'Chip communication' diaporamas de présentation

Three-Dimensional Microelectronics Integration: Design, Analysis and Characterization

Three-Dimensional Microelectronics Integration: Design, Analysis and Characterization. Zeynep Dilli Ph.D. Program Dissertation Proposal. Introduction & Motivation: 3-D Integration. Current trend in electronics: Tighter integration at every integration level:

671 views • 48 slides

Three-Dimensional Microelectronics Integration: Design, Analysis and Characterization

Three-Dimensional Microelectronics Integration: Design, Analysis and Characterization. Zeynep Dilli Ph.D. Program Dissertation Proposal. Introduction & Motivation: 3-D Integration. Current trend in electronics: Tighter integration at every integration level:

507 views • 48 slides

Three-Dimensional Microelectronics Integration: Design, Analysis and Characterization

Three-Dimensional Microelectronics Integration: Design, Analysis and Characterization. Zeynep Dilli Ph.D. Program Dissertation Proposal. Introduction & Motivation: 3-D Integration. Current trend in electronics: Tighter integration at every integration level:

458 views • 45 slides

Three-Dimensional Microelectronics Integration: Design, Analysis and Characterization

Three-Dimensional Microelectronics Integration: Design, Analysis and Characterization. Zeynep Dilli Ph.D. Program Dissertation Proposal. Introduction & Motivation: 3-D Integration. Current trend in electronics: Tighter integration at every integration level:

452 views • 45 slides

Monolithic Integrated Antennas and Nanoantennas for Wireless Sensors and for Wireless Intrachip and Interchip

Monolithic Integrated Antennas and Nanoantennas for Wireless Sensors and for Wireless Intrachip and Interchip Communication. Peter Russer 1 , Nikolaus Fichtner 1 , Paolo Lugli 1 , Wolfgang Porod 2 and Hristomir Yordanov 1

693 views • 41 slides

Time for High-Confidence Cyber-Physical Systems

Time for High-Confidence Cyber-Physical Systems. Key Collaborators on work shown here: Steven Edwards Jeff Jensen Sungjun Kim Isaac Liu Slobodan Matic Hiren Patel Jan Reinke Sanjit Seshia Mike Zimmer Jia Zou. Edward A. Lee Robert S. Pepper Distinguished Professor UC Berkeley

499 views • 30 slides

SCHEDULING AND TIMING ANALYSIS OF HW/SW ON-CHIP COMMUNICATION IN MP SOC DESIGN

SCHEDULING AND TIMING ANALYSIS OF HW/SW ON-CHIP COMMUNICATION IN MP SOC DESIGN. Contents. Introduction Motivation Communication Scheduling and HW/SW Timing Analysis Experimental Results Conclusion. Introduction. On-chip Communication Architecture in MP SoC design

270 views • 16 slides

Adaptive Single-Chip Multiprocessing

297 views • 15 slides

Fault-tolerant Multicore System on Network-on-Chip

Fault-tolerant Multicore System on Network-on-Chip. Presenter: Parhelia. Motivation (1). Challenge of future SoC: Performance/Technology Gap. Advanced architecture techniques are required!. Before 2002, ILP helped to close the gap successfully. Motivation (2). Trend: More Core, More better.

117 views • 10 slides

Team 1: Algorhythms Software Design Considerations

182 views • 8 slides