'Tsv' diaporamas de présentation

Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs)

Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [CM MATLAB Release Support Document] Date Submitted: [March 13 2007] Source: [Hiroshi Harada, Ryuhei Funada, Hirokazu Sawada, Shuzo Kato ] Company [NICT],

1.12k views • 104 slides

Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs)

Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [CM MATLAB Release 1.1 Support Document] Date Submitted: [Jan. 2007] Source: [Rick Roberts] Company [Intel, Corp], E-Mail:[richard.d.roberts@intel.com]

1.02k views • 102 slides

Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs)

Project: IEEE P802.15 Working Group for Wireless Personal Area Networks (WPANs) Submission Title: [ CM MATLAB Release 1.0 Support Document ] Date Submitted: [ Nov 2007 ] Source: [ Rick Roberts ] Company [ Intel, Corp ], E-Mail:[ richard.d.roberts@intel.com ]

1.02k views • 102 slides

Pre-bond TSV Test Optimization and Stacking Yield Improvement of 3D ICs Bei Zhang Final Exam

Pre-bond TSV Test Optimization and Stacking Yield Improvement of 3D ICs Bei Zhang Final Exam. Thesis Advisor: Dr . Vishwani Agrawal Thesis Committee : Dr. Victor Nelson Dr. Adit Singh External reader: Dr. Xiao Qin. Department of Electrical and Computer Engineering

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3D-TSV ???????????????????????? How to make true 3D-TSV IC application

3D-TSV ???????????????????????? How to make true 3D-TSV IC application. ???? ???? Meisei University Collaborative Research Center Kanji Otsuka. ?????????????????????????????. ???????????????????????????????????????? ???????????????????????????????????????????????????????????????????

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Design Partitioning for 3D IC

Design Partitioning for 3D IC. ? ? ???. Outline. Introduction & problem definition Algorithm BFS-Based Initial Partitioning FM-Based Partition Optimization Experimental results Analysis. ????. Introduction & Problem Definition. ?????? TSV ?? TSV ???? TSV_IO( ????? )

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WP4: Relation with industry

WP4: Relation with industry. Report Second AIDA annual meeting LNF, 10-12 April 2013. Agenda. Academia-Industry matching event Analysis of the 3 AIME events National-level events Plans for 2013-2014 Collaboration Spotting. Previous AIDA Workshop Recap.

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Moving from Timepix3 to Timepix 4 and beyond

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Power and Slew-aware Clock Network Design for Through-Silicon-Via (TSV) based 3D ICs

Power and Slew-aware Clock Network Design for Through-Silicon-Via (TSV) based 3D ICs. Xin Zhao and Sung Kyu Lim School of Electrical and Computer Engineering Georgia Institute of Technology Atlanta, Georgia, U.S.A. Reference the slides of this paper in ASPDAC 2010. Outline.

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Theater Support Vessel

579 views • 37 slides

Stacking Signal TSV for Thermal Dissipation in Global Routing for 3D IC

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Integration of Electrografted Layers for the Metallization of Deep TSVs

Integration of Electrografted Layers for the Metallization of Deep TSVs. Claudio Truzzi, Ph.D. Alchimer. International Wafer-Level Packaging Conference, October 11-14, 2010. Outline. Introduction: The Drivers for TSVs Limitations of Traditional Dry-Process Approaches

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Delay and Power Optimization with TSV-aware 3D Floorplanning

Delay and Power Optimization with TSV-aware 3D Floorplanning. M. A. Ahmed and M. Chrzanowska-Jeske Portland State University, Oregon, USA. ISQED 2014. Outline. Introduction Electrical Characteristics of 3D Interconnect 3D-Interconnect Electrical Performance TSV Aware 3D Floorplanning

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The Way Ahead Theater Support Vessel ACTD & Joint High Speed Vessel Program

The Way Ahead Theater Support Vessel ACTD & Joint High Speed Vessel Program. LTC Philip Schoenig Product Manager Army Watercraft Systems. February 05. Purpose. Provide an update on the ACTD program along with the status and way ahead of the Joint High Speed Vessel Program.

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On Effective and Efficient In-Field TSV Repair for Stacked 3D ICs

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PathFinding Methodology for Interposer and 3D Die Stacking

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PathFinding Methodology for Interposer and 3D Die Stacking

537 views • 14 slides

TSV

TSV. Thru-silicon vias. Ranganathan. Ranganathan. TSV: front and back versions. Arthur Keigler, Kathy O'Donnell, Zhenqiu Liu, and Bill Wu, NEXX Systems, Billerica, Mass.; John Trezza, Cubic Wafer, Austin, Texas -- Semiconductor International, 8/1/2007. Ranganathan. Profile control.

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Market Research on 3D TSV Packages Market 2016 and Analysis to 2026

Currently, 3D Packaging using Through Silicon Via technology (3D TSV) is one of the hottest topics in the semiconductor ecosystem. 3D TSV is vertical electrical connection (via) passing completely through a silicon wafer or die. These short vertical interconnects are replacing the long interconnects of 2D packaging technologies including wire-bond and flip chips.

185 views • 7 slides