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Flexible Hybrid Electronic Systems

Flexible Hybrid Electronic Systems. Ananth Dodabalapur. The University of Texas at Austin. 3 Dec., 2008. Panelists. Ana Arias Manager, PARC, Palo Alto, CA Tobin Marks Prof. of Chemistry and Materials, Northwestern Univ. Dan Frisbie Prof. of Chemical Engineering, U of Minn.

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Flexible Hybrid Electronic Systems

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  1. Flexible Hybrid Electronic Systems Ananth Dodabalapur The University of Texas at Austin 3 Dec., 2008

  2. Panelists • Ana Arias • Manager, PARC, Palo Alto, CA • Tobin Marks • Prof. of Chemistry and Materials, Northwestern Univ. • Dan Frisbie • Prof. of Chemical Engineering, U of Minn. • Ananth Dodabalapur • Prof. of ECE, The Univ. of Texas at Austin

  3. Additional Panelists • George Malliaras (Cornell) • Shelby Nelson (Kodak) • Others

  4. Some key highlights/areas in the field of hybrid flexible electronics • Electronic paper • Plastic Logic, Polymer vision, E-Ink • Printed RFID Tags • Poly IC, Philips, Nano---, Weyerhaeuser • Printed electronics for displays • Philips, Merck (Covion), CDT,… • Printed Bioelectronics • Nanoindent, Accreo,

  5. Case I Electronic Paper • Original Proposal (with organic transistor backplanes) • 1996 (Bell Labs) • First demonstration • 2000/2001(Lucent/E-Ink) • Commercial prototypes • Mid 2000

  6. Case II - OFET based RFID • First proposal (organic FET based RFID • 1995 (Philips) • Working prototypes • 2005 to 2008 • Commercial production • Beyond 2010

  7. Hybrid Flexible System Design • Communication • Wireless, wired • Circuit design • Semiconductor technology • Lumped silicon • Thin film semiconductors • Materials • Insulators, conductors • Other components and devices • Sensors, Actuators, display elements, etc.. • Fabrication • Roll-to-roll (RTR) or other

  8. Thin-Film Semiconductors • Organic and Polymer • Easiest to print • Proven compatibility with R2R • Mobilities limited to near 1 cm2/V-s* • Carbon Nanotube films • Can possess higher mobilities (near 80 cm2/V-s) for L = 100 micron devices (Rogers et al., Nature 2008) • Issues of metallic nanotubes • Separation of semiconducting nanotubes yielded 0.5-0.6 cm2/V-s. (Bao et al, Science 2008) • Inorganic Semiconductors/Nanowires • High mobilities with Indium oxide (Marks et al., Nature Materials 2006)

  9. Fabrication methods for Flexible Electronics • Ink-jet printing • Gravure • Flexo • Screen Printing • Nano-imprinting • Laser-based approaches • Photolithography for R2R

  10. Technical Themes for the Study • Circuit and system design • Device physics • Inorganic and organic semiconductor materials for transistors • Dielectrics and conductors • Functional devices and materials (for sensors etc) • Fabrication processes

  11. Tasks

  12. Timetable • Dec. 08 Kickoff meeting (All panelists meet with sponsors and WTEC staff at NSF) • Mar. 09 Baseline workshop at NSF (optional--this surveys US research in the field) • May. 09 Site visits in Europe • Possible week identified… • June 09 Site Visits in Asia (Optional) • Jul. 09 Final Workshop at NSF • Aug 09 Draft Final Report goal

  13. Proposed Visit Locations • England • Cambridge Univ • CDT • Plastic Logic • Imperial College • Netherlands • Holst Inst., Paul Blom Group • Philips, Eindhoven • Polymer Vision, Eindhoven • Germany • Dresden – OLED Company • Dresden – Plastic Logic • Poly IC • Nano Ident • Max Planck, Mainz • Fraunhofer Inst.

  14. Proposed Visit Locations (cont’d) • Italy • CNR Bolognia • Annalisa Bonfiglio(?), Sardinia • Austria • Linz, Sariciftci group • TU Graz, Guenther Leising • Belgium • IMEC (Heremans) • Sweden • Linkoping (Inganas) • Norkoping (Berggren)

  15. Possible Additional Visits - Ananth (No airfare needed) • China • Beijing conference (June 2009). International Conference on Optical Probes in conjugated polymers. Will try and visit 1-2 labs. • Singapore • IMRE, A*Star (several visits) • S Korea • Samsung Adv. Inst of Technology (Jan 2009) • LG Chemical (Possibly Jan 2009) • Samsung main place(?) • Japan • U of Tokyo (T Someya) • Mitsubishi Chemical Group • SONY (????) • Yamagata (Kido)?

  16. Report Outline • Introduction: Duane • Materials 1 : Tobin • Devices and hybrid integration: Ananth + New panelist (Shelby Nelson?) • Fabrication methods : Dan • Circuits and applications : Ana • Bioelectronics George Malliaras(?) • Travel report: several

  17. Planning Schedule • Monday afternoon 2 Feb (Arizona meet) • June 29, 30 Workshop • Conf call 8 Jan 2 PM EST

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