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Back-End Bonding

Glue Pitch Adaptors. Robot I&J2500. Back-End Bonding. Glue Beetle Chip to Hybrid. H&K 710 bonder. Robot I&J2500. The I&J2500 has a work area of 510 x 510mm. We mount a turn plate to the work holder that allows us to hold the hybrid for accurate dispensing of the glue. Requirements.

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Back-End Bonding

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  1. Glue Pitch Adaptors Robot I&J2500 Back-End Bonding Glue Beetle Chip to Hybrid H&K 710 bonder

  2. Robot I&J2500 The I&J2500 has a work area of 510 x 510mm. We mount a turn plate to the work holder that allows us to hold the hybrid for accurate dispensing of the glue. Mike Wormald mpw@liv.ac.uk

  3. Requirements Glue pitch adaptors to LHCB hybrids. • Making sure all the bond pads are supported with glue, as bonding is impossible with bounce under the pads. • Even spread of glue for planarity. (Bonding jigs vacuum this area down) • Ensure no overspill of glue that would hinder the position of the sensors or cover bond pads for the chips • Correct location of the pitch adaptors. Mike Wormald mpw@liv.ac.uk

  4. Process • Dispense Glue • Place pitch adaptors Mike Wormald mpw@liv.ac.uk

  5. Process • Apply Weights • Leave to cure • In oven at 40◦c for 1hour. • Visually inspect. • Remove any excess or fill unsupported areas. • Chips can be mounted at this stage • Place back in oven for further two hours Mike Wormald mpw@liv.ac.uk

  6. Glue chips to Hybrid Requirements • Planarity, 710 bonder only has one touchdown per reference system but chips are bonded on all three faces. • No overspill of conductive glue that may cause shorts on the hybrid • Accurate placement –ease of bonding front end- Mike Wormald mpw@liv.ac.uk

  7. Dispense Glue Mike Wormald mpw@liv.ac.uk

  8. Place Chips Mike Wormald mpw@liv.ac.uk

  9. Accurate Position Mike Wormald mpw@liv.ac.uk

  10. Back End Bonding Mike Wormald mpw@liv.ac.uk

  11. Screen shot of bonds with overlay Mike Wormald mpw@liv.ac.uk

  12. The End Mike Wormald mpw@liv.ac.uk

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