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Plasma Spray Process

Plasma Spray Process. Plasma jet can reach very high temperature > 20,000 K Plasma disassociation effect (ionization) is important to enhance heat transfer Almost applicable to any materials: ceramics, metal, plastics, etc. Splat pattern of a single particle

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Plasma Spray Process

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  1. Plasma Spray Process • Plasma jet can reach very high temperature > 20,000 K • Plasma disassociation effect (ionization) is important to enhance heat transfer • Almost applicable to any materials: ceramics, metal, plastics, etc. • Splat pattern of a single particle • Complete melting of the particle is critical for uniform coating • Residual stress due to uneven thermal expansion is important

  2. Residual Thermal Stress

  3. High Velocity Oxygen Fuel (HOVF) • Very high velocity (>1000 m/s supersonic range) • Existence of diamond shock-cell structure; very noisy • High kinetic energy of the particles is responsible for the bonding (no melting is required).

  4. Chemical Vapor Deposition (CVD) • Combined mass and heat transfers • Surface chemistry is governed by surface temperature & gas flow concentration • Low pressure CVD (LPCVD) • Integrated circuit • Temperature control is critical

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