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A Moisture Resistant Air Cavity Plastic Microwave Power Package Capable of Eutectic Die Attach

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A Moisture Resistant Air Cavity Plastic Microwave Power Package Capable of Eutectic Die Attach

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    1. A Moisture Resistant Air Cavity Plastic Microwave Power Package Capable of Eutectic Die Attach

    2. RJR Polymers Inc. Headquartered in Oakland, CA Worldwide sales and engineering force Manufacturer of injection molded plastic packages, pre-applied adhesives and equipment

    3. R-Pak Air Cavity Packages Plastic backed for low power package applications like sensors CCD / CMOS for vision and optical sensor applications with glass covers Thermally enhanced metal backed for microwave and power applications

    5. RJRs Injection Molded Packages Package Stackup Thermal Base (Cu, WCu, CuMoCu, AlSiC, etc) Sidewall with leads Lids with epoxy (pre-applied) RJR formulated epoxy as interstitial layers Plastic alloy formulated to match the CTE of Copper or Copper alloys (WCu, CuMo, etc.) Leads are coated with moisture resistant polymer, then injection molded The 3 layers are bonded together using RJR IsoThermal Sealing (ITS) equipment

    6. 1) Package Base

    7. Thermally-Enhanced Package Exploded View

    8. Moisture Resistance IPC/JEDEC J-STD-202B Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices intended to classify nonhermetic solid state SMDs by moisture sensitivity to ensure that proper handling precautions are applied Applies to plastic SMDs with cavity or without cavity Basic issue is vapor pressure change of water during solder reflow cycle causing damage Delamination, cracking, leaks, popcorning Low moisture sensitivity comes from choice of materials, design of package and good processes

    9. Hermeticity JEDEC standard JES D22-A109-A defines test procedures Derivative of MIL-STD-883, Method 1013 Historic military definition of hermetic means sealed to a specified helium leak rate Assumes cavity package Excludes organic seals or materials

    10. Nonhermetic and Near Hermetic Rationale that organics are non-hermetic based on diffusion rates of water through organic materials Metal, ceramic and glass are considered hermetic New organic materials challenge that definition Near Hermetic is a common term without a clear definition Moisture getters further confound the issue

    11. Package Elements to Consider

    13. RJR Plastic Alloy HTP-1280 R-Pak? Plastic Body Compound This custom thermoplastic compound is used in RJR R-Pak? plastic body package technology. The following properties are typical for the bulk material molded into standard test configurations defined by the applicable test method. These property values are intended for general engineering purposes and are not intended for establishing product specifications. Physical: Density: 1.67 gm/cc ASTM D792 Water Absorption 0.02% ASTM D570 Mechanical @ 23C: Tensile Strength 21,000 PSI ASTM D638 Tensile Modulus 2.5 X 106 PSI ASTM D638 Elongation @ Break 1.2% ASTM D638 Flexural Strength 31,000 PSI ASTM D790 Flexural Modulus 2.4 X 106 PSI ASTM D790 IZOD Impact Strength Notched 1.6 ftlb/in ASTM D256 Thermal: Melting Point 280?C (536?F) ASTM D3418 DTUL @ 1.8 Mpa (264 PSI) 270?C (518?F) ASTM D648 Electrical: Volume Resistivity 1012 ohm-cm ASTM D257 Surface Resistivity 1017 ohm IEC 93 Dielectric Strength 766 V/mil ASTM D149 Dielectric Constant 3.8 @ 1 kHz ASTM D150 3.7 @ 100 kHz 3.7 @ 10 MHz Dissipation Factor 0.007 @ 100 kHz ASTM D150 0.003 @ 10 MHz ASTM D150 Arc Resistance 165 Sec. ASTM D495 Comparative Tracking Index 175 volts ASTM D3638 Chemical Resistance: Not affected by: Water, Acetone, MEK, Methyl celusolve, Hexanes, (Sulfuric Acid, Nitric Acid, and HCl) as used in electroplating baths.

    14. Epoxy Sealing Materials Common properties Minimal moisture transmission Low ionics Very low volatiles (outgassing) Cure in minutes for efficient assembly Lead primer formulation Adherent to LCP and lead finish Viscosity supports efficient lead coating process Sealing epoxy Uniform cover and sidewall coating Easily B-staged

    15. Process Design Appropriate sidewall thickness Molding process Tool design and process control Epoxy application Complete 4 sided primer application Consistent application to sidewall and cover Package assembly process Isothermal Packaging System (ITS) Lead forming Tool design critical to maintaining package integrity

    16. Sealing Equipment - ITS (Isothermal Packaging System) Semiautomatic Custom Designed and Built Plates Controls: Time Pressure Temperature UPH: 600 - 700* 99% + Yield

    17. Isothermal Packaging System Lid is held up during temperature ramp up At temperature, lid is released onto package Piston applies pressure to lid preventing pinholes and blowouts

    18. Thermally Enhanced R-Pak Moisture resistant and near hermetic Capable of eutectic die attach High thermal dissipation capability High frequency capability parts in service at 5.8 GHz Can pass JEDEC Level I Moisture Pre-Conditioning Pass Mil-Std 883 Section 1010 Condition C temp cycle

    19. RELIABILITY TESTING

    20. Eutectic Die Attach in an Air Cavity Plastic Package !

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