'Thermal vias' diaporamas de présentation

Thermal Via Placement in 3D ICs

Thermal Via Placement in 3D ICs. Brent Goplen, Sachin Sapatnekar Department of Electrical and Computer Engineering University of Minnesota. Overview. Introduction Simplified Example Formulation Results Conclusions. Layer 5. Layer 4. Layer 3. Layer 2. Layer 1. Bulk Substrate.

526 views • 32 slides

ASENT Thermal Analysis Last revised: 8/17/2005

384 views • 22 slides

Thermal Management

Thermal Management. Must do thermal management at the device, the board, and the box levels Device: proper package heat sinking Thermal vias to Cu planes Unobstructed airflow Soldering the device thermal pad to the PCB Board level Heat flow out of the board

419 views • 2 slides

Thermal Simulations

Thermal Simulations. Esju has competence to carry out 3D CFD simulations from system to component level. Examples high variety of BTS cabinets with HEx, filter, double-walls, ... high variety of compact products with TECs, radiation shields, ... PWBs with thermal vias

160 views • 1 slides