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Bond pad - PowerPoint PPT Presentation

CHAPTER 9

CHAPTER 9. Master Figure. Fig. 9.1. Figs. 9.2 a, b, c. (a). (b). (c). Polysilicon bond ring. Getter. Gold. Bond pad. Feedthrough. Figs. 9.3 a, b, c. (a). (b). (c). Figs. 9.4 a, b. (a). (b). Figs. 9.5 a, b. (a). (b). Fig. 9.6. Figs. 9.7 a, b, c. (a). (b). (c).

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491 views • 39 slides

Effects on PC-Board and System Level Effects on Integrated Circuit Level Effects on Device Level

Microwave Interference Effects on Device, Integrated Circuits and PC-Board System. A Presentation on Recent Progress. N. Goldsman, Y. Bai, A. Akturk, T. Chitnis, B. Jacob, J. Baker, A. Iliadis, J. Melngailis 10/10/01. Effects on PC-Board and System Level Effects on Integrated Circuit Level

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255 views • 25 slides

3DIC and I/O redistribution RAL/Uppsala

3DIC and I/O redistribution RAL/Uppsala. Paul Seller Richard Brenner. 3DIC with EMFT. 3DIC with EMFT. A lot of detailed work has been done to prepare TSV cut technology and to prepare masks for AMS process including Oxide/Nitride steps for metal coverage.

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130 nm Module

130 nm Module. With wider ABCn130 . Reduces wire length with same angle by 1.1 mm (6.7 to 5.6 mm). Wider Chip Details. By widening chip by 400 m m and having only two test bond pads per row (in blue) can increase bond pad pitch from 109 m m to 119 m m. Comparisons at Liverpool.

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112 views • 4 slides

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Bond pad - PowerPoint PPT Presentation

CHAPTER 9

Effects on PC-Board and System Level Effects on Integrated Circuit Level Effects on Device Level

3DIC and I/O redistribution RAL/Uppsala

130 nm Module