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TE-MPE-EM Overview

TE-MPE-EM provides CERN-wide support for PCB, flexible circuits, and hybrids production, assembly, and repair. The structure includes design office, manufacturing, and assembly departments. The workload involves planning, subcontracting, and component tracking. Infrastructure includes electronic workshop and repair facilities across multiple locations, with plans for new buildings in 2014.

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TE-MPE-EM Overview

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  1. TE-MPE-EMOverview Betty Magnin

  2. Overview Mandate Structure Workload Infrastructure

  3. Mandate • To provide a CERN-wide support for • the layout • the production • the assembly • in the domain of • printed circuit boards • flexible circuits • hybrids and fine pitch detectors (MPGD)

  4. Structure Design, manufacturing and assembly Design Office Planning and subcontracting Technological and commercial choices Ordering, collecting components, trackingInvoicing 2 staff/ 2 FSU 1 staff / 9 FSU Repair MPGD Fine-pitch photolithography facility - PCB manufacturing Assembly Workshop Industry 4 Staff 8 staff/ 12 FSU

  5. Workload Design office Outsourcing Internalproduction facilities

  6. Infrastructure Today : spread on 3 locations (B1, B301, B102) By January 2014, B107, new building for TE-MPE-EM and TE-VSC

  7. Infrastructure B867 Electronic workshop for the repair of radiated parts Available 2013/Q1

  8. Any question?

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