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Modeling Coupled Fields in Ultrasonic Vibration Processes for Advanced Materials Processing

This study presents a revolutionary ultrasonic consolidation technology that utilizes sound to merge metal layers from featureless foil stock. The process involves coupled mechanical and thermal fields, leading to true metallurgical bonds with full density across various metals. Benefits include low heat generation for electronics embedding, non-destructive fiber embedding, and the ability to create sealed internal geometries and join dissimilar materials. This work features ANSYS models for simulating the thermo-mechanical dynamics of the ultrasonic process, showcasing temperature and plastic strain field distributions over multiple vibration cycles.

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Modeling Coupled Fields in Ultrasonic Vibration Processes for Advanced Materials Processing

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  1. Modeling of Coupled-Fields Problem in Materials Processing with Ultrasonic Vibrations Chunbo (Sam) Zhang, Leijun Li Materials Processing & Testing Laboratory Mechanical & Aerospace Engineering Department Utah State University Supported by NSF Grant DMI-0522908

  2. Introduction • A revolutionary process technology that uses sound to merge layers of metal drawn from featureless foil stock • A complicated process with coupled mechanical and thermal fields under ultrasonic wave. • Produces true metallurgical bonds with full density • Works with a variety of metals

  3. Benefits of UC • Low process heat enables electronics embedding • Non-destructive, fully-encapsulating fiber embedding • Complex internal geometries • Fully enclosed, sealed internal cavity creation and object embedding • Dissimilar material joining • Rapid manufacturing

  4. Schematic and Device of UC • SolidicaTM Form-Action ultrasonic consolidation system purchased by Utah State University Schematic of UC Process

  5. Applications of UC 3-D Complex Geometries Metal-Matrix Composites Real-time Sensing (Non-invasive, Non-destructive) Metal Composite Shields (Dissimilar Metal Joining)

  6. ANSYS Model for UC Simulation 3-D Thermo-Mechanical Coupled Dynamic Model (a) solid model, (b) meshed model

  7. ANSYS Simulation Conditions • Normal pressure: 1800 N • Vibration amplitude: 16 µm • Vibration frequency: 20 KHz • Preheat temperature : 300 oF

  8. Governing Equations in ANSYS for UC Linear Material Behavior Von-Mises Yielding Criteria Plastic Strain equation

  9. Governing Equations in ANSYS for UC Isotropic Hardening Rule Transient Dynamic Equation for a Linear Structure

  10. Governing Equations in ANSYS for UC Conduction and Convection Heat Flow

  11. Simulation Results – Temperature Field Distribution of Temperature at the 700th Vibration Cycle (X-Y Plane, oF)

  12. Simulation Results – Plastic Strain Field Distribution of von-Mises Plastic Strain at the 700th Vibration Cycle (X-Y Plane)

  13. Conclusions • The friction heat flux at contact surface increases initially and decreases in the later period of ultrasonic bonding. • In the plastic region, three concentration areas occur at the contact surface, one in the central and other two at the two extremes of the sonotrode vibration.

  14. WelcomeQuestions and Comments !

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