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Schedule

DØ SMT Status Report. Schedule. Ladder and Wedge Production. Axial detectors (3-chip): Ladders being retrofitted due to grounding problem Finishing last few ladders needed 2 o detectors (9-chip): Production paced by HDI availability can restart at >8/week when HDIs received

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Schedule

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  1. DØ SMT Status Report Schedule D0 PMG, May 04, 2000

  2. Ladder and Wedge Production • Axial detectors (3-chip): • Ladders being retrofitted due to grounding problem • Finishing last few ladders needed • 2o detectors (9-chip): • Production paced by HDI availability • can restart at >8/week when HDIs received • Sensor supply not pacing production, original order complete this month • Overall supply of +2 deg. after yield may fall short • 50 additional wafers entered into system for reorder • Fallback for spares: • use sensors with higher bias resistance • 90o detectors (6-chip): • 87(/144) sensors built so far • Paced by Micron delivery, 13 delivered in so far in May • F Wedges (14-chip): • Production in progress, paced by testing • Micron order complete, ~18 spare on shelf • Eurisys order is late. • Waiting for 25 sensors to clear customs • Next batch this month • H Wedges (6-chip): • ~180 half wedges produced to date • Sensor delivery on schedule • Glued 25 full wedges of which ~15 grade A • changed encapsulant to more flexible material to avoid stresses on bonds • Concentrating on full wedge production and disk assembly D0 PMG, May 04, 2000

  3. High Density Interconnect (HDI) • 9-chip hdi’s • All Be pieces needed received. • 37 (34 + 3) hdi’s sent to Promex for stuffing • 10 passed - ladders built • 27 developed surface bubbles: • 23 now repaired and are under test, 4 not recovered • 40 HDIs at now Promex for assembly • 34 flex circuits still needed from Compunetics • pacing 9 chip ladder production • F-wedge HDI’s • All components for HDI’s in hand: Be, jumpers, flex • 23 HDI’s at Fermilab for wedge production • 50 recently stuffed under test • 26 HDI’s at Promex • H-wedge hdi’s • All flex in hand • 60 being laminated • 30 received from Silitronics; 20 at Fermilab D0 PMG, May 04, 2000

  4. Production Status D0 PMG, May 04, 2000

  5. Production Status for first half cylinder • All detectors for 1st 1/2 cylinder produced • not all tested, but OK assuming yields hold up • 4 flavors of 9-chip ladders; current status: “short tails” D0 PMG, May 04, 2000

  6. Barrel / Disk Assembly Barrels • 69/72 ladders installed in first barrel • May have to reground some ladders • Installation of ladders for second barrel started; 6 installed ladder installation radially outward. F Disks • First ring assembled ~5/10/2000 • Oversight on cable placement, need to reinstall some wedges • Behind schedule, but lag can be made up rapidly H Disks • Installed 4 wedges on first ring, pORC needed • CMM programming and use of rotary table understood • Mechanical assembly of first ring in the next few weeks. • Not a schedule issue Assembly • Half cylinder cut • cable cut-outs being made at outside (water jet) shop • Preparing for fit-up of H disk supports in Sci-Fi Note: We haved changed our plans from the original schedule which assumed immediate integration of the 1st barrel/disk module - we will perform readout separately D0 PMG, May 04, 2000

  7. Readout and Cabling Readout • Readout system being prepared for full readout of barrel / disk assembly • Start with 1st F ring (rather than barrel) • Need pORC ~ next week • First test with full assembly and cooling • Channels read out limited by interface card supply, have 4, hope for 15 in June • Supply of cards for 1st half cylinder installation and testing will be insufficient, increase pre-production number? Low Mass Cables • Low mass cables must be installed before move to D0. • Cable production data from Honeywell : • 820 cables started, 166 produced, 360 needed for first 1/2 cylinder (including spares) • delivery expected at 56/week • ~4 week post processing and testing • First half cylinder done ~ end of July • Cables may be pacing item in delivery to D0, watch carefully D0 PMG, May 04, 2000

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