Texts

  10. Capstone Design Project 318-595 • 2.Electronics by Hambley, 2nd Edition, Prentice Hall, ISBN 0-13-691982-0 • 3. Schematic Capture With Cadence Pspice by Marc E. Herniter, 2nd Edition, Prentice Hall Inc, ISBN 0-13-048400-8 (Earlier Edition may also be used) Supporting Texts (from 318-335)

  11. Capstone Design Project 318-595 • 4. Strategies for Engineering Communications by Stevenson, 1st Edition, Wiley, ISBN 0-471-12817-1 Secondary Text

  12. Capstone Design Project 318-595 • Printed Circuit Assembly Design by Marks and Caterina, 1st Edition McGraw Hill, ISBN 0-07-014107-7 Reference Text

  13. Capstone Design Project Web Info 595 WEBSITE http://www.uwm.edu/course//318-595 The website is password protected. Login name = ee595, Password = xxxxxx. On-Line Component & Project Information http://ee.cleversoul.com/ http://www.datasheetlocator.com/ http://cmpmedia.globalspec.com/

  14. Capstone Design Project E203 “McPherson” Lab ·Agilent 54622D/54641D Dual Analog CH, 16 Dig CH, 100/350 Mhz DSO w/2 probes (in cabinet) Backup Scopes: ·Tektronix TDS350, 1 GSPS dual trace DSO w/2 probes (all probes are locked in cabinet) ·Hitachi, V-660, 60 Mhz dual trace analog oscilloscope with NTSC TV-V and TV-H triggering ·NEW!! Fluke 179 Portable DMM, V: 100uV–1Kv, Cap:1000pF -10,000uF, Freq: 2hz-50 KHz, Temp: 40-400oC Backup DMM: ·Tenma 74-4020 including capacitance meter and frequency counter ·Heathkit Triple DC power supply (may not be on bench due to space constraints) ·Elenco Dual Variable Regulated DC power supply, XP-650 (2 at each bench) ·Hewlett Packard HP33120A Waveform, AM, and FM Generator ·120 VAC power with 20 AMP circuit breaker protection on corner panel ·4 conductor wire distribution to Blue, Grey, Red and Black terminals via 30 AMP circuit breaker protection All Analog Scope and DSO probes, BNC-BNC cables, BNC-Clip cables, Banana Jack Wires, and Aligator Clips are kept locked in metal cabinet and must be supplied by the TA.

  15. Weekly Lab Assignments Entirely Devoted to Project • Lab Assignments are due at End of Lab • Lab 1, 4, 6 are Presentations • 2 Exams (in LEC) • TUESDAY DEC 12 Faculty Presentation • THURSDAY DEC 14 Project Reports Due

  16. 318-595 Grade Composition Final Grading Scale ═════════════════════════════════════════════════════════ 94.0 - 100.0 ..... A 78.0 - 83.99 ..... C 93.0 - 93.99 ..... A - 77.0 - 77.99 ..... C - 92.0 - 92.99 ..... B + 76.0 - 76.99 ..... D + 86.0 - 91.99 ..... B 70.0 - 75.99 ..... D 85.0 - 85.99 ..... B - 00.0 - 69.99 ..... F 84.0 - 84.99 ..... C + Final Grade 0-100 Pts Exams 25% Project Labs 20% Design Project 50% Lab Performance 5%

  17. Capstone Design Project Design Project Grade MSWord Report Score 35% Peer Evaluations 15% Design Project Grade Faculty Team Evaluation 10% Prototype Demo 15% Faculty Individual Evaluation 15% Lab Assistant Evals 10% Individual ComponentsTeam Components

  18. Faculty Evaluation Criteria for Oral Presentations Capstone Design Project Rate the presentation on a scale of 1 (= Poor) to 5 (= Excellent) 1 Identification and formulation of the problem 1 2 3 4 5 2 Level of analysis of the problem and the solution(s) 1 2 3 4 5 3 Application of knowledge of math and science 1 2 3 4 5 4 Application of engineering knowledge 1 2 3 4 5 5 Use of tools and techniques appropriate for modern engineering analysis 1 2 3 4 5 6 Consideration of economic aspects 1 2 3 4 5 7 Consideration of societal aspects (e.g. accessibility, cultural, gender issues) 1 2 3 4 5 8 Consideration of environmental, and health and safety issues 1 2 3 4 5 Project Faculty Eval Criteria

  19. Faculty Evaluation Criteria for Oral Presentations 9 Consideration of ethical, political and legal issues 1 2 3 4 5 Capstone Design Project 10 Consideration of manufacturability and sustainability 1 2 3 4 5 11 Appropriateness of the scope and level of the project for a capstone experience 1 2 3 4 5 12 Quality of visual aids (slides, transparencies, models) 1 2 3 4 5 13 Use of audience-appropriate content, detail, style and vocabulary 1 2 3 4 5 14 Use of charts, graphs and figures in the presentation 1 2 3 4 5 15 Language usage (grammar, spelling) 1 2 3 4 5 Project Faculty Eval Criteria Non Technical Areas

  20. Faculty Evaluation Criteria for Oral Presentations 16 Clarity and volume of speech 1 2 3 4 5 Capstone Design Project 17 Technical credibility of material and effectiveness of responses to questions and comments 1 2 3 4 5 18 Presenter’s contribution level versus team member peers and overall project tasks 1 2 3 4 5 19 Presenter’s professionalism including appearance, organization and manner 1 2 3 4 5 20 Presenter’s eye contact and ability to address the audience 1 2 3 4 5 Project Faculty Eval Criteria Presentation Skill Areas

  21. Capstone Design Project Project Team Logistics • Project Teams must be comprised of students from same lab section • Project Teams must be comprised of 4-6 students • Project Team members are asked to communicate outside of normal class times • Project Teams should plan on meeting at least 1/week outside of normal lecture/lab and office hour times • Project Team members will assess their teammates at semester end anonymously as part of the project grade

  22. Capstone Design Project Safety • Safety Glasses Must be Worn When ……. • Soldering, Drilling, Sawing, Sanding, Gluing and Filing • Using of heat gun or other heat sources for tubing shrinkage or other assembly • When trimming leads of wires particularly on soldered connections • When using any type of power tools AC Power in E203 Standard Grounded Outlets on 20AMP Breakers, Caution: NO GFCI’s Food/Drink Lab bench areas are used for soldering lead based alloys Keep food/drink away from of lab bench areas. ESD Lab bench areas are equipped with ESD grounding pads

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