Bond pads - PowerPoint PPT Presentation

Back-End Bonding

Glue Pitch Adaptors. Robot I&amp;J2500. Back-End Bonding. Glue Beetle Chip to Hybrid. H&amp;K 710 bonder. Robot I&amp;J2500. The I&amp;J2500 has a work area of 510 x 510mm. We mount a turn plate to the work holder that allows us to hold the hybrid for accurate dispensing of the glue. Requirements.

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155 views • 12 slides

RAL / UPPSALA Paul Seller I/O TSVs with T-Micro 3DIC with EMFT Munich

RAL / UPPSALA Paul Seller I/O TSVs with T-Micro 3DIC with EMFT Munich. I/O TSV with T-Micro. No Bond pads!. 4*80 test 4S ASIC. 4S. Hexitec ASIC with TSVs, wire-bonding on back working last year. Thinned to 120um. New ‘4S’ ASIC with small readout region.

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299 views • 7 slides

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