'Rc delay' diaporamas de présentation

COPING WITH INTERCONNECT

COPING WITH INTERCONNECT. Impact of Interconnect Parasitics. Nature of Interconnect. INTERCONNECT. Capacitance: The Parallel Plate Model. Typical Wiring Capacitance Values. Fringing Capacitance. Fringing Capacitance: Values. How to counter Clock Skew?. Interwire Capacitance.

885 views • 66 slides

COPING WITH INTERCONNECT

COPING WITH INTERCONNECT. Impact of Interconnect Parasitics. Nature of Interconnect. INTERCONNECT. Capacitance: The Parallel Plate Model. Typical Wiring Capacitance Values. Fringing Capacitance. Fringing Capacitance: Values. How to counter Clock Skew?. Interwire Capacitance.

868 views • 51 slides

COPING WITH INTERCONNECT

COPING WITH INTERCONNECT. Impact of Interconnect Parasitics. Nature of Interconnect. INTERCONNECT. Capacitance: The Parallel Plate Model. Typical Wiring Capacitance Values. Fringing Capacitance. Fringing Capacitance: Values. How to counter Clock Skew?. Interwire Capacitance.

514 views • 51 slides

Parallelization by SimPL ification : A Case Study in VLSI Placement

Parallelization by SimPL ification : A Case Study in VLSI Placement. Myung-Chul Kim, Dong-Jin Lee and Igor L. Markov Dept. of EECS, University of Michigan. Complexities of Parallel Algorithms & SW. Objectives of parallelization A. Improve completion time by using multiple cores in ||

579 views • 47 slides

VLSI Interconnects

1.91k views • 46 slides

Signal Delay

Signal Delay. Time taken to propagate signal to down stream cell. Delay. Interconnect. Cell. Cell. Terminology. Rise time t r : time for a waveform to rise from 10% to 90% Vdd Fall time t f : time for a waveform to fall from 90% to 10% Vdd

497 views • 39 slides

Introduction to CMOS VLSI Design Lecture 6: Wires

Introduction to CMOS VLSI Design Lecture 6: Wires. David Harris Harvey Mudd College Spring 2004. Outline. Introduction Wire Resistance Wire Capacitance Wire RC Delay Crosstalk Wire Engineering Repeaters. Introduction. Chips are mostly made of wires called interconnect

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EE 447 VLSI Design Lecture 5: Wires

EE 447 VLSI Design Lecture 5: Wires. Outline. Introduction Wire Resistance Wire Capacitance Wire RC Delay Crosstalk Wire Engineering Repeaters. Introduction. Chips are mostly made of wires called interconnect In stick diagram, wires set size

660 views • 36 slides

EE466: VLSI Design Lecture 11: Wires

EE466: VLSI Design Lecture 11: Wires. Outline. Introduction Wire Resistance Wire Capacitance Wire RC Delay Crosstalk Wire Engineering Repeaters. Introduction. Chips are mostly made of wires called interconnect In stick diagram, wires set size

385 views • 36 slides

Introduction to CMOS VLSI Design Lecture 14: Wires

Introduction to CMOS VLSI Design Lecture 14: Wires. David Harris Harvey Mudd College Spring 2007. Outline. Introduction Wire Resistance Wire Capacitance Wire RC Delay Crosstalk Wire Engineering Repeaters. Introduction. Chips are mostly made of wires called interconnect

406 views • 36 slides

Lecture 25: Interconnect Modeling

Lecture 25: Interconnect Modeling. EECS 312 Reading: 8.3 (text), 4.3.2, 4.4.1-4.4.4 (2 nd edition). Last Time. Simultaneous switching noise is a key problem for off-chip drivers Drive them as slowly as allowed General interconnect characteristics Local wires and global wires

567 views • 33 slides

Introduction to CMOS VLSI Design Lecture 19: Design for Skew

Introduction to CMOS VLSI Design Lecture 19: Design for Skew. David Harris Harvey Mudd College Spring 2004. Outline. Clock Distribution Clock Skew Skew-Tolerant Static Circuits Traditional Domino Circuits Skew-Tolerant Domino Circuits. Clocking.

657 views • 29 slides

EE4800 CMOS Digital IC Design & Analysis

EE4800 CMOS Digital IC Design & Analysis. Lecture 9 Interconnect Zhuo Feng. Outline. Introduction Wire Resistance Wire Capacitance Wire RC Delay Crosstalk Wire Engineering Repeaters. Introduction. Chips are mostly made of wires called interconnect In stick diagram, wires set size

293 views • 29 slides

Chapter 7

Chapter 7. Programmable ASIC Interconnect. Application-Specific Integrated Circuits Michael John Sebastian Smith Addison Wesley, 1997. Programmable Interconnect.

1.22k views • 14 slides

Debouncing Switches

Debouncing Switches. Mechanical switches are one of the most common interfaces to a uC. Switch inputs are asynchronous to the uC and are not e lectrically clean. Asynchronous inputs can be handled with a synchronizer (2 FF's).

277 views • 13 slides

Debouncing Switches

Debouncing Switches. Mechanical switches are one of the most common interfaces to a uC. Switch inputs are asynchronous to the uC and are not e lectrically clean. Asynchronous inputs can be handled with a synchronizer (2 FF's).

415 views • 13 slides

265 views • 9 slides

Semiconductor computing platform challenges

Semiconductor computing platform challenges. S/W inertia. O/S limitations. reliability. feature set. performance. security. accelerators. power. cost. Reconfigurability. Microprocessors. Mem. Latency/Bandwidth Power Constraints. Intelligent RAM. DSP/ASIP. wire load. fab cost.

136 views • 2 slides