'Phonon scattering' diaporamas de présentation

Patrick Hopkins University of Virginia Department of Mechanical and Aerospace Engineering

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Lecture 4 - Spectroscopy

Lecture 4 - Spectroscopy. Analytical Electron Microscopy (AEM), Energy Dispersive Spectroscopy (EDS), Electron Energy Loss Spectroscopy (EELS),, EDS-EELS Spectrum Imaging, Energy Filtered TEM (EFTEM).

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The chemical bonds between atoms are not rigid :

Act like spring Vibration. Phonon Dispersion and Scattering. The 1-D Diatomic Chain. The chemical bonds between atoms are not rigid :. Quanta of lattice vibration are called phonons. Lattice vibrations are responsible for transport of energy in many solids. Spring-mass model.

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On dissipative radiation and Quantum Forces

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Thermal Properties of Materials

Thermal Properties of Materials. Li Shi Department of Mechanical Engineering & Center for Nano and Molecular Science and Technology, Texas Materials Institute The University of Texas at Austin Austin, TX 78712 www.me.utexas.edu/~lishi lishi@mail.utexas.edu. Outline.

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Interface effects on thermophysical properties in nanomaterial systems

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Determining Parameters in the Spicer-Model and Predicted Maximum QE

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IEE5328 Nanodevice Transport Theory and Computational Tools

IEE5328 Nanodevice Transport Theory and Computational Tools. Lecture 1: Introduction. Prof. Ming-Jer Chen Dept. Electronics Engineering National Chiao-Tung University Feb. 20, 2013. Motivation of this Nano Course.

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Measurements and models of thermal transport properties

Measurements and models of thermal transport properties. by Anne Hofmeister. Many thanks to Joy Branlund, Maik Pertermann, Alan Whittington, and Dave Yuen. Thermal conductivity largely governs mantle convection. vs. vs. viscous damping. buoyancy. heat diffusion.

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Measurements and models of thermal transport properties

Measurements and models of thermal transport properties. by Anne Hofmeister. Many thanks to Joy Branlund, Maik Pertermann, Alan Whittington, and Dave Yuen. Thermal conductivity largely governs mantle convection. vs. vs. viscous damping. buoyancy. heat diffusion.

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Submicron Devices Final Examination

Submicron Devices Final Examination. 2004.01.12. Problem 1: Charge Sharing. Page 162, exercise 3.6. x j +?L. W dm. x j +W dm. (b). (a). Problem 2: Scaling. Please prove that the classical field scaling can maintain the constant power density (power/unit area).

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ME 381R Lecture 7: Phonon Scattering & Thermal Conductivity

ME 381R Lecture 7: Phonon Scattering & Thermal Conductivity. Dr. Li Shi Department of Mechanical Engineering The University of Texas at Austin Austin, TX 78712 www.me.utexas.edu/~lishi lishi@mail.utexas.edu. Reading: 1-3-3, 1-6-2 in Tien et al References: Ch5 in Kittel. 1.0. 0.01.

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COMPUTATIONAL PHYSICS

COMPUTATIONAL PHYSICS. Aniket Bhattacharya 1 GS + 1UGS Archana Dubey - Abdelkader Kara 1 UGS Talat Rahman 7 GS + 1 REU + 5.2 PostDocs

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(A)

Full-band Simulations of Band-to-Band Tunneling Diodes Woo-Suhl Cho, Mathieu Luisier and Gerhard Klimeck Purdue University. III-V Band-to-band tunneling (BTBT) diodes. Comparison to drift-diffusion simulations. Solution: accurate modeling of BGN. Comparison to Experimental Data.

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Contact Resistance Modeling in HEMT Devices

Contact Resistance Modeling in HEMT Devices. Virtual Source. E F. 0 nm. E F. 2D sim. domain. E F. E F. In 53 Ga 47 As. Plot Line. M. Salmani-Jelodar, S. H. Park, H.-H. Park, S. Steiger, G. Klimeck Network for Computational Nanotechnology (NCN), Purdue University. In 52 Al 48 As.

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Ultrafast Carrier Dynamics in Graphene

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