'Scalability references' diaporamas de présentation

Interconnect and Packaging Lecture 2: Scalability

Interconnect and Packaging Lecture 2: Scalability. Chung-Kuan Cheng UC San Diego. Outlines. Trends of Interconnect and Packaging Scalability References. I. Trends of High Performance Interconnect and Packaging. I. Trends. On-Chip Interconnect Delay (5-40 times of Speed of Light 5ps/mm)

457 views • 21 slides