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Double-Side Module Assembly Enhancements at KEK: Status Update

Learn about the latest developments in improving double-side module assembly at KEK, including revised jigs and challenges faced. Progress on module fabrication and the effectiveness of new assembly processes are discussed. Stay updated on the status of this project.

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Double-Side Module Assembly Enhancements at KEK: Status Update

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  1. KEK (+ UniGe) Status Y. Unno et al.

  2. Double-side modules

  3. Leakage current after SB assembly (*) )later identified due to “no wire” wire-bonding, i.e., wedge hit sensor.

  4. Revised new jig (of KEK) • Vacuum chuck with uniformly spaced vacuum holes, a la “SCT barrel module assembly jig” • Sorry, no photo yet Before assembly (HPK) Before assembly (HPK) After SB assembly After SB assembly Back-side Front-side

  5. Summary • KEK is required to provide 4 double-side modules to the super-module program. • Two are under fabrication, through very slow steps (wire-bonding debugging, assembly jig debugging, …) • Prospect: up to 4 would be completed by mid. Oct. • The revised new jig seems promising against the damage to the sensor in the SB assembly. • Need to watch out, yet.

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