'Bo cui' diaporamas de présentation

Electron beam lithography (EBL)

Electron beam lithography (EBL). Overview and resolution limit. Electron source (thermionic and field emission). Electron optics (electrostatic and magnetic lens). Aberrations (spherical, chromatic, diffraction, astigmation). EBL systems (raster/vector scan, round/shaped beam)

2.11k views • 63 slides

1.18k views • 50 slides

Introduction and application. Light source and photomask, alignment. Photolithography systems.

Chapter 5 Lithography. Introduction and application. Light source and photomask, alignment. Photolithography systems. Resolution, depth of focus, modulation transfer function. Other lithography issues: none-flat wafer, standing wave... Photoresist.

1.36k views • 38 slides

Chapter 2 Modern CMOS technology

Chapter 2 Modern CMOS technology. Introduction. CMOS process flow (continued). NE 343: Microfabrication and thin film technology Instructor: Bo Cui, ECE, University of Waterloo; http://ece.uwaterloo.ca/~bcui/ Textbook: Silicon VLSI Technology by Plummer, Deal and Griffin. Gate oxide growth.

698 views • 26 slides

Chapter 10 Etching

Chapter 10 Etching. Introduction to etching. Wet chemical etching: isotropic. Anisotropic etching of crystalline Si. Dry etching overview. Plasma etching mechanism. Types of plasma etch system. Dry etching issues. Dry etching method for various films.

3.04k views • 23 slides